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Browse by Category: Main > Tools & Hardware
Class Information
Number: 156/584
Name: Adhesive bonding and miscellaneous chemical manufacture > Delaminating apparatus
Description: Apparatus having means to positively force at least two layers out of bonded relationship one to the other.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6402452 Carrier tape feeder with cover tape parting Jun. 11, 2002
6394165 Self-adhesive element dispenser and applicator device and method thereof May. 28, 2002
6386815 Pick-up apparatus for semiconductor chips May. 14, 2002
6386476 Floor covering removal tool May. 14, 2002
6382292 Method and apparatus for separating composite member using fluid May. 7, 2002
6383329 Apparatus and method for removing a label from a surface with a chilled medium May. 7, 2002
6379098 Chip feeder for chip mounter Apr. 30, 2002
6379489 Carpet reclamation process Apr. 30, 2002
6371401 Apparatus for removing a floor covering Apr. 16, 2002
6358358 Method and apparatus for producing signs with a weeding and laminating system Mar. 19, 2002
6349756 Peel assembly for a printer Feb. 26, 2002
6343981 Vehicle for scraping a floor Feb. 5, 2002
6338771 Method and device for removing lamination Jan. 15, 2002
6336787 Method for transferring wafers in a semiconductor tape-peeling apparatus Jan. 8, 2002
6321817 Electronic component supply device Nov. 27, 2001
6319354 System and method for dicing semiconductor components Nov. 20, 2001
6318437 Tape feeder for component part mounter Nov. 20, 2001
6296035 Apparatus for removing coating from coated product Oct. 2, 2001
6296034 Image-forming material removing apparatus Oct. 2, 2001
6290805 System and method for using a pick and place apparatus Sep. 18, 2001
6277234 Method and apparatus for removing work pieces adhered to a support Aug. 21, 2001
6277711 Semiconductor matrix formation Aug. 21, 2001
6273990 Method and apparatus for removing a protective coating from an optical fiber and inhibiting damage to same Aug. 14, 2001
6269860 Top-cover-tape feeding apparatus and top-cover-tape treating apparatus Aug. 7, 2001
6263941 Nozzle for cleaving substrates Jul. 24, 2001
6261047 Electronic component feeder Jul. 17, 2001
6248201 Apparatus and method for chip processing Jun. 19, 2001
6244323 Method for stripping coatings from optical fibers Jun. 12, 2001
6237665 Apparatus for removing lead characters from cassette May. 29, 2001
6238515 Wafer transfer apparatus May. 29, 2001
6238511 Method and apparatus for processing substrate May. 29, 2001
6235144 Resist removing apparatus and method May. 22, 2001
6234225 Cell electrode with thick tip portion May. 22, 2001
6227276 Apparatus for removing a polarizer of a liquid crystal display May. 8, 2001
6221199 Apparatus and method for removing an adhesive bonded pad Apr. 24, 2001
6210524 Method of improving peel-plate dispensability of label constructions Apr. 3, 2001
6202728 Electric-component feeder Mar. 20, 2001
6203218 Substrate processing apparatus and substrate processing method Mar. 20, 2001
6202913 Electric-component supplying unit Mar. 20, 2001
6199615 Machine for removing wrap-around labels or shrink-wraps from bottles or similar devices Mar. 13, 2001
6199616 Carpet remover Mar. 13, 2001
6196783 Tape feeders and systems using the same Mar. 6, 2001
6193780 Process and apparatus for the recovery of aluminum and energy from used aluminum-plastic packages Feb. 27, 2001
6189591 Wafer sheet expanding apparatus and pellet bonding apparatus using thereof Feb. 20, 2001
6182729 System and method for processing ingots Feb. 6, 2001
6176966 Method of die bonding electronic component and die bonding apparatus thereof Jan. 23, 2001
6173750 Method and apparatus for removing die from a wafer and conveying die to a pickup location Jan. 16, 2001
6171439 Manual stamp dispenser Jan. 9, 2001
6164357 Apparatus for manufacturing adhesive layer, apparatus for manufacturing double-sided substrate, and apparatus for manufacturing multi-layered substrate Dec. 26, 2000
6163951 Method and apparatus for lifting tabs of a laminate from a substrate Dec. 26, 2000

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