Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Material Science
Class Information
Number: 148/DIG.28
Name: Metal treatment > Dicing
Description:










Patents under this class:
1 2

Patent Number Title Of Patent Date Issued
8039283 Nitride compound semiconductor element and method for manufacturing same Oct. 18, 2011
6451120 Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers Sep. 17, 2002
6124148 Method of manufacturing semiconductor acceleration sensor Sep. 26, 2000
6063695 Simplified process for the fabrication of deep clear laser marks using a photoresist mask May. 16, 2000
5933351 System and method for locating dies cut from a silicon wafer on a wafer table Aug. 3, 1999
5693181 Method of making transducer chips with grooves on the wafer for easy separation of the chips Dec. 2, 1997
5691248 Methods for precise definition of integrated circuit chip edges Nov. 25, 1997
5650348 Method of making an integrated circuit chip having an array of logic gates Jul. 22, 1997
5641714 Method of manufacturing members Jun. 24, 1997
5637537 Method of severing a thin film semiconductor device Jun. 10, 1997
5605489 Method of protecting micromechanical devices during wafer separation Feb. 25, 1997
5597767 Separation of wafer into die with wafer-level processing Jan. 28, 1997
5597766 Method for detaching chips from a wafer Jan. 28, 1997
5593925 Semiconductor device capable of preventing humidity invasion Jan. 14, 1997
5593926 Method of manufacturing semiconductor device Jan. 14, 1997
5580831 Sawcut method of forming alignment marks on two faces of a substrate Dec. 3, 1996
5543365 Wafer scribe technique using laser by forming polysilicon Aug. 6, 1996
5527744 Wafer method for breaking a semiconductor Jun. 18, 1996
5525549 Method for producing an acceleration sensor Jun. 11, 1996
5516728 Process for fabircating an integrated circuit May. 14, 1996
5462900 Method of manufacturing semiconductor elements without burrs Oct. 31, 1995
5462636 Method for chemically scribing wafers Oct. 31, 1995
5451549 Semiconductor dicing method which uses variable sawing speeds Sep. 19, 1995
5434094 Method of producing a field effect transistor Jul. 18, 1995
5421956 Method of fabricating an integrated pressure sensor Jun. 6, 1995
5393706 Integrated partial sawing process Feb. 28, 1995
5393707 Semiconductor - slice cleaving Feb. 28, 1995
5389556 Individually powering-up unsingulated dies on a wafer Feb. 14, 1995
5376589 Method of fabricating similar indexed dissociated chips Dec. 27, 1994
5369060 Method for dicing composite wafers Nov. 29, 1994
5340772 Method of increasing the layout efficiency of dies on a wafer and increasing the ratio of I/O area to active area per die Aug. 23, 1994
5314844 Method for dicing a semiconductor wafer May. 24, 1994
5302554 Method for producing semiconductor device Apr. 12, 1994
5288663 Method for extending wafer-supporting sheet Feb. 22, 1994
5284792 Full-wafer processing of laser diodes with cleaved facets Feb. 8, 1994
5275958 Method for producing semiconductor chips Jan. 4, 1994
5266528 Method of dicing semiconductor wafer with diamond and resin blades Nov. 30, 1993
5259925 Method of cleaning a plurality of semiconductor devices Nov. 9, 1993
5219796 Method of fabricating image sensor dies and the like for use in assembling arrays Jun. 15, 1993
5206181 Method for manufacturing a semiconductor device with a slotted metal test pad to prevent lift-off during wafer scribing Apr. 27, 1993
5202271 Manufacturing method of photovoltaic device Apr. 13, 1993
5196378 Method of fabricating an integrated circuit having active regions near a die edge Mar. 23, 1993
5182233 Compound semiconductor pellet, and method for dicing compound semiconductor wafer Jan. 26, 1993
5179035 Method of fabricating two-terminal non-linear devices Jan. 12, 1993
5132252 Method for fabricating semiconductor devices that prevents pattern contamination Jul. 21, 1992
5102818 Method for the smooth fine classification of varactor diodes Apr. 7, 1992
5096855 Method of dicing semiconductor wafers which produces shards less than 10 microns in size Mar. 17, 1992
5091331 Ultra-thin circuit fabrication by controlled wafer debonding Feb. 25, 1992
5024970 Method of obtaining semiconductor chips Jun. 18, 1991
4990462 Method for coplanar integration of semiconductor ic devices Feb. 5, 1991

1 2










 
 
  Recently Added Patents
Electrical conduit containing a fire-resisting thermoplastic composition
Avalanche photo diode and method of manufacturing the same
Sparse data compression
Liquid composite compositions using non-volatile liquids and nanoparticles and uses thereof
Downlink scheduling in fractional frequency reuse (FFR) systems
Lighting apparatus
Commissioning incoming packet switched connections
  Randomly Featured Patents
Glass envelopes for tungsten-halogen lamps
Frame-type chair
Controlled leakage container and method
Method for dividing wafer, method for manufacturing silicon devices, and method for manufacturing liquid ejecting heads
Bacillus MGA3 diaminopimelate decarboxylase gene
Treating impaired consciousness with glutamyl-L-histidyl-L-prolinamide
Self-monitoring distributed hardware systems
Multi-cylinder stirling engine
Imidazo [1,5-d]-as-triazine-4(3H)-ones and thiones
Plasma-arc torch system with filter