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Class Information
Number: 156/89.21
Name: Adhesive bonding and miscellaneous chemical manufacture > Methods > Surface bonding and/or assembly therefor > With vitrification or firing ceramic material > Forming electrical article or component thereof > Elemental metal or alloy containing > Molybdenum containing
Description: Subject matter wherein the metal or alloy contains molybdenum (Mo).

Patents under this class:

Patent Number Title Of Patent Date Issued
8337646 Greensheet via repair/fill tool Dec. 25, 2012
7510619 Greensheet via repair/fill tool Mar. 31, 2009
6733871 Process for producing ceramic member for bonding, ceramic member for bonding, vacuum switch, and vacuum vessel May. 11, 2004
6723192 Process for producing a thin film EL device Apr. 20, 2004
6660116 Capacitive filtered feedthrough array for an implantable medical device Dec. 9, 2003
6627020 Method for sinter distortion control Sep. 30, 2003
6533888 Apparatus and method for fabricating buried and flat metal features Mar. 18, 2003
6506481 Ceramic member for bonding, process for producing the same, vacuum switch, and vacuum vessel Jan. 14, 2003
6316116 Ceramic circuit board and method of manufacturing the same Nov. 13, 2001
6258192 Multi-thickness, multi-layer green sheet processing Jul. 10, 2001
6245185 Method of making a multilayer ceramic product with thin layers Jun. 12, 2001
5897724 Method of producing a hybrid integrated circuit Apr. 27, 1999
5876538 Method for manufacturing a ceramic multilayer substrate for complex electronic circuits Mar. 2, 1999
5853513 Method of producing a stator for a disk drive motor Dec. 29, 1998
5755903 Method of making a multilayer ceramic substrate having reduced stress May. 26, 1998
5653834 Process for making electrical feedthroughs for ceramic circuit board support substrates Aug. 5, 1997
5632942 Method for preparing multilayer ceramic/glass substrates with electromagnetic shielding May. 27, 1997
5633073 Ceramic susceptor with embedded metal electrode and eutectic connection May. 27, 1997
5525280 Method of making a pressure transducer apparatus Jun. 11, 1996
5478420 Process for forming open-centered multilayer ceramic substrates Dec. 26, 1995
5448826 Method of making ceramic microwave electronic package Sep. 12, 1995
5372666 Method of manufacturing a multilayered circuit board Dec. 13, 1994
5290375 Process for manufacturing ceramic multilayer substrate Mar. 1, 1994
5277723 Method for producing multilayer ceramic body with convex side faces Jan. 11, 1994
5277724 Method of minimizing lateral shrinkage in a co-fired, ceramic-on-metal circuit board Jan. 11, 1994
5271150 Method for fabricating a ceramic multi-layer substrate Dec. 21, 1993
5089071 Process for producing a multilayered ceramic structure using an adhesive film Feb. 18, 1992
5063121 Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it Nov. 5, 1991
5061552 Multi-layer ceramic substrate assembly and a process for manufacturing same Oct. 29, 1991
4943470 Ceramic substrate for electrical devices Jul. 24, 1990
4800137 Composite layer aluminum nitride base sintered body Jan. 24, 1989
4762269 Method of joining molded silicon carbide parts Aug. 9, 1988
4678683 Process for cofiring structure comprised of ceramic substrate and refractory metal metallization Jul. 7, 1987
4661181 Method of assembly of at least two components of ceramic material each having at least one flat surface Apr. 28, 1987
4624896 Multi-layer ceramic substrate and method for the production thereof Nov. 25, 1986
4585972 Discharge lamp arc tubes Apr. 29, 1986
4539622 Hybrid integrated circuit device Sep. 3, 1985
4510000 Method for palladium activating molybdenum metallized features on a ceramic substrate Apr. 9, 1985
4356047 Method of making ceramic lid assembly for hermetic sealing of a semiconductor chip Oct. 26, 1982
4340436 Process for flattening glass-ceramic substrates Jul. 20, 1982
4336088 Method of fabricating an improved multi-layer ceramic substrate Jun. 22, 1982
4313262 Molybdenum substrate thick film circuit Feb. 2, 1982
4137628 Method of manufacturing connection-type ceramic packages for integrated circuits Feb. 6, 1979
3948706 Method for metallizing ceramic green sheets Apr. 6, 1976

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