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Class Information
Number: 148/DIG.12
Name: Metal treatment > Bonding e.g., electrostatic for strain gauges
Description:










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
7871898 Method for low temperature bonding and bonded structure Jan. 18, 2011
7807549 Method for low temperature bonding and bonded structure Oct. 5, 2010
7713839 Diamond substrate formation for electronic assemblies May. 11, 2010
7550052 Method of producing a complex structure by assembling stressed structures Jun. 23, 2009
7335572 Method for low temperature bonding and bonded structure Feb. 26, 2008
7049165 Method of manufacturing an external force detection sensor May. 23, 2006
7041178 Method for low temperature bonding and bonded structure May. 9, 2006
6984571 Three dimensional device integration method and integrated device Jan. 10, 2006
6969668 Treatment method of film quality for the manufacture of substrates Nov. 29, 2005
6936497 Method of forming electronic dies wherein each die has a layer of solid diamond Aug. 30, 2005
6902987 Method for low temperature bonding and bonded structure Jun. 7, 2005
6743662 Silicon-on-insulator wafer for RF integrated circuit Jun. 1, 2004
6429094 Treatment process for molecular bonding and unbonding of two structures Aug. 6, 2002
6323110 Structure and fabrication process of silicon on insulator wafer Nov. 27, 2001
6303468 Method for making a thin film of solid material Oct. 16, 2001
6235611 Method for making silicon-on-sapphire transducers May. 22, 2001
6191006 Method of bonding a III-V group compound semiconductor layer on a silicon substrate Feb. 20, 2001
6171965 Treatment method of cleaved film for the manufacture of substrates Jan. 9, 2001
6168965 Method for making backside illuminated image sensor Jan. 2, 2001
6030884 Method of bonding a III-V group compound semiconductor layer on a silicon substrate Feb. 29, 2000
6025060 Method and apparatus for composite gemstones Feb. 15, 2000
6010591 Method for the releasable bonding and subsequent separation of reversibly bonded and polished wafers and also a wafer structure and wafer Jan. 4, 2000
6004860 SOI substrate and a method for fabricating the same Dec. 21, 1999
5998281 SOI wafer and method for the preparation thereof Dec. 7, 1999
5994188 Method of fabricating a vertical power device with integrated control circuitry Nov. 30, 1999
5956577 Method of manufacturing serrated gate-type or joined structure Sep. 21, 1999
5937312 Single-etch stop process for the manufacture of silicon-on-insulator wafers Aug. 10, 1999
5932048 Method of fabricating direct-bonded semiconductor wafers Aug. 3, 1999
5895953 Ohmic contact to lightly doped islands from a conductive rapid diffusion buried layer Apr. 20, 1999
5891751 Hermetically sealed transducers and methods for producing the same Apr. 6, 1999
5866469 Method of anodic wafer bonding Feb. 2, 1999
5863832 Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system Jan. 26, 1999
5849627 Bonded wafer processing with oxidative bonding Dec. 15, 1998
5846638 Composite optical and electro-optical devices Dec. 8, 1998
5804494 Method of fabricating bonded wafer Sep. 8, 1998
5801084 Bonded wafer processing Sep. 1, 1998
5773355 Method for manufacturing semiconductor substrate Jun. 30, 1998
5769991 Method and apparatus for wafer bonding Jun. 23, 1998
5755914 Method for bonding semiconductor substrates May. 26, 1998
5728591 Process for manufacturing light valve device using semiconductive composite substrate Mar. 17, 1998
5710057 SOI fabrication method Jan. 20, 1998
5705421 A SOI substrate fabricating method Jan. 6, 1998
5702962 Fabrication process for a static induction transistor Dec. 30, 1997
5698471 Method of manufacturing a composite substrate and a piezoelectric device using the substrate Dec. 16, 1997
5693574 Process for the laminar joining of silicon semiconductor slices Dec. 2, 1997
5691231 Method of manufacturing silicon on insulating substrate Nov. 25, 1997
5688714 Method of fabricating a semiconductor device having a top layer and base layer joined by wafer bonding Nov. 18, 1997
5686319 Method for producing a diode Nov. 11, 1997
5683947 Method for producing a component according to the anodic bonding method and component Nov. 4, 1997
5681775 Soi fabrication process Oct. 28, 1997

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