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Class Information
Number: 156/345.1
Name: Adhesive bonding and miscellaneous chemical manufacture > Differential fluid etching apparatus
Description: . Apparatus under the class definition for contacting a workpiece with a reactive fluid to chemically erode different portions of the workpiece at different rates.

Sub-classes under this class:

Class Number Class Name Patents
156/345.11 For liquid etchant 163
156/345.43 Having glow discharge electrode gas energizing means 459
156/345.29 With etchant gas supply or exhaust structure located outside of etching chamber (e.g., supply tank, pipe network, exhaust pump, particle filter) 336
156/345.33 With gas inlet structure (e.g., inlet nozzle, gas distributor) 538
156/345.37 With heating or cooling means for apparatus part other than workpiece support 232
156/345.31 With means for passing discrete workpiece through plural chambers (e.g., loadlock) 359
156/345.5 With means for photochemical energization of a gas using ultraviolet, visible, or x-ray radiation 108
156/345.4 With means to direct electron beam or ion beam to a gas to energize the gas 36
156/345.39 With means to generate and to direct a reactive ion etchant beam at a workpiece 117
156/345.24 With measuring, sensing, detection or process control means 486
156/345.3 With mechanical mask, shield or shutter for shielding workpiece 137
156/345.41 With microwave gas energizing means 276
156/345.38 With multiple gas energizing means associated with one workpiece etching 106
156/345.35 With plasma generation means remote from processing chamber 197
156/345.48 With radio frequency (rf) antenna or inductive coil gas energizing means 620
156/345.51 With workpiece support 647

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
6706138 Adjustable dual frequency voltage dividing plasma reactor Mar. 16, 2004
6703092 Resin molded article for chamber liner Mar. 9, 2004
6689222 Sealable surface method and device Feb. 10, 2004
6685796 CMP uniformity Feb. 3, 2004
6682627 Process chamber having a corrosion-resistant wall and method Jan. 27, 2004
6677225 System and method for constraining totally released microcomponents Jan. 13, 2004
6676800 Particle contamination cleaning from substrates using plasmas, reactive gases, and mechanical agitation Jan. 13, 2004
6669810 Method for detecting etching endpoint, and etching apparatus and etching system using the method thereof Dec. 30, 2003
6669811 Linear drive system for use in a plasma processing system Dec. 30, 2003
6669807 Method for reactive ion etching and apparatus therefor Dec. 30, 2003
6664497 Toroidal low-field reactive gas source Dec. 16, 2003
6660646 Method for plasma hardening photoresist in etching of semiconductor and superconductor films Dec. 9, 2003
6652656 Semiconductor wafer holding assembly Nov. 25, 2003
6649020 Plasma processing apparatus Nov. 18, 2003
6641697 Substrate processing using a member comprising an oxide of a group IIIB metal Nov. 4, 2003
6638880 Chemical vapor deposition apparatus and a method of manufacturing a semiconductor device Oct. 28, 2003
6635115 Tandem process chamber Oct. 21, 2003
6624081 Enhanced etching/smoothing of dielectric surfaces Sep. 23, 2003
6623595 Wavy and roughened dome in plasma processing reactor Sep. 23, 2003
6602380 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine Aug. 5, 2003
6602381 Plasma confinement by use of preferred RF return path Aug. 5, 2003
6596123 Method and apparatus for cleaning a semiconductor wafer processing system Jul. 22, 2003
6592708 Filter apparatus and method therefor Jul. 15, 2003
6592707 Corrosion-resistant protective coating for an apparatus and method for processing a substrate Jul. 15, 2003
6579408 Apparatus and method for etching wafer backside Jun. 17, 2003
6579407 Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system Jun. 17, 2003
6562182 Method and apparatus for endpointing a chemical-mechanical planarization process May. 13, 2003
6562184 Planarization system with multiple polishing pads May. 13, 2003
6562183 Anti-corrosive parts for etching apparatus May. 13, 2003
6558504 Plasma processing system and method May. 6, 2003
6554950 Method and apparatus for removal of surface contaminants from substrates in vacuum applications Apr. 29, 2003
6537415 Apparatus for processing samples Mar. 25, 2003
6524428 Method of holding substrate and substrate holding system Feb. 25, 2003
6508911 Diamond coated parts in a plasma reactor Jan. 21, 2003
6506254 Semiconductor processing equipment having improved particle performance Jan. 14, 2003
6506312 Vapor deposition chamber components and methods of making the same Jan. 14, 2003
6500299 Chamber having improved gas feed-through and method Dec. 31, 2002
6497783 Plasma processing apparatus provided with microwave applicator having annular waveguide and processing method Dec. 24, 2002
6478923 Vacuum operation apparatus Nov. 12, 2002
6475334 Dry etching device and dry etching method Nov. 5, 2002
6467297 Wafer holder for rotating and translating wafers Oct. 22, 2002
6461470 Apparatus for etching glass substrate Oct. 8, 2002
6454899 Apparatus for filling trenches Sep. 24, 2002
6454898 Inductively coupled RF Plasma reactor having an overhead solenoidal antenna and modular confinement magnet liners Sep. 24, 2002
6447632 Apparatus and nozzle device for gaseous polishing Sep. 10, 2002
6447634 Method and apparatus for selective removal of material from wafer alignment marks Sep. 10, 2002
6444084 Low density high frequency process for a parallel-plate electrode plasma reactor having an inductive antenna Sep. 3, 2002
6444085 Inductively coupled RF plasma reactor having an antenna adjacent a window electrode Sep. 3, 2002
6440260 Plasma monitoring method and semiconductor production apparatus Aug. 27, 2002
6432255 Method and apparatus for enhancing chamber cleaning Aug. 13, 2002

1 2 3 4 5 6

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