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Browse by Category: Main > Tools & Hardware
Class Information
Number: 156/584
Name: Adhesive bonding and miscellaneous chemical manufacture > Delaminating apparatus
Description: Apparatus having means to positively force at least two layers out of bonded relationship one to the other.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Patent Number Title Of Patent Date Issued
7913735 Adhesive tape joining apparatus Mar. 29, 2011
7896047 Semiconductor wafer mount apparatus Mar. 1, 2011
7896053 Non-destructive component separation using infrared radiant energy Mar. 1, 2011
7886798 Expanding method and expanding device Feb. 15, 2011
7875144 Transferring device and transferring method Jan. 25, 2011
7857029 Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods Dec. 28, 2010
7850813 Method for producing a functional member having no base material Dec. 14, 2010
7849905 Stripping device and stripping apparatus Dec. 14, 2010
7849900 Apparatus for joining a separating adhesive tape Dec. 14, 2010
7850249 Floor covering removal machine Dec. 14, 2010
7846288 Methods and systems for removing protective films from microfeature workpieces Dec. 7, 2010
7846289 Sheet peeling apparatus and sheet peeling method Dec. 7, 2010
7828924 Intermediate material for manufacturing circuit board and method for manufacturing circuit board using such intermediate material Nov. 9, 2010
7828926 Selective removal of resin coatings and related methods Nov. 9, 2010
7823619 Film stripping method and apparatus Nov. 2, 2010
7819239 Feeder for an auto mounting device Oct. 26, 2010
7820006 Die pickup apparatus for picking up semiconductor dies and methods for picking up semiconductor dies Oct. 26, 2010
7802359 Electronic assembly manufacturing method Sep. 28, 2010
7802598 Lamination device method for flexographic plate manufacturing Sep. 28, 2010
7798195 Suction unit Sep. 21, 2010
7779885 Label peeling mechanism and label printer Aug. 24, 2010
7771560 Methods to prevent ECC (edge chipping and cracking) damage during die picking process Aug. 10, 2010
7763144 Device and method for the detachment of a tube blank from a support core Jul. 27, 2010
7763145 System for removal of an integrated circuit from a mount material Jul. 27, 2010
7759164 Semiconductor manufacturing method of die pick-up from wafer Jul. 20, 2010
7757742 Vibration-induced die detachment system Jul. 20, 2010
7757740 Film-affixing device Jul. 20, 2010
7757741 Apparatus for attaching a peeling tape Jul. 20, 2010
7753097 Label making apparatus Jul. 13, 2010
7740735 Tools and methods for disuniting semiconductor wafers Jun. 22, 2010
7740728 Film separation method and film separation apparatus Jun. 22, 2010
7736460 Method and system for film removal and sorting of coated resin products Jun. 15, 2010
7736710 Package and method of closing and opening a package Jun. 15, 2010
7730600 Method, system, and apparatus for detaching and collecting an IC tag from a paper sheet to which it is attached Jun. 8, 2010
7717147 Apparatus for refurbishing used cores for rolls of material May. 18, 2010
7713368 Sheet peeling apparatus and peeling method May. 11, 2010
7713376 Method and device for exposing electronic components May. 11, 2010
7686916 Sheet peeling apparatus and peeling method Mar. 30, 2010
7686910 Method and device for the automated application of paint film to bodywork parts Mar. 30, 2010
7681617 Linear multiple feeder for automatic surface-mounting device positioning apparatuses Mar. 23, 2010
7670452 Separation apparatus and method Mar. 2, 2010
7665204 Die detachment apparatus comprising pre-peeling structure Feb. 23, 2010
7654298 Apparatus for removing a flexible floor covering from a floor Feb. 2, 2010
7655109 Floor covering lifting and removal hand tool Feb. 2, 2010
7648888 Apparatus and method for splitting substrates Jan. 19, 2010
7644747 Rectangular substrate dividing apparatus Jan. 12, 2010
7641760 Method of thermal adherend release and apparatus for thermal adherend release Jan. 5, 2010
7638013 Systems for assembling components on submounts and methods therefor Dec. 29, 2009
7632374 Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor Dec. 15, 2009
7631680 Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer Dec. 15, 2009

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