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Class Information
Number: 156/345.13
Name: Adhesive bonding and miscellaneous chemical manufacture > Differential fluid etching apparatus > For liquid etchant > With mechanical polishing (i.e., cmp-chemical mechanical polishing) > With measuring, sensing, detection or process control means
Description: Apparatus including means to measure, sense, or detect a process condition, or to automatically control the operation of the apparatus.

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8591698 Peak-based endpointing for chemical mechanical polishing Nov. 26, 2013
8460507 CMP sensor and control system Jun. 11, 2013
8398811 Polishing apparatus and polishing method Mar. 19, 2013
8388409 Substrate polishing apparatus Mar. 5, 2013
8357263 Apparatus and methods for electrical measurements in a plasma etcher Jan. 22, 2013
8292693 Using optical metrology for wafer to wafer feed back process control Oct. 23, 2012
8268115 Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods Sep. 18, 2012
8257545 Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith Sep. 4, 2012
8070909 Feedback control of chemical mechanical polishing device providing manipulation of removal rate profiles Dec. 6, 2011
8043466 Etching apparatus Oct. 25, 2011
8043467 Liquid processing apparatus and liquid processing method Oct. 25, 2011
8043468 Apparatus for and method of processing substrate Oct. 25, 2011
8025759 Polishing apparatus and polishing method Sep. 27, 2011
7935216 Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods May. 3, 2011
7869062 Apparatus for supporting substrate, apparatus for measuring surface potential, apparatus for measuring film thickness, and apparatus for inspecting substrate Jan. 11, 2011
7842916 Method of and apparatus for analyzing ions adsorbed on surface of mask Nov. 30, 2010
7780503 Polishing apparatus and polishing method Aug. 24, 2010
7751911 Failure alarm device and failure alarm method Jul. 6, 2010
7695589 Versatile system for conditioning slurry in CMP process Apr. 13, 2010
7690966 Method and apparatus for detecting planarization of metal films prior to clearing Apr. 6, 2010
7622037 Ozonated water flow and concentration control apparatus and method Nov. 24, 2009
7585204 Substrate polishing apparatus Sep. 8, 2009
7582183 Apparatus for detection of thin films during chemical/mechanical polishing planarization Sep. 1, 2009
7520956 On-wafer monitoring system Apr. 21, 2009
7510460 Substrate polishing apparatus Mar. 31, 2009
7507144 Substrate polishing apparatus Mar. 24, 2009
7498236 Silicon wafer thinning end point method Mar. 3, 2009
7341502 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Mar. 11, 2008
7326103 Vertically adjustable chemical mechanical polishing head and method for use thereof Feb. 5, 2008
7309618 Method and apparatus for real time metal film thickness measurement Dec. 18, 2007
7278901 Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film Oct. 9, 2007
7241202 Substrate polishing apparatus Jul. 10, 2007
7235154 Devices and methods for optical endpoint detection during semiconductor wafer polishing Jun. 26, 2007
7229521 Etching system using a deionized water adding device Jun. 12, 2007
7169015 Apparatus for optical inspection of wafers during processing Jan. 30, 2007
7171334 Method and apparatus for synchronizing data acquisition of a monitored IC fabrication process Jan. 30, 2007
7156947 Energy enhanced surface planarization Jan. 2, 2007
7132035 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes Nov. 7, 2006
7128803 Integration of sensor based metrology into semiconductor processing tools Oct. 31, 2006
7052575 System and method for active control of etch process May. 30, 2006
7049633 Method of measuring meso-scale structures on wafers May. 23, 2006
6998013 CMP apparatus polishing head with concentric pressure zones Feb. 14, 2006
6959255 Method and apparatus for monitoring integrated circuit fabrication Oct. 25, 2005
6951597 Dynamic polishing fluid delivery system for a rotational polishing apparatus Oct. 4, 2005
6951624 Method and apparatus of arrayed sensors for metrological control Oct. 4, 2005
6942543 Substrate polishing apparatus Sep. 13, 2005
6934032 Copper oxide monitoring by scatterometry/ellipsometry during nitride or BLOK removal in damascene process Aug. 23, 2005
6929755 Method of and apparatus for chemical mechanical polishing and slurry supplying device Aug. 16, 2005
6916428 Photo-chemical remediation of Cu-CMP waste Jul. 12, 2005
6911111 Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning Jun. 28, 2005

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