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Class Information
Number: 156/89.17
Name: Adhesive bonding and miscellaneous chemical manufacture > Methods > Surface bonding and/or assembly therefor > With vitrification or firing ceramic material > Forming electrical article or component thereof > Elemental metal or alloy containing > Silver containing
Description: Subject matter wherein the metal or alloy contains silver (Ag).










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
7819996 Method of manufacturing ceramic sheet and method of manufacturing gas sensing element Oct. 26, 2010
7655103 Ceramic multilayer substrate and method for manufacturing the same Feb. 2, 2010
7431785 Manufacturing method for monolithic piezoelectric part, and monolithic piezoelectric part Oct. 7, 2008
7243424 Production method for a multilayer ceramic substrate Jul. 17, 2007
7189297 Method of manufacturing ESD protection component Mar. 13, 2007
7186307 Method for manufacturing a ceramic multilayer circuit board Mar. 6, 2007
7185421 Method and apparatus for manufacturing multilayer printed wiring board Mar. 6, 2007
7141129 Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods Nov. 28, 2006
7011725 High performance embedded RF filters Mar. 14, 2006
6855222 Method for manufacturing laminated multilayer electronic components Feb. 15, 2005
6846375 Method of manufacturing multilayer ceramic wiring board and conductive paste for use Jan. 25, 2005
6758927 Method for making monolithic piezoelectric ceramic element Jul. 6, 2004
6749706 Method of manufacturing monolithic piezoelectric ceramic device Jun. 15, 2004
6723192 Process for producing a thin film EL device Apr. 20, 2004
6533888 Apparatus and method for fabricating buried and flat metal features Mar. 18, 2003
6488795 Multilayered ceramic substrate and method of producing the same Dec. 3, 2002
6471805 Method of forming metal contact pads on a metal support substrate Oct. 29, 2002
6444066 Method for manufacturing ceramic electronic device Sep. 3, 2002
6270601 Method for producing filled vias in electronic components Aug. 7, 2001
6241838 Method of producing a multi-layer ceramic substrate Jun. 5, 2001
6228196 Method of producing a multi-layer ceramic substrate May. 8, 2001
6217821 Method of forming distortion-free circuits Apr. 17, 2001
6045747 Method of producing an LC-circuit Apr. 4, 2000
6041496 Method of making ceramic substrate Mar. 28, 2000
5882536 Method and etchant to join ag-clad BSSCO superconducting tape Mar. 16, 1999
5876538 Method for manufacturing a ceramic multilayer substrate for complex electronic circuits Mar. 2, 1999
5840140 Method for making a microceramic optical shutter Nov. 24, 1998
5795422 Method for forming molded ceramic devices having embedded spiral coils Aug. 18, 1998
5766392 Method of manufacturing a multilayer ceramic electronic component Jun. 16, 1998
5759480 Method of firing and sintering a ceramic electronic component Jun. 2, 1998
5683790 Multilayer ceramic parts Nov. 4, 1997
5635000 Method for screening using electrostatic adhesion Jun. 3, 1997
5632942 Method for preparing multilayer ceramic/glass substrates with electromagnetic shielding May. 27, 1997
5628919 Methods for producing a chip carrier and terminal electrode for a circuit substrate May. 13, 1997
5547530 Method of manufacturing a ceramic substrate Aug. 20, 1996
5514451 Conductive via fill inks for ceramic multilayer circuit boards on support substrates May. 7, 1996
5500996 Method for manufacturing a thermistor having a negative temperature coefficient in multi-layer technology Mar. 26, 1996
5478420 Process for forming open-centered multilayer ceramic substrates Dec. 26, 1995
5474741 Method for reducing shrinkage during firing of ceramic bodies Dec. 12, 1995
5456778 Method of fabricating ceramic circuit substrate Oct. 10, 1995
5448826 Method of making ceramic microwave electronic package Sep. 12, 1995
5440802 Method of making wire element ceramic chip fuses Aug. 15, 1995
5423930 Method of providing a sintered ceramic body having a concave portion Jun. 13, 1995
5416277 Cicuit and process of manufacturing the circuit May. 16, 1995
5412865 Method of manufacturing multilayer electronic component May. 9, 1995
5407502 Method for producing a semiconductor device having an improved adhesive structure Apr. 18, 1995
5405466 Method of manufacturing multilayer ceramic electronic component Apr. 11, 1995
5378297 Ferrite chip bead and method for making same Jan. 3, 1995
5370759 Method for producing multilayered ceramic substrate Dec. 6, 1994
5368667 Preparation of devices that include a thin ceramic layer Nov. 29, 1994

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