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Class Information
Number: 148/DIG.135
Name: Metal treatment > Removal of substrate
Description:










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
7550052 Method of producing a complex structure by assembling stressed structures Jun. 23, 2009
7049165 Method of manufacturing an external force detection sensor May. 23, 2006
6429094 Treatment process for molecular bonding and unbonding of two structures Aug. 6, 2002
6168965 Method for making backside illuminated image sensor Jan. 2, 2001
RE36890 Gradient chuck method for wafer bonding employing a convex pressure Oct. 3, 2000
6060373 Method for manufacturing a flip chip semiconductor device May. 9, 2000
6025060 Method and apparatus for composite gemstones Feb. 15, 2000
6004860 SOI substrate and a method for fabricating the same Dec. 21, 1999
5932048 Method of fabricating direct-bonded semiconductor wafers Aug. 3, 1999
5897333 Method for forming integrated composite semiconductor devices Apr. 27, 1999
5869354 Method of making dielectrically isolated integrated circuit Feb. 9, 1999
5866436 Process of manufacturing an intergrated circuit having an interferometrically profiled mounting film Feb. 2, 1999
5846638 Composite optical and electro-optical devices Dec. 8, 1998
5846844 Method for producing group III nitride compound semiconductor substrates using ZnO release layers Dec. 8, 1998
5776789 Method for fabricating a semiconductor memory device Jul. 7, 1998
5769991 Method and apparatus for wafer bonding Jun. 23, 1998
5755914 Method for bonding semiconductor substrates May. 26, 1998
5753529 Surface mount and flip chip technology for total integrated circuit isolation May. 19, 1998
5747353 Method of making surface micro-machined accelerometer using silicon-on-insulator technology May. 5, 1998
5728591 Process for manufacturing light valve device using semiconductive composite substrate Mar. 17, 1998
5723353 Process for manufacturing a sensor Mar. 3, 1998
5719069 One-chip integrated sensor process Feb. 17, 1998
5702963 Method of forming high density electronic circuit modules Dec. 30, 1997
5698474 High speed diamond-based machining of silicon semiconductor die in wafer and packaged form for backside emission microscope detection Dec. 16, 1997
5698452 Method of making integrated detector/photoemitter with non-imaging director Dec. 16, 1997
5696034 Method for producing semiconductor substrate Dec. 9, 1997
5674758 Silicon on insulator achieved using electrochemical etching Oct. 7, 1997
5668045 Process for stripping outer edge of BESOI wafers Sep. 16, 1997
5650353 Method for production of SOI substrate Jul. 22, 1997
5647932 Method of processing a piezoelectric device Jul. 15, 1997
5646066 Method for forming electrical contact to the optical coating of an infrared detector from the backside of the detector Jul. 8, 1997
5646067 Method of bonding wafers having vias including conductive material Jul. 8, 1997
5643821 Method for making ohmic contact to lightly doped islands from a silicide buried layer and applications Jul. 1, 1997
5643805 Process for producing a bipolar device Jul. 1, 1997
5637510 Method for fabricating solar cell Jun. 10, 1997
5633209 Method of forming a circuit membrane with a polysilicon film May. 27, 1997
5622586 Method of fabricating device made of thin diamond foil Apr. 22, 1997
5602054 Method for formation of a well in a dielectrically isolated island Feb. 11, 1997
5597766 Method for detaching chips from a wafer Jan. 28, 1997
5595933 Method for manufacturing a cathode Jan. 21, 1997
5593915 Method of manufacturing semiconductor device Jan. 14, 1997
5591678 Process of manufacturing a microelectric device using a removable support substrate and etch-stop Jan. 7, 1997
5589419 Process for fabricating semiconductor device having a multilevel interconnection Dec. 31, 1996
5585304 Method of making semiconductor device with multiple transparent layers Dec. 17, 1996
5580802 Silicon-on-insulator gate-all-around mosfet fabrication methods Dec. 3, 1996
5563084 Method of making a three-dimensional integrated circuit Oct. 8, 1996
5547886 Method of producing a semiconductor device Aug. 20, 1996
5540785 Fabrication of defect free silicon on an insulating substrate Jul. 30, 1996
5532173 FET optical receiver using backside illumination, indium materials species Jul. 2, 1996
5514235 Method of making bonded wafers May. 7, 1996

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