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Class Information
Number: 165/80.4
Name: Heat exchange > With retainer for removable article > Electrical component > Liquid cooled
Description: Apparatus in which cooling of the electrical component is effected by liquid coolant.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5829516 |
Liquid cooled heat sink for cooling electronic components |
Nov. 3, 1998 |
| 5826643 |
Method of cooling electronic devices using a tube in plate heat sink |
Oct. 27, 1998 |
| 5815370 |
Fluidic feedback-controlled liquid cooling module |
Sep. 29, 1998 |
| 5810933 |
Wafer cooling device |
Sep. 22, 1998 |
| 5812372 |
Tube in plate heat sink |
Sep. 22, 1998 |
| 5790376 |
Heat dissipating pad structure for an electronic component |
Aug. 4, 1998 |
| 5778968 |
Method for heating or cooling wafers |
Jul. 14, 1998 |
| 5775416 |
Temperature controlled chuck for vacuum processing |
Jul. 7, 1998 |
| 5774334 |
Low thermal resistant, fluid-cooled semiconductor module |
Jun. 30, 1998 |
| 5764482 |
Integrated circuit heat seat |
Jun. 9, 1998 |
| 5761035 |
Circuit board apparatus and method for spray-cooling a circuit board |
Jun. 2, 1998 |
| 5761037 |
Orientation independent evaporator |
Jun. 2, 1998 |
| 5749413 |
Heat exchanger for high power electrical component and package incorporating same |
May. 12, 1998 |
| 5751327 |
Printer including temperature controlled LED recording heads |
May. 12, 1998 |
| 5738165 |
Substrate holding apparatus |
Apr. 14, 1998 |
| 5740015 |
Heat exchanger |
Apr. 14, 1998 |
| 5737186 |
Arrangement of plural micro-cooling devices with electronic components |
Apr. 7, 1998 |
| 5731954 |
Cooling system for computer |
Mar. 24, 1998 |
| 5727618 |
Modular microchannel heat exchanger |
Mar. 17, 1998 |
| RE35721 |
Cooling device of semiconductor chips |
Feb. 3, 1998 |
| 5692558 |
Microchannel cooling using aviation fuels for airborne electronics |
Dec. 2, 1997 |
| 5687575 |
Miniature thermo-electric cooled cryogenic pump |
Nov. 18, 1997 |
| 5688398 |
Device for filtering an electrically insulative and thermally conductive liquid medium and a power electronics unit incorporating a device of this kind |
Nov. 18, 1997 |
| 5685361 |
Motor vehicle with a heat exchanger housing system for cooling automotive accessory components and a heat exchanger housing system for cooling automotive accessory components in a motor vehicl |
Nov. 11, 1997 |
| 5685363 |
Substrate holding device and manufacturing method therefor |
Nov. 11, 1997 |
| 5676198 |
Cooling apparatus for an electronic component |
Oct. 14, 1997 |
| 5676205 |
Quasi-infinite heat source/sink |
Oct. 14, 1997 |
| 5675473 |
Apparatus and method for shielding an electronic module from electromagnetic radiation |
Oct. 7, 1997 |
| 5673750 |
Vacuum processing method and apparatus |
Oct. 7, 1997 |
| 5666269 |
Metal matrix composite power dissipation apparatus |
Sep. 9, 1997 |
| 5660227 |
Heat exchanger for high power electrical component |
Aug. 26, 1997 |
| 5651260 |
Control apparatus and method for actuating an electrically driven compressor used in an air conditioning system of an automotive vehicle |
Jul. 29, 1997 |
| 5647534 |
Device for heating an interior of an electric vehicle |
Jul. 15, 1997 |
| 5636683 |
Heating device for embodying connections by a meltable material |
Jun. 10, 1997 |
| 5636684 |
Cooling element and connector for an electronic power component cooled by a fluid electrically isolated from the component |
Jun. 10, 1997 |
| 5621615 |
Low cost, high thermal performance package for flip chips with low mechanical stress on chip |
Apr. 15, 1997 |
| 5595240 |
Cooling apparatus of electronic devices |
Jan. 21, 1997 |
| 5595241 |
Wafer heating chuck with dual zone backplane heating and segmented clamping member |
Jan. 21, 1997 |
| 5592363 |
Electronic apparatus |
Jan. 7, 1997 |
| 5579826 |
Method for burn-in of high power semiconductor devices |
Dec. 3, 1996 |
| 5572404 |
Heat transfer module incorporating liquid metal squeezed from a compliant body |
Nov. 5, 1996 |
| 5572407 |
Apparatus for interconnecting an integrated circuit device to a multilayer printed wiring board |
Nov. 5, 1996 |
| 5561590 |
Heat transfer sub-assembly incorporating liquid metal surrounded by a seal ring |
Oct. 1, 1996 |
| 5555928 |
Liquid cooled cooling device |
Sep. 17, 1996 |
| 5544696 |
Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer |
Aug. 13, 1996 |
| 5539617 |
Liquid-coolant cooling element |
Jul. 23, 1996 |
| 5537291 |
Cooling device for integrated circuit element |
Jul. 16, 1996 |
| 5529115 |
Integrated circuit cooling device having internal cooling conduit |
Jun. 25, 1996 |
| 5522452 |
Liquid cooling system for LSI packages |
Jun. 4, 1996 |
| 5515910 |
Apparatus for burn-in of high power semiconductor devices |
May. 14, 1996 |
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