| |
 |
|
Class Information
Number: 165/185
Name: Heat exchange > Heat transmitter
Description: Elements for receiving heat from one material and conducting it for discharging to another.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619894 |
Heat dissipation device |
Nov. 17, 2009 |
| 7619893 |
Heat spreader for electronic modules |
Nov. 17, 2009 |
| 7619890 |
Heat dissipation module |
Nov. 17, 2009 |
| 7619888 |
Flat heat column and heat dissipating apparatus thereof |
Nov. 17, 2009 |
| 7613005 |
Mounting device for mounting heat sink onto electronic component |
Nov. 3, 2009 |
| 7613004 |
Heat sink with heat dissipating fins and method of manufacturing heat sink |
Nov. 3, 2009 |
| 7610678 |
Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body |
Nov. 3, 2009 |
| 7609521 |
Heat dissipation device with a heat pipe |
Oct. 27, 2009 |
| 7608315 |
Insulator with high thermal conductivity and method for producing the same |
Oct. 27, 2009 |
| 7606036 |
Heat dissipation device |
Oct. 20, 2009 |
| 7606035 |
Heat sink and memory module using the same |
Oct. 20, 2009 |
| 7606031 |
Heat dissipating device |
Oct. 20, 2009 |
| 7606028 |
Heat dissipation device having a fan holder for attachment of a fan |
Oct. 20, 2009 |
| 7606027 |
Electronic apparatus cooling structure |
Oct. 20, 2009 |
| 7599186 |
Heat conduction bus, particularly for a microprocessor-based computation unit |
Oct. 6, 2009 |
| 7595993 |
Mounting structure with heat sink for electronic component and female securing member for same |
Sep. 29, 2009 |
| 7595991 |
Using the wave soldering process to attach motherboard chipset heat sinks |
Sep. 29, 2009 |
| 7595988 |
Thermal management system and method for electronic assemblies |
Sep. 29, 2009 |
| 7593232 |
Electronic apparatus and circuit board unit |
Sep. 22, 2009 |
| 7593228 |
Technique for forming a thermally conductive interface with patterned metal foil |
Sep. 22, 2009 |
| 7592695 |
Compound heat sink |
Sep. 22, 2009 |
| 7589972 |
Electrical connector with clip mechanism |
Sep. 15, 2009 |
| 7589971 |
Reconfigurable heat sink assembly |
Sep. 15, 2009 |
| 7589969 |
Folding protective cover for heat-conductive medium |
Sep. 15, 2009 |
| 7589968 |
Heat-dissipating electromagnetic shield |
Sep. 15, 2009 |
| 7589967 |
Heat dissipation device |
Sep. 15, 2009 |
| 7588549 |
Thermoelectric temperature control for extracorporeal blood circuit |
Sep. 15, 2009 |
| 7588074 |
In the rate of energy transfer across boundaries |
Sep. 15, 2009 |
| 7584780 |
Active heat sink structure with flow augmenting rings and method for removing heat |
Sep. 8, 2009 |
| 7583502 |
Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC) |
Sep. 1, 2009 |
| 7583501 |
Electronic apparatus |
Sep. 1, 2009 |
| 7581583 |
Heat dissipating device with adjusting member |
Sep. 1, 2009 |
| 7580264 |
Power supply and fixing structure of heatsink and circuit board applicable to the same |
Aug. 25, 2009 |
| 7576989 |
Heat sink assembly having supporting clip |
Aug. 18, 2009 |
| 7576987 |
Clip for heat dissipation device |
Aug. 18, 2009 |
| 7570490 |
Variable spring rate thermal management apparatus attachment mechanism |
Aug. 4, 2009 |
| 7567439 |
Heat dissipation device having a rotatable fastener |
Jul. 28, 2009 |
| 7566490 |
Composite material and base plate |
Jul. 28, 2009 |
| 7564689 |
Clip for heat sink |
Jul. 21, 2009 |
| 7564687 |
Heat dissipation device having a fixing base |
Jul. 21, 2009 |
| 7561428 |
Information processing apparatus |
Jul. 14, 2009 |
| 7558067 |
Retaining tool for a heat sink |
Jul. 7, 2009 |
| 7558066 |
System and method for cooling a module |
Jul. 7, 2009 |
| 7558062 |
Heat-dissipating module and electronic apparatus |
Jul. 7, 2009 |
| 7554810 |
Mounting apparatus for securing heat dissipation module to circuit board |
Jun. 30, 2009 |
| 7554809 |
Heatsink assembly structure |
Jun. 30, 2009 |
| 7551446 |
Thermal management device attachment |
Jun. 23, 2009 |
| 7551435 |
Heat-absorbing member, cooling device, and electronic apparatus |
Jun. 23, 2009 |
| 7550097 |
Thermal conductive material utilizing electrically conductive nanoparticles |
Jun. 23, 2009 |
| 7548428 |
Computer device heat dissipation system |
Jun. 16, 2009 |
|
|
|
