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Class Information
Number: 156/345.27
Name: Adhesive bonding and miscellaneous chemical manufacture > Differential fluid etching apparatus > With measuring, sensing, detection or process control means > For temperature detection or control
Description: Apparatus wherein the means is for measuring, sensing, detecting, or controlling temperature within the apparatus or within some portion thereof.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8692166 Substrate heating device and substrate heating method Apr. 8, 2014
8683943 Plasma process apparatus and plasma process method Apr. 1, 2014
8673080 Temperature controlled showerhead Mar. 18, 2014
8623173 Substrate processing apparatus having electrode member Jan. 7, 2014
8617348 Modulating etch selectivity and etch rate of silicon nitride thin films Dec. 31, 2013
8608900 Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes Dec. 17, 2013
8591755 Methods for controlling plasma constituent flux and deposition during semiconductor fabrication and apparatus for implementing the same Nov. 26, 2013
8587763 Substrate processing method, substrate processing system, and computer-readable recording medium recording program thereon Nov. 19, 2013
8580693 Temperature enhanced electrostatic chucking in plasma processing apparatus Nov. 12, 2013
8555809 Method for constant concentration evaporation and a device using the same Oct. 15, 2013
8547085 Plasma-facing probe arrangement including vacuum gap for use in a plasma processing chamber Oct. 1, 2013
8535479 Manufacturing method of semiconductor device, and semiconductor device Sep. 17, 2013
8476561 Substrate heating device and substrate heating method Jul. 2, 2013
8465593 Substrate processing apparatus and gas supply method Jun. 18, 2013
8430963 Cool-down system and method for a vapor deposition system Apr. 30, 2013
8394229 Susceptor ring Mar. 12, 2013
8343280 Multi-zone substrate temperature control system and method of operating Jan. 1, 2013
8337660 Capacitively coupled plasma reactor having very agile wafer temperature control Dec. 25, 2012
8323410 High throughput chemical treatment system and method of operating Dec. 4, 2012
8313610 Temperature control modules for showerhead electrode assemblies for plasma processing apparatuses Nov. 20, 2012
8308962 Etching processes used in MEMS production Nov. 13, 2012
8304021 Vapor phase deposition apparatus, method for depositing thin film and method for manufacturing semiconductor device Nov. 6, 2012
8303715 High throughput thermal treatment system and method of operating Nov. 6, 2012
8302554 Apparatus and method for rapid cooling of large area substrates in vacuum Nov. 6, 2012
8303716 High throughput processing system for chemical treatment and thermal treatment and method of operating Nov. 6, 2012
8287688 Substrate support for high throughput chemical treatment system Oct. 16, 2012
8262798 Shower head, device and method for manufacturing thin films Sep. 11, 2012
8221580 Plasma reactor with wafer backside thermal loop, two-phase internal pedestal thermal loop and a control processor governing both loops Jul. 17, 2012
8216486 Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body Jul. 10, 2012
8206550 Method and system for manufacturing semiconductor device having less variation in electrical characteristics Jun. 26, 2012
8157951 Capacitively coupled plasma reactor having very agile wafer temperature control Apr. 17, 2012
8137467 Temperature controlled showerhead Mar. 20, 2012
8128751 Film-forming apparatus Mar. 6, 2012
8114244 Method for etching a sample Feb. 14, 2012
8110044 Substrate processing apparatus and temperature control device Feb. 7, 2012
8110045 Processing equipment for object to be processed Feb. 7, 2012
8092637 Manufacturing method in plasma processing apparatus Jan. 10, 2012
8092638 Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution Jan. 10, 2012
8092639 Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes Jan. 10, 2012
8083855 Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body Dec. 27, 2011
8075729 Method and apparatus for controlling temperature of a substrate Dec. 13, 2011
8070880 Substrate processing apparatus Dec. 6, 2011
8043466 Etching apparatus Oct. 25, 2011
8038796 Apparatus for spatial and temporal control of temperature on a substrate Oct. 18, 2011
8034181 Plasma processing apparatus Oct. 11, 2011
8034180 Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor Oct. 11, 2011
8020398 Fluid delivery mechanism for vacuum wafer processing system Sep. 20, 2011
8012304 Plasma reactor with a multiple zone thermal control feed forward control apparatus Sep. 6, 2011
8002463 Method and device for determining the temperature of a substrate Aug. 23, 2011
7977609 Temperature measuring device using oscillating frequency signals Jul. 12, 2011

1 2 3 4










 
 
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