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Class Information
Number: 165/80.3
Name: Heat exchange > With retainer for removable article > Electrical component > Air cooled, including fins
Description: Apparatus in which heat from the electrical component is removed through structure which includes fins in an environment of stationary or moving air.


Patents under this class:

Patent Number Title Of Patent Date Issued
7619896 Electrical junction box Nov. 17, 2009
7619892 Positioning device for heatsink Nov. 17, 2009
7619890 Heat dissipation module Nov. 17, 2009
7619889 Controllable heat transfer medium system and method for use with a circuit board Nov. 17, 2009
7619888 Flat heat column and heat dissipating apparatus thereof Nov. 17, 2009
7619885 Card fixing structure Nov. 17, 2009
7616445 Structure and method for efficient thermal dissipation in an electronic assembly Nov. 10, 2009
7616444 Gimballed attachment for multiple heat exchangers Nov. 10, 2009
7616442 Power electronic module cooling system and method Nov. 10, 2009
7616441 Graphite heat dissipation apparatus and clamping frame for clamping graphite heat dissipation fin module Nov. 10, 2009
7613005 Mounting device for mounting heat sink onto electronic component Nov. 3, 2009
7613004 Heat sink with heat dissipating fins and method of manufacturing heat sink Nov. 3, 2009
7613001 Heat dissipation device with heat pipe Nov. 3, 2009
7613000 Heat dissipation device and electronic device with the same Nov. 3, 2009
7612992 Cooling device for memory chips Nov. 3, 2009
7612446 Structures to enhance cooling of computer memory modules Nov. 3, 2009
7610950 Heat dissipation device with heat pipes Nov. 3, 2009
7610948 Cooler module Nov. 3, 2009
7610947 Heat-dissipating model Nov. 3, 2009
7609522 Heat sink assembly Oct. 27, 2009
7608315 Insulator with high thermal conductivity and method for producing the same Oct. 27, 2009
7607470 Synthetic jet heat pipe thermal management system Oct. 27, 2009
7606037 Fastener and heat-dissipating device having the fastener Oct. 20, 2009
7606035 Heat sink and memory module using the same Oct. 20, 2009
7606034 Thermally enhanced memory module Oct. 20, 2009
7606028 Heat dissipation device having a fan holder for attachment of a fan Oct. 20, 2009
7606027 Electronic apparatus cooling structure Oct. 20, 2009
7604041 Heat sink clip Oct. 20, 2009
7604040 Integrated liquid cooled heat sink for electronic components Oct. 20, 2009
7600558 Cooler Oct. 13, 2009
7599187 Semiconductor module and heat radiating plate Oct. 6, 2009
7599182 Heat dissipation device Oct. 6, 2009
7597134 Heat dissipation device with a heat pipe Oct. 6, 2009
7597133 Heat dissipation device with heat pipes Oct. 6, 2009
7595993 Mounting structure with heat sink for electronic component and female securing member for same Sep. 29, 2009
7595992 Substrate unit, cooling device, and electronic device Sep. 29, 2009
7595991 Using the wave soldering process to attach motherboard chipset heat sinks Sep. 29, 2009
7593229 Heat exchange enhancement Sep. 22, 2009
7593228 Technique for forming a thermally conductive interface with patterned metal foil Sep. 22, 2009
7592695 Compound heat sink Sep. 22, 2009
7591267 Room temperature heat exchanger for breathing circuit Sep. 22, 2009
7589972 Electrical connector with clip mechanism Sep. 15, 2009
7589970 Assembled structure of power semiconductor device and heat sink Sep. 15, 2009
7589969 Folding protective cover for heat-conductive medium Sep. 15, 2009
7589968 Heat-dissipating electromagnetic shield Sep. 15, 2009
7589967 Heat dissipation device Sep. 15, 2009
7586746 Heat dissipating device with air duct Sep. 8, 2009
7584780 Active heat sink structure with flow augmenting rings and method for removing heat Sep. 8, 2009
7583504 Cooling assembly Sep. 1, 2009
7583503 Thermal module allowing adjustment in the height of heat sink relative to fixing rack Sep. 1, 2009



 
 
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