| Patent Number |
Title Of Patent |
Date Issued |
| 6451120 |
Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers |
Sep. 17, 2002 |
| 6124148 |
Method of manufacturing semiconductor acceleration sensor |
Sep. 26, 2000 |
| 6063695 |
Simplified process for the fabrication of deep clear laser marks using a photoresist mask |
May. 16, 2000 |
| 5933351 |
System and method for locating dies cut from a silicon wafer on a wafer table |
Aug. 3, 1999 |
| 5693181 |
Method of making transducer chips with grooves on the wafer for easy separation of the chips |
Dec. 2, 1997 |
| 5691248 |
Methods for precise definition of integrated circuit chip edges |
Nov. 25, 1997 |
| 5650348 |
Method of making an integrated circuit chip having an array of logic gates |
Jul. 22, 1997 |
| 5641714 |
Method of manufacturing members |
Jun. 24, 1997 |
| 5637537 |
Method of severing a thin film semiconductor device |
Jun. 10, 1997 |
| 5605489 |
Method of protecting micromechanical devices during wafer separation |
Feb. 25, 1997 |
| 5597767 |
Separation of wafer into die with wafer-level processing |
Jan. 28, 1997 |
| 5597766 |
Method for detaching chips from a wafer |
Jan. 28, 1997 |
| 5593926 |
Method of manufacturing semiconductor device |
Jan. 14, 1997 |
| 5593925 |
Semiconductor device capable of preventing humidity invasion |
Jan. 14, 1997 |
| 5580831 |
Sawcut method of forming alignment marks on two faces of a substrate |
Dec. 3, 1996 |
| 5543365 |
Wafer scribe technique using laser by forming polysilicon |
Aug. 6, 1996 |
| 5527744 |
Wafer method for breaking a semiconductor |
Jun. 18, 1996 |
| 5525549 |
Method for producing an acceleration sensor |
Jun. 11, 1996 |
| 5516728 |
Process for fabircating an integrated circuit |
May. 14, 1996 |
| 5462900 |
Method of manufacturing semiconductor elements without burrs |
Oct. 31, 1995 |
| 5462636 |
Method for chemically scribing wafers |
Oct. 31, 1995 |
| 5451549 |
Semiconductor dicing method which uses variable sawing speeds |
Sep. 19, 1995 |
| 5434094 |
Method of producing a field effect transistor |
Jul. 18, 1995 |
| 5421956 |
Method of fabricating an integrated pressure sensor |
Jun. 6, 1995 |
| 5393707 |
Semiconductor - slice cleaving |
Feb. 28, 1995 |
| 5393706 |
Integrated partial sawing process |
Feb. 28, 1995 |
| 5389556 |
Individually powering-up unsingulated dies on a wafer |
Feb. 14, 1995 |
| 5376589 |
Method of fabricating similar indexed dissociated chips |
Dec. 27, 1994 |
| 5369060 |
Method for dicing composite wafers |
Nov. 29, 1994 |
| 5340772 |
Method of increasing the layout efficiency of dies on a wafer and increasing the ratio of I/O area to active area per die |
Aug. 23, 1994 |
| 5314844 |
Method for dicing a semiconductor wafer |
May. 24, 1994 |
| 5302554 |
Method for producing semiconductor device |
Apr. 12, 1994 |
| 5288663 |
Method for extending wafer-supporting sheet |
Feb. 22, 1994 |
| 5284792 |
Full-wafer processing of laser diodes with cleaved facets |
Feb. 8, 1994 |
| 5275958 |
Method for producing semiconductor chips |
Jan. 4, 1994 |
| 5266528 |
Method of dicing semiconductor wafer with diamond and resin blades |
Nov. 30, 1993 |
| 5259925 |
Method of cleaning a plurality of semiconductor devices |
Nov. 9, 1993 |
| 5219796 |
Method of fabricating image sensor dies and the like for use in assembling arrays |
Jun. 15, 1993 |
| 5206181 |
Method for manufacturing a semiconductor device with a slotted metal test pad to prevent lift-off during wafer scribing |
Apr. 27, 1993 |
| 5202271 |
Manufacturing method of photovoltaic device |
Apr. 13, 1993 |
| 5196378 |
Method of fabricating an integrated circuit having active regions near a die edge |
Mar. 23, 1993 |
| 5182233 |
Compound semiconductor pellet, and method for dicing compound semiconductor wafer |
Jan. 26, 1993 |
| 5179035 |
Method of fabricating two-terminal non-linear devices |
Jan. 12, 1993 |
| 5132252 |
Method for fabricating semiconductor devices that prevents pattern contamination |
Jul. 21, 1992 |
| 5102818 |
Method for the smooth fine classification of varactor diodes |
Apr. 7, 1992 |
| 5096855 |
Method of dicing semiconductor wafers which produces shards less than 10 microns in size |
Mar. 17, 1992 |
| 5091331 |
Ultra-thin circuit fabrication by controlled wafer debonding |
Feb. 25, 1992 |
| 5024970 |
Method of obtaining semiconductor chips |
Jun. 18, 1991 |
| 4990462 |
Method for coplanar integration of semiconductor ic devices |
Feb. 5, 1991 |
| 4978639 |
Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips |
Dec. 18, 1990 |
