Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Tools & Hardware
Class Information
Number: 156/419
Name: Adhesive bonding and miscellaneous chemical manufacture > Surface bonding means and/or assembly means therefor > Tire body building type > Building drums, per se > Collapsible > Resilient spring actuated
Description: Apparatus in which the means for shifting the relative position of the elements which make up the periphery of the drum include an elastic body which recovers its original shape when released after being distorted.










Patents under this class:

Patent Number Title Of Patent Date Issued
8511359 Layup mandrel having changeable shape and method of using the same Aug. 20, 2013
7578897 Rubber member sticking device Aug. 25, 2009
5618374 Belt and tread drum for vehicle tire making machine Apr. 8, 1997
5490897 Tire former capable of expanding and contracting in an axial direction Feb. 13, 1996
5356504 Method of sealing cracks in foundation walls by applying polyvinyl acetal as a primer for silicone sealant Oct. 18, 1994
5232542 Drum for assembling tire components Aug. 3, 1993
4473427 Radial tire manufacture apparatus Sep. 25, 1984
4472233 Radial tire building drum Sep. 18, 1984
4138307 Axially adjustable fire construction drum Feb. 6, 1979
4045277 Pneumatic tire building drum Aug. 30, 1977
3948717 Tire building drum Apr. 6, 1976











 
 
  Recently Added Patents
Delivery of captions, content advisory and other data through digital interface
Display apparatus having a semi-penetration layer and a sealing unit
Pyroelectric detector, pyroelectric detection device, and electronic instrument
Geo-coding images
Mobile advertising and compensation-verification system
Distributed image acquisition, storage, and backup system
Information display device and program storing medium
  Randomly Featured Patents
Mobile controllable strobe light system and method for directing the movements of fish
Mooring pendant apparatus
Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bump
EEPROM memory cell comprising a selection transistor with threshold voltage adjusted by implantation, and related manufacturing process
Driver safety program
Bottom-hole information collecting equipment
Folding sawhorse
Process for producing a multilayer ceramic circuit substrate
Target assembly for sputtering magnetic material
Ambience lighting system for a display device