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Class Information
Number: 156/89.18
Name: Adhesive bonding and miscellaneous chemical manufacture > Methods > Surface bonding and/or assembly therefor > With vitrification or firing ceramic material > Forming electrical article or component thereof > Elemental metal or alloy containing > Copper containing
Description: Subject matter wherein the metal or alloy contains copper (Cu).










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8377240 Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method Feb. 19, 2013
7189297 Method of manufacturing ESD protection component Mar. 13, 2007
7127812 Process for producing a multi-layer printed wiring board Oct. 31, 2006
7122131 Conductive paste for via conductor, ceramic wiring board using the same, and method of manufacturing the same Oct. 17, 2006
7063813 Stacked ceramic body and production method thereof Jun. 20, 2006
7011726 Method of fabricating thin dielectric film and thin film capacitor including the dielectric film Mar. 14, 2006
6972060 Method for producing stacked ceramic body Dec. 6, 2005
6964718 Method of preparing multilayered piezoelectric ceramic material Nov. 15, 2005
6960271 Laminate-type dielectric device, a production method and an electrode paste material Nov. 1, 2005
6861622 Negative temperature coefficient thermistor and method for manufacturing the same Mar. 1, 2005
6855222 Method for manufacturing laminated multilayer electronic components Feb. 15, 2005
6846375 Method of manufacturing multilayer ceramic wiring board and conductive paste for use Jan. 25, 2005
6723192 Process for producing a thin film EL device Apr. 20, 2004
6660116 Capacitive filtered feedthrough array for an implantable medical device Dec. 9, 2003
6627020 Method for sinter distortion control Sep. 30, 2003
6623663 Electroconductive paste and method for manufacturing a multilayer ceramic electronic part using the same Sep. 23, 2003
6610241 Microwave sintering of multilayer dielectrics with base metal electrodes Aug. 26, 2003
6488795 Multilayered ceramic substrate and method of producing the same Dec. 3, 2002
6418616 Full additive process with filled plated through holes Jul. 16, 2002
6335077 Electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same Jan. 1, 2002
6284080 Barrier metallization in ceramic substrate for implantable medical devices Sep. 4, 2001
6270601 Method for producing filled vias in electronic components Aug. 7, 2001
6258192 Multi-thickness, multi-layer green sheet processing Jul. 10, 2001
6248960 Ceramics substrate with electronic circuit and its manufacturing method Jun. 19, 2001
6245185 Method of making a multilayer ceramic product with thin layers Jun. 12, 2001
6241838 Method of producing a multi-layer ceramic substrate Jun. 5, 2001
6228196 Method of producing a multi-layer ceramic substrate May. 8, 2001
6217821 Method of forming distortion-free circuits Apr. 17, 2001
6183669 Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate Feb. 6, 2001
6139666 Method for producing ceramic surfaces with easily removable contact sheets Oct. 31, 2000
6120708 Conductive paste and method for producing ceramic substrate using the same Sep. 19, 2000
6066219 Process for producing a ceramic substrate and a ceramic substrate May. 23, 2000
5985068 Method of manufacturing a monolithic ceramic electronic device Nov. 16, 1999
5985461 Electroconductive paste, and method for producing ceramic substrate using it Nov. 16, 1999
5897724 Method of producing a hybrid integrated circuit Apr. 27, 1999
5891283 Conductive paste composition and method for producing a ceramic substrate Apr. 6, 1999
5840140 Method for making a microceramic optical shutter Nov. 24, 1998
5653834 Process for making electrical feedthroughs for ceramic circuit board support substrates Aug. 5, 1997
5635000 Method for screening using electrostatic adhesion Jun. 3, 1997
5632942 Method for preparing multilayer ceramic/glass substrates with electromagnetic shielding May. 27, 1997
5628919 Methods for producing a chip carrier and terminal electrode for a circuit substrate May. 13, 1997
5614043 Method for fabricating electronic components incorporating ceramic-metal composites Mar. 25, 1997
5581876 Method of adhering green tape to a metal support substrate with a bonding glass Dec. 10, 1996
5557844 Method of preparing a printed circuit board Sep. 24, 1996
5547530 Method of manufacturing a ceramic substrate Aug. 20, 1996
5522976 Target component for cathode sputtering Jun. 4, 1996
5520759 Method for producing ceramic parts May. 28, 1996
5514451 Conductive via fill inks for ceramic multilayer circuit boards on support substrates May. 7, 1996
5507897 Process for the preparation of a target component for cathode sputtering Apr. 16, 1996
5503703 Laser bonding process Apr. 2, 1996

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