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Class Information
Number: 156/89.15
Name: Adhesive bonding and miscellaneous chemical manufacture > Methods > Surface bonding and/or assembly therefor > With vitrification or firing ceramic material > Forming electrical article or component thereof > Nitride compound containing
Description: Subject matter wherein the product formed contains a binary compound of nitrogen; e.g., BN, etc.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7269897 Manufacturing process of a stacked semiconductor device Sep. 18, 2007
7185421 Method and apparatus for manufacturing multilayer printed wiring board Mar. 6, 2007
7140085 Process for manufacturing a capacitive vacuum measuring cell Nov. 28, 2006
6949156 Methods for making and using self-constrained low temperature glass-ceramic unfired tape for microelectronics Sep. 27, 2005
6900073 Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates May. 31, 2005
6723192 Process for producing a thin film EL device Apr. 20, 2004
6660116 Capacitive filtered feedthrough array for an implantable medical device Dec. 9, 2003
6627020 Method for sinter distortion control Sep. 30, 2003
6579393 High thermal conductivity lossy dielectric using co-densified multilayer configuration Jun. 17, 2003
6506691 High rate silicon nitride deposition method at low pressures Jan. 14, 2003
6495959 Cermet for lamp and ceramic discharge lamp Dec. 17, 2002
6316116 Ceramic circuit board and method of manufacturing the same Nov. 13, 2001
6245185 Method of making a multilayer ceramic product with thin layers Jun. 12, 2001
5932043 Method for flat firing aluminum nitride/tungsten electronic modules Aug. 3, 1999
5759320 Method of forming cavity substrates using compressive pads Jun. 2, 1998
5688450 Method of making an electronic package structure utilizing aluminum nitride/aluminum composite material Nov. 18, 1997
5683529 Process of producing aluminum nitride multiple-layer circuit board Nov. 4, 1997
5681410 Method of producing a piezoelectric/electrostrictive actuator Oct. 28, 1997
5662755 Method of making multi-layered ceramic substrates Sep. 2, 1997
5656113 Method of manufacturing a multilayered wiring substrate of aluminum nitride having a high dielectric layer Aug. 12, 1997
5593526 Process for preparing a multi-layer wiring board Jan. 14, 1997
5575872 Method for forming a ceramic circuit substrate Nov. 19, 1996
5547530 Method of manufacturing a ceramic substrate Aug. 20, 1996
5534091 Joining method of ceramics and insertion member for heating and joining for use in the method Jul. 9, 1996
5516388 Sol-gel bonding May. 14, 1996
5503703 Laser bonding process Apr. 2, 1996
5489465 Edge seal technology for low dielectric/porous substrate processing Feb. 6, 1996
5470412 Process for producing a circuit substrate Nov. 28, 1995
5439636 Large ceramic articles and method of manufacturing Aug. 8, 1995
5407502 Method for producing a semiconductor device having an improved adhesive structure Apr. 18, 1995
5387474 Green ceramic composite and method for making such composite Feb. 7, 1995
5372666 Method of manufacturing a multilayered circuit board Dec. 13, 1994
5370759 Method for producing multilayered ceramic substrate Dec. 6, 1994
5368673 Joining method for joining electrically ceramic bodies and a joining apparatus and joining agent for use in the joining method Nov. 29, 1994
5302219 Method for obtaining via patterns in ceramic sheets Apr. 12, 1994
5300163 Process for fabricating a multilayer ceramic circuit board Apr. 5, 1994
5296189 Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith Mar. 22, 1994
5285570 Process for fabricating microwave and millimeter wave stripline filters Feb. 15, 1994
5277723 Method for producing multilayer ceramic body with convex side faces Jan. 11, 1994
5254191 Method for reducing shrinkage during firing of ceramic bodies Oct. 19, 1993
5250130 Replica hot pressing technique Oct. 5, 1993
5194298 Method of preparing corrosion resistant composite materials Mar. 16, 1993
5176772 Process for fabricating a multilayer ceramic circuit board Jan. 5, 1993
5147484 Method for producing multi-layer ceramic substrates with oxidation resistant metalization Sep. 15, 1992
5141899 Low dielectric inorganic composition for multilayer ceramic package containing titanium silicate glass and crystal inhibitor Aug. 25, 1992
5102720 Co-fired multilayer ceramic tapes that exhibit constrained sintering Apr. 7, 1992
5087509 Substrate used for fabrication of thick film circuit Feb. 11, 1992
5085720 Method for reducing shrinkage during firing of green ceramic bodies Feb. 4, 1992
5073526 Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite Dec. 17, 1991
5072087 Process for heating materials by microwave energy Dec. 10, 1991

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