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Class Information
Number: 156/331.5
Name: Adhesive bonding and miscellaneous chemical manufacture > Methods > Surface bonding and/or assembly therefor > Particular adhesive > Organic containing > Synthetic resin containing > Nitrogenous resin > With polymerization completion, i.e., curing, after assembly > N in a ring
Description: Subject matter wherein the resin precursor contains a cyclic moiety and the cyclic moiety contains nitrogen.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8691924 Optical-use pressure-sensitive adhesive sheet Apr. 8, 2014
8470124 Cold pressing process for polyamide epichlorohydrin (PAE) based wood adhesive Jun. 25, 2013
8444805 Low formaldehyde emission adhesive system May. 21, 2013
8298368 Universal primer compositions and methods Oct. 30, 2012
8277601 Reactive hot melt adhesive Oct. 2, 2012
8268102 Formaldehyde-free lignocellulosic adhesives and composites made from the adhesives Sep. 18, 2012
8080609 Low energy surface bonding system containing a primer with long open time Dec. 20, 2011
8066891 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film Nov. 29, 2011
8043534 Maleimide compositions and methods for use thereof Oct. 25, 2011
7629056 Circuit-connecting material and circuit terminal connected structure and connecting method Dec. 8, 2009
7537839 Adhesive compositions free of metallic catalyst May. 26, 2009
7452442 Gluing wood based materials with melaminic amino resin and resorcinol or tannin resin Nov. 18, 2008
7342053 Resin composition, adhesive film using the same and multilayer printed circuit board Mar. 11, 2008
7297217 Method and apparatus for applying low viscosity cyanoacrylate adhesive on wooden furniture Nov. 20, 2007
7271227 Adhesive compositions free of metallic catalyst Sep. 18, 2007
6858295 Pressure sensitive adhesive comprising vinylpyrrolidone Feb. 22, 2005
6824642 Phenyl-linked oxazole cyanates as dielectrics having good adhesive and filling properties Nov. 30, 2004
6787244 Adhesively bonded chip-and wafer stacks Sep. 7, 2004
6667108 Wearprotected wood veneer Dec. 23, 2003
6632314 Method of making a lamination and surface planarization for multilayer thin film interconnect Oct. 14, 2003
6613183 Method and apparatus for applying low viscosity cyanoacrylate adhesive on wooden furniture Sep. 2, 2003
6478920 Chip-type circuit component and method of manufacturing the same Nov. 12, 2002
6440258 Adhesive film for semiconductor package Aug. 27, 2002
6132886 Adhesives for flexible laminates Oct. 17, 2000
5972145 Removable passivating polyimide coating and methods of use Oct. 26, 1999
5959068 Adhesive tape for electronic parts and liquid adhesive Sep. 28, 1999
5922167 Bending integrated circuit chips Jul. 13, 1999
5908529 Multi-layer film substrate and process for production thereof Jun. 1, 1999
5856425 Dispensable resin paste Jan. 5, 1999
5670010 Process for adhering a fluororesin film to a metal surface using a primer Sep. 23, 1997
5603798 Two-part moisture curable polyurethane adhesive Feb. 18, 1997
5527621 Method for surface treatment of polyimide resin molded articles Jun. 18, 1996
5489667 Polyetheresteramides and process for making and using the same Feb. 6, 1996
5397419 Thermosetting imide oligomer and manufacturing method of heat resistant laminated sheet using the same Mar. 14, 1995
5360671 Thermoplastic polymides and composites therefrom Nov. 1, 1994
5312579 Low pressure process for continuous fiber reinforced polyamic acid resin matrix composite laminates May. 17, 1994
5205894 Polyimide and high-temperature adhesive of polyimide Apr. 27, 1993
5194307 High performance epoxy based coverlay and bond fly adhesive with heat activated cure mechanism Mar. 16, 1993
5176780 Method of bonding polyimide films and printed circuit boards incorporating the same Jan. 5, 1993
5156710 Method of laminating polyimide to thin sheet metal Oct. 20, 1992
5152863 Reactive-oligoimide adhesives, laminates, and methods of making the laminates Oct. 6, 1992
5085905 Adhesion of elastomers to brass plated wire Feb. 4, 1992
4980004 Method of manufacturing polyimide foam shapes having improved density and cell size uniformity Dec. 25, 1990
4945006 Low odor adhesive compositions and bonding method employing same Jul. 31, 1990
4923538 Method of making porous inorganic particle filled polyimide foam insulation products May. 8, 1990
4923651 Method of manufacturing polyimide foam shapes having improved density and cell size uniformity May. 8, 1990
4908086 Low-cost semiconductor device package process Mar. 13, 1990
4876323 .alpha.-substituted acrylic acid esters, their polymers and method of synthesizing same Oct. 24, 1989
4874648 Method of making flame resistant polyimide foam insulation and the resulting insulation Oct. 17, 1989
4865784 Method of making porous inorganic particle filled polyimide foam insulation products Sep. 12, 1989

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