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Class Information
Number: 156/89.19
Name: Adhesive bonding and miscellaneous chemical manufacture > Methods > Surface bonding and/or assembly therefor > With vitrification or firing ceramic material > Forming electrical article or component thereof > Elemental metal or alloy containing > Tungsten containing
Description: Subject matter wherein the metal or alloy contains tungsten (W).

Patents under this class:

Patent Number Title Of Patent Date Issued
6898071 Electrical multilayer component and method for the production thereof May. 24, 2005
6733871 Process for producing ceramic member for bonding, ceramic member for bonding, vacuum switch, and vacuum vessel May. 11, 2004
6723192 Process for producing a thin film EL device Apr. 20, 2004
6660116 Capacitive filtered feedthrough array for an implantable medical device Dec. 9, 2003
6627020 Method for sinter distortion control Sep. 30, 2003
6533888 Apparatus and method for fabricating buried and flat metal features Mar. 18, 2003
6506481 Ceramic member for bonding, process for producing the same, vacuum switch, and vacuum vessel Jan. 14, 2003
6416848 Resistance element and method of production of same Jul. 9, 2002
6316116 Ceramic circuit board and method of manufacturing the same Nov. 13, 2001
6245185 Method of making a multilayer ceramic product with thin layers Jun. 12, 2001
6090237 Apparatus for restraining adhesive overflow in a multilayer substrate assembly during lamination Jul. 18, 2000
5932043 Method for flat firing aluminum nitride/tungsten electronic modules Aug. 3, 1999
5897724 Method of producing a hybrid integrated circuit Apr. 27, 1999
5876538 Method for manufacturing a ceramic multilayer substrate for complex electronic circuits Mar. 2, 1999
5635000 Method for screening using electrostatic adhesion Jun. 3, 1997
5632942 Method for preparing multilayer ceramic/glass substrates with electromagnetic shielding May. 27, 1997
5525280 Method of making a pressure transducer apparatus Jun. 11, 1996
5478420 Process for forming open-centered multilayer ceramic substrates Dec. 26, 1995
5448826 Method of making ceramic microwave electronic package Sep. 12, 1995
5329695 Method of manufacturing a multilayer circuit board Jul. 19, 1994
5277723 Method for producing multilayer ceramic body with convex side faces Jan. 11, 1994
5271150 Method for fabricating a ceramic multi-layer substrate Dec. 21, 1993
5176773 Method of manufacturing a ceramic carrier Jan. 5, 1993
5089071 Process for producing a multilayered ceramic structure using an adhesive film Feb. 18, 1992
5074941 Enhancing bonding at metal-ceramic interfaces Dec. 24, 1991
5063121 Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it Nov. 5, 1991
5061552 Multi-layer ceramic substrate assembly and a process for manufacturing same Oct. 29, 1991
5011725 Substrates with dense metal vias produced as co-sintered and porous back-filled vias Apr. 30, 1991
4943470 Ceramic substrate for electrical devices Jul. 24, 1990
4935289 Gas sensor and method for production thereof Jun. 19, 1990
4889573 Method of forming a pattern of conductor runs on a sheet of dielectric material Dec. 26, 1989
4825539 Process for manufacturing a multilayer substrate May. 2, 1989
4800137 Composite layer aluminum nitride base sintered body Jan. 24, 1989
4786342 Method for producing cast tape finish on a dry-pressed substrate Nov. 22, 1988
4766010 Process for manufacturing dielectric layers formed from ceramic compositions containing inorganic peroxide and electronic devices including said layers Aug. 23, 1988
4762269 Method of joining molded silicon carbide parts Aug. 9, 1988
4678683 Process for cofiring structure comprised of ceramic substrate and refractory metal metallization Jul. 7, 1987
4661181 Method of assembly of at least two components of ceramic material each having at least one flat surface Apr. 28, 1987
4652318 Method of making an electric field device Mar. 24, 1987
4624896 Multi-layer ceramic substrate and method for the production thereof Nov. 25, 1986
4585972 Discharge lamp arc tubes Apr. 29, 1986
4510000 Method for palladium activating molybdenum metallized features on a ceramic substrate Apr. 9, 1985
4137628 Method of manufacturing connection-type ceramic packages for integrated circuits Feb. 6, 1979

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