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Class Information
Number: 156/345.12
Name: Adhesive bonding and miscellaneous chemical manufacture > Differential fluid etching apparatus > For liquid etchant > With mechanical polishing (i.e., cmp-chemical mechanical polishing)
Description: Apparatus including means for carrying out combined chemical etching and mechanical abrading to polish a workpiece.


Sub-classes under this class:

Class Number Class Name Patents
156/345.13 With measuring, sensing, detection or process control means 112
156/345.14 With wafer retaining ring 60


Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
7622016 Retainer ring of chemical mechanical polishing device Nov. 24, 2009
7585425 Apparatus and method for reducing removal forces for CMP pads Sep. 8, 2009
7541094 Firepolished quartz parts for use in semiconductor processing Jun. 2, 2009
7527694 Substrate gripping apparatus May. 5, 2009
7479206 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Jan. 20, 2009
7459056 Pad conditioning head for CMP process Dec. 2, 2008
7452814 Method of polishing GaN substrate Nov. 18, 2008
7435162 Polishing fluids and methods for CMP Oct. 14, 2008
7402521 Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor Jul. 22, 2008
7396430 Apparatus and method for confined area planarization Jul. 8, 2008
7288165 Pad conditioning head for CMP process Oct. 30, 2007
7270597 Method and system for chemical mechanical polishing pad cleaning Sep. 18, 2007
7255771 Multiple zone carrier head with flexible membrane Aug. 14, 2007
7252736 Compliant grinding wheel Aug. 7, 2007
7198560 Wafer planarization composition and method of use Apr. 3, 2007
7166017 Slurry for CMP, polishing method and method of manufacturing semiconductor device Jan. 23, 2007
7156947 Energy enhanced surface planarization Jan. 2, 2007
7156946 Wafer carrier pivot mechanism Jan. 2, 2007
7153197 Method for achieving uniform CU CMP polishing Dec. 26, 2006
7139641 Wafer protection system Nov. 21, 2006
7132035 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes Nov. 7, 2006
7101259 Polishing method and apparatus Sep. 5, 2006
7083700 Methods and apparatuses for planarizing microelectronic substrate assemblies Aug. 1, 2006
7081182 Method and apparatus for automatically measuring the concentration of TOC in a fluid used in a semiconductor manufacturing process Jul. 25, 2006
7077727 Process for chemical-mechanical polishing of metal substrates Jul. 18, 2006
7077725 Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus Jul. 18, 2006
7070659 System for filling openings in semiconductor products Jul. 4, 2006
7052375 Method of making carrier head backing plate having low-friction coating May. 30, 2006
7037403 In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization May. 2, 2006
7025854 Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system Apr. 11, 2006
7004814 CMP process control method Feb. 28, 2006
6997785 Wafer planarization composition and method of use Feb. 14, 2006
6994611 Method and system for cleaning a chemical mechanical polishing pad Feb. 7, 2006
6992007 Method of cleaning damascene structure of semiconductor wafer during fabrication of semiconductor device Jan. 31, 2006
6936133 Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool Aug. 30, 2005
6921455 Device for polishing outer peripheral edge of semiconductor wafer Jul. 26, 2005
6896776 Method and apparatus for electro-chemical processing May. 24, 2005
6887338 300 mm platen and belt configuration May. 3, 2005
6886442 Punching apparatus for backing-films of CMP machines and preventive maintenance method for the same May. 3, 2005
6887358 Installation for processing wafers May. 3, 2005
6872280 Slurry collection device and method Mar. 29, 2005
6869498 Chemical mechanical polishing with shear force measurement Mar. 22, 2005
6867138 Method of chemical/mechanical polishing of the surface of semiconductor device Mar. 15, 2005
6863770 Method and apparatus for polishing a substrate while washing a polishing pad of the apparatus with at least one free-flowing vertical stream of liquid Mar. 8, 2005
6857940 Polishing apparatus and method Feb. 22, 2005
6849152 In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization Feb. 1, 2005
6837781 Polishing pad Jan. 4, 2005
6833046 Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies Dec. 21, 2004
6827814 Processing apparatus, processing system and processing method Dec. 7, 2004
6818095 Chemical mechanical polishing apparatus Nov. 16, 2004

1 2 3 4 5


 
 
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