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Class Information
Number: 156/345.16
Name: Adhesive bonding and miscellaneous chemical manufacture > Differential fluid etching apparatus > For liquid etchant > With measuring, sensing, detection or process control means > With endpoint detection means
Description: Apparatus including means to detect when a desired end of the etching has been reached.










Patents under this class:

Patent Number Title Of Patent Date Issued
8591698 Peak-based endpointing for chemical mechanical polishing Nov. 26, 2013
8496756 Methods for processing substrates in process systems having shared resources Jul. 30, 2013
8292693 Using optical metrology for wafer to wafer feed back process control Oct. 23, 2012
8048799 Method for forming copper wiring in semiconductor device Nov. 1, 2011
8043466 Etching apparatus Oct. 25, 2011
7690966 Method and apparatus for detecting planarization of metal films prior to clearing Apr. 6, 2010
7604527 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Oct. 20, 2009
7569119 In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization Aug. 4, 2009
7507144 Substrate polishing apparatus Mar. 24, 2009
7169015 Apparatus for optical inspection of wafers during processing Jan. 30, 2007
7037403 In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization May. 2, 2006
6989683 Enhanced endpoint detection for wet etch process control Jan. 24, 2006
6976902 Chemical mechanical polishing apparatus Dec. 20, 2005
6953515 Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection Oct. 11, 2005
6899784 Apparatus for detecting CMP endpoint in acidic slurries May. 31, 2005
6896588 Chemical mechanical polishing optical endpoint detection May. 24, 2005
6863772 Dual-port end point window for plasma etcher Mar. 8, 2005
6843880 Enhanced endpoint detection for wet etch process control Jan. 18, 2005
6808590 Method and apparatus of arrayed sensors for metrological control Oct. 26, 2004
6776871 Method and apparatus for endpointing a chemical-mechanical planarization process Aug. 17, 2004
6752689 Apparatus for optical inspection of wafers during polishing Jun. 22, 2004
6682628 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Jan. 27, 2004
6589099 Method for chemical mechanical polishing (CMP) with altering the concentration of oxidizing agent in slurry Jul. 8, 2003
6562254 Etching method May. 13, 2003
6517668 Method and apparatus for endpointing a chemical-mechanical planarization process Feb. 11, 2003
6464824 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Oct. 15, 2002
6258205 Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material Jul. 10, 2001
5788801 Real time measurement of etch rate during a chemical etching process Aug. 4, 1998
5591299 System for providing integrated monitoring, control and diagnostics functions for semiconductor spray process tools Jan. 7, 1997
5573624 Chemical etch monitor for measuring film etching uniformity during a chemical etching process Nov. 12, 1996
5516399 Contactless real-time in-situ monitoring of a chemical etching May. 14, 1996
5501766 Minimizing overetch during a chemical etching process Mar. 26, 1996
5500073 Real time measurement of etch rate during a chemical etching process Mar. 19, 1996
5456788 Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process Oct. 10, 1995
5244527 Manufacturing unit for semiconductor devices Sep. 14, 1993
4885051 Optically controlled dimpler for preparation of ultrathin samples Dec. 5, 1989
4481061 Etching depth monitor Nov. 6, 1984
4462856 System for etching a metal film on a semiconductor wafer Jul. 31, 1984
4338157 Method for forming electrical connecting lines by monitoring the etch rate during wet etching Jul. 6, 1982
4021278 Reduced meniscus-contained method of handling fluids in the manufacture of semiconductor wafers May. 3, 1977
3953265 Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers Apr. 27, 1976











 
 
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