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Class Information
Number: 156/345.12
Name: Adhesive bonding and miscellaneous chemical manufacture > Differential fluid etching apparatus > For liquid etchant > With mechanical polishing (i.e., cmp-chemical mechanical polishing)
Description: Apparatus including means for carrying out combined chemical etching and mechanical abrading to polish a workpiece.

Sub-classes under this class:

Class Number Class Name Patents
156/345.13 With measuring, sensing, detection or process control means 132
156/345.14 With wafer retaining ring 66

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8679286 Catalyst-aided chemical processing method Mar. 25, 2014
8652295 CMP tool implementing cyclic self-limiting CM process Feb. 18, 2014
8557132 Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning Oct. 15, 2013
8524035 Method and apparatus for conformable polishing Sep. 3, 2013
8388799 Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad and chemical mechanical polishing method Mar. 5, 2013
8388409 Substrate polishing apparatus Mar. 5, 2013
8318042 Systems, methods and solutions for chemical polishing of GaAs wafers Nov. 27, 2012
8309465 System and method for producing devices including a semiconductor part and a non-semiconductor part Nov. 13, 2012
8298369 Liquid supply method, liquid supply apparatus, substrate polishing apparatus, and method of measuring supply flow rate of liquid Oct. 30, 2012
8268114 Workpiece holder for polishing, workpiece polishing apparatus and polishing method Sep. 18, 2012
8257544 Chemical mechanical polishing pad having a low defect integral window Sep. 4, 2012
8219375 Plated film thickness calculating method and plated film thickness calculating device Jul. 10, 2012
8205625 Apparatus and method for surface treatment of substrate, and substrate processing apparatus and method Jun. 26, 2012
8043958 Capping before barrier-removal IC fabrication method Oct. 25, 2011
8025732 Apparatus for processing a substrate Sep. 27, 2011
8008203 Substrate, method of polishing the same, and polishing apparatus Aug. 30, 2011
7993485 Methods and apparatus for processing a substrate Aug. 9, 2011
7947190 Methods for polishing semiconductor device structures by differentially applying pressure to substrates that carry the semiconductor device structures May. 24, 2011
7935216 Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods May. 3, 2011
7897007 Substrate holding apparatus and substrate polishing apparatus Mar. 1, 2011
7879180 Polishing device and polishing method Feb. 1, 2011
7855150 Plasma system and method for anisotropically etching structures into a substrate Dec. 21, 2010
7850817 Polishing device and substrate processing device Dec. 14, 2010
7842158 Multiple zone carrier head with flexible membrane Nov. 30, 2010
7811925 Capping before barrier-removal IC fabrication method Oct. 12, 2010
7695589 Versatile system for conditioning slurry in CMP process Apr. 13, 2010
7632378 Polishing apparatus Dec. 15, 2009
7622016 Retainer ring of chemical mechanical polishing device Nov. 24, 2009
7585425 Apparatus and method for reducing removal forces for CMP pads Sep. 8, 2009
7541094 Firepolished quartz parts for use in semiconductor processing Jun. 2, 2009
7527694 Substrate gripping apparatus May. 5, 2009
7479206 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Jan. 20, 2009
7459056 Pad conditioning head for CMP process Dec. 2, 2008
7452814 Method of polishing GaN substrate Nov. 18, 2008
7435162 Polishing fluids and methods for CMP Oct. 14, 2008
7402521 Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor Jul. 22, 2008
7396430 Apparatus and method for confined area planarization Jul. 8, 2008
7288165 Pad conditioning head for CMP process Oct. 30, 2007
7270597 Method and system for chemical mechanical polishing pad cleaning Sep. 18, 2007
7255771 Multiple zone carrier head with flexible membrane Aug. 14, 2007
7252736 Compliant grinding wheel Aug. 7, 2007
7198560 Wafer planarization composition and method of use Apr. 3, 2007
7166017 Slurry for CMP, polishing method and method of manufacturing semiconductor device Jan. 23, 2007
7156946 Wafer carrier pivot mechanism Jan. 2, 2007
7156947 Energy enhanced surface planarization Jan. 2, 2007
7153197 Method for achieving uniform CU CMP polishing Dec. 26, 2006
7139641 Wafer protection system Nov. 21, 2006
7132035 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes Nov. 7, 2006
7101259 Polishing method and apparatus Sep. 5, 2006
7083700 Methods and apparatuses for planarizing microelectronic substrate assemblies Aug. 1, 2006

1 2 3 4 5 6

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