| Patent Number |
Title Of Patent |
Date Issued |
| 6350645 |
Strapping via for interconnecting integrated circuit structures |
Feb. 26, 2002 |
| 6057186 |
Method for improving the butted contact resistance of an SRAM by double Vcc implantation |
May. 2, 2000 |
| 6010953 |
Method for forming a semiconductor buried contact with a removable spacer |
Jan. 4, 2000 |
| 5998295 |
Method of forming a rough region on a substrate |
Dec. 7, 1999 |
| 5998249 |
Static random access memory design and fabrication process featuring dual self-aligned contact structures |
Dec. 7, 1999 |
| 5902132 |
Method of manufacturing a semiconductor device including a process of forming a contact hole |
May. 11, 1999 |
| 5851869 |
Manufacture of semiconductor device having low contact resistance |
Dec. 22, 1998 |
| 5846860 |
Method of making buried contact in DRAM technology |
Dec. 8, 1998 |
| 5846865 |
Method of fabricating flat-cell mask read-only memory (ROM) devices |
Dec. 8, 1998 |
| 5840621 |
Method for manufacturing contact structure capable of avoiding short-circuit |
Nov. 24, 1998 |
| 5824579 |
Method of forming shared contact structure |
Oct. 20, 1998 |
| 5728596 |
Method for forming a semiconductor buried contact with a removable spacer |
Mar. 17, 1998 |
| 5719079 |
Method of making a semiconductor device having high density 4T SRAM in logic with salicide process |
Feb. 17, 1998 |
| 5710078 |
Method to improve the contact resistance of bit line metal structures to underlying polycide structures |
Jan. 20, 1998 |
| 5705437 |
Trench free process for SRAM |
Jan. 6, 1998 |
| 5700719 |
Semiconductor device and method for producing the same |
Dec. 23, 1997 |
| 5700707 |
Method of manufacturing SRAM cell structure having a tunnel oxide capacitor |
Dec. 23, 1997 |
| 5677231 |
Method for providing trench isolation |
Oct. 14, 1997 |
| 5665623 |
Method of fabricating totally self-aligned contacts for dynamic randomaccess memory cells |
Sep. 9, 1997 |
| 5607881 |
Method of reducing buried contact resistance in SRAM |
Mar. 4, 1997 |
| 5605864 |
Method for forming a semiconductor buried contact with a removable spacer |
Feb. 25, 1997 |
| 5604147 |
Method of forming a cylindrical container stacked capacitor |
Feb. 18, 1997 |
| 5593922 |
Method for buried contact isolation in SRAM devices |
Jan. 14, 1997 |
| 5576243 |
Process for forming stacked contacts and metal contacts on static random access memory having thin film transistors |
Nov. 19, 1996 |
| 5521113 |
Process for forming a butting contact through a gate electrode |
May. 28, 1996 |
| 5502008 |
Method for forming metal plug and/or wiring metal layer |
Mar. 26, 1996 |
| 5468669 |
Integrated circuit fabrication |
Nov. 21, 1995 |
| 5462895 |
Method of making semiconductor device comprising a titanium nitride film |
Oct. 31, 1995 |
| 5451544 |
Method of manufacturing a back contact for semiconductor die |
Sep. 19, 1995 |
| 5444021 |
Method for making a contact hole of a semiconductor device |
Aug. 22, 1995 |
| 5444016 |
Method of making ohmic contacts to a complementary III-V semiconductor device |
Aug. 22, 1995 |
| 5413961 |
Method for forming a contact of a semiconductor device |
May. 9, 1995 |
| 5405798 |
Method of producing a dynamic random access memory device having improved contact hole structures |
Apr. 11, 1995 |
| 5397722 |
Process for making self-aligned source/drain polysilicon or polysilicide contacts in field effect transistors |
Mar. 14, 1995 |
| 5393704 |
Self-aligned trenched contact (satc) process |
Feb. 28, 1995 |
| 5389564 |
Method of forming a GaAs FET having etched ohmic contacts |
Feb. 14, 1995 |
| 5387548 |
Method of forming an etched ohmic contact |
Feb. 7, 1995 |
| 5366930 |
Method for making highly integrated semiconductor connecting device using a conductive plug |
Nov. 22, 1994 |
| 5358903 |
Contact of a semiconductor device and its manufacturing process |
Oct. 25, 1994 |
| 5284799 |
Method of making a metal plug |
Feb. 8, 1994 |
| 5279979 |
Semiconductor having diffusion region separated from the gap electrode and wiring layer |
Jan. 18, 1994 |
| 5275971 |
Method of forming an ohmic contact to III-V semiconductor materials |
Jan. 4, 1994 |
| 5254498 |
Method for forming barrier metal structure |
Oct. 19, 1993 |
| 5250461 |
Method for dielectrically isolating integrated circuits using doped oxide sidewalls |
Oct. 5, 1993 |
| 5219793 |
Method for forming pitch independent contacts and a semiconductor device having the same |
Jun. 15, 1993 |
| 5208168 |
Semiconductor device having punch-through protected buried contacts and method for making the same |
May. 4, 1993 |
| 5206184 |
Method of making single layer personalization |
Apr. 27, 1993 |
| 5196373 |
Method of making trench conductor and crossunder architecture |
Mar. 23, 1993 |
| 5173449 |
Metallization process |
Dec. 22, 1992 |
| 5171713 |
Process for forming planarized, air-bridge interconnects on a semiconductor substrate |
Dec. 15, 1992 |
