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Class Information
Number: 165/80.4
Name: Heat exchange > With retainer for removable article > Electrical component > Liquid cooled
Description: Apparatus in which cooling of the electrical component is effected by liquid coolant.


Patents under this class:

Patent Number Title Of Patent Date Issued
7433190 Liquid cooled electronic chassis having a plurality of phase change material reservoirs Oct. 7, 2008
7431071 Fluid circuit heat transfer device for plural heat sources Oct. 7, 2008
7430119 Impeller and aligned cold plate Sep. 30, 2008
7428152 Localized thermal management system Sep. 23, 2008
7428150 Computing platform component cooling with quick disconnect Sep. 23, 2008
7426112 Heat dissipating module Sep. 16, 2008
7424907 Methods and apparatus for an integrated fan pump cooling module Sep. 16, 2008
7423875 Liquid-cooling heat dissipating device for dissipating heat by a casing Sep. 9, 2008
7423874 Magneto-hydrodynamic heat sink Sep. 9, 2008
7420808 Liquid-based cooling system for cooling a multi-component electronics system Sep. 2, 2008
7420807 Cooling device for electronic apparatus Sep. 2, 2008
7420804 Liquid cooling system including hot-swappable components Sep. 2, 2008
7418996 Integrated liquid cooling system for electronic components Sep. 2, 2008
7417859 Heat radiating assembly for plasma display apparatus and plasma display apparatus including the same Aug. 26, 2008
7417857 Power-electronic-cooling device Aug. 26, 2008
7414846 Cooling structure for interface card Aug. 19, 2008
7414845 Circuit board assembly for a liquid submersion cooled electronic device Aug. 19, 2008
7414844 Liquid cooled heat sink with cold plate retention mechanism Aug. 19, 2008
7414843 Method and apparatus for a layered thermal management arrangement Aug. 19, 2008
7411791 Extendable heat dissipation apparatus Aug. 12, 2008
7408780 Compliant thermal interface structure utilizing spring elements with fins Aug. 5, 2008
7408778 Heat sinks for dissipating a thermal load Aug. 5, 2008
7408776 Conductive heat transport cooling system and method for a multi-component electronics system Aug. 5, 2008
7408775 Electrical module and support therefor with integrated cooling Aug. 5, 2008
7404433 Liquid cooled heat sink Jul. 29, 2008
7403392 Liquid submersion cooling system Jul. 22, 2008
7400505 Hybrid cooling system and method for a multi-component electronics system Jul. 15, 2008
7400504 Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled Jul. 15, 2008
7400503 Systems for low cost coaxial liquid cooling Jul. 15, 2008
7400502 Connector heat transfer unit Jul. 15, 2008
7400500 Low-power compact computer Jul. 15, 2008
7398818 Fluidic pump for heat management Jul. 15, 2008
7397664 Heatspreader for single-device and multi-device modules Jul. 8, 2008
7397662 Electronic card unit and method for removing heat from a heat-generating component on a printed circuit board Jul. 8, 2008
7394655 Absorptive cooling for electronic devices Jul. 1, 2008
7391613 Memory module assembly including a clamp for mounting heat sinks thereon Jun. 24, 2008
7391612 Dual impeller push-pull axial fan sink Jun. 24, 2008
7390427 Hydrofluoroether as a heat-transfer fluid Jun. 24, 2008
7388752 Series-connected heat dissipater coupled by heat pipe Jun. 17, 2008
7388747 Heat plate fixing structure Jun. 17, 2008
7388746 Heatsink assembly Jun. 17, 2008
7385821 Cooling method for ICS Jun. 10, 2008
7385817 Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled Jun. 10, 2008
7385816 Dual impeller push-pull axial fan heat sink Jun. 10, 2008
7385815 Dual impeller push-pull axial fan Jun. 10, 2008
7382616 Cooling system for computer hardware Jun. 3, 2008
7380409 Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing Jun. 3, 2008
7379301 Integrated liquid cooling system May. 27, 2008
7375962 Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus May. 20, 2008
7373967 Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits May. 20, 2008



 
 
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