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Class Information
Number: 148/DIG.12
Name: Metal treatment > Bonding e.g., electrostatic for strain gauges
Description:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7550052 |
Method of producing a complex structure by assembling stressed structures |
Jun. 23, 2009 |
| 7335572 |
Method for low temperature bonding and bonded structure |
Feb. 26, 2008 |
| 7049165 |
Method of manufacturing an external force detection sensor |
May. 23, 2006 |
| 7041178 |
Method for low temperature bonding and bonded structure |
May. 9, 2006 |
| 6984571 |
Three dimensional device integration method and integrated device |
Jan. 10, 2006 |
| 6969668 |
Treatment method of film quality for the manufacture of substrates |
Nov. 29, 2005 |
| 6936497 |
Method of forming electronic dies wherein each die has a layer of solid diamond |
Aug. 30, 2005 |
| 6902987 |
Method for low temperature bonding and bonded structure |
Jun. 7, 2005 |
| 6743662 |
Silicon-on-insulator wafer for RF integrated circuit |
Jun. 1, 2004 |
| 6429094 |
Treatment process for molecular bonding and unbonding of two structures |
Aug. 6, 2002 |
| 6323110 |
Structure and fabrication process of silicon on insulator wafer |
Nov. 27, 2001 |
| 6303468 |
Method for making a thin film of solid material |
Oct. 16, 2001 |
| 6235611 |
Method for making silicon-on-sapphire transducers |
May. 22, 2001 |
| 6191006 |
Method of bonding a III-V group compound semiconductor layer on a silicon substrate |
Feb. 20, 2001 |
| 6171965 |
Treatment method of cleaved film for the manufacture of substrates |
Jan. 9, 2001 |
| 6168965 |
Method for making backside illuminated image sensor |
Jan. 2, 2001 |
| 6030884 |
Method of bonding a III-V group compound semiconductor layer on a silicon substrate |
Feb. 29, 2000 |
| 6025060 |
Method and apparatus for composite gemstones |
Feb. 15, 2000 |
| 6010591 |
Method for the releasable bonding and subsequent separation of reversibly bonded and polished wafers and also a wafer structure and wafer |
Jan. 4, 2000 |
| 6004860 |
SOI substrate and a method for fabricating the same |
Dec. 21, 1999 |
| 5998281 |
SOI wafer and method for the preparation thereof |
Dec. 7, 1999 |
| 5994188 |
Method of fabricating a vertical power device with integrated control circuitry |
Nov. 30, 1999 |
| 5956577 |
Method of manufacturing serrated gate-type or joined structure |
Sep. 21, 1999 |
| 5937312 |
Single-etch stop process for the manufacture of silicon-on-insulator wafers |
Aug. 10, 1999 |
| 5932048 |
Method of fabricating direct-bonded semiconductor wafers |
Aug. 3, 1999 |
| 5895953 |
Ohmic contact to lightly doped islands from a conductive rapid diffusion buried layer |
Apr. 20, 1999 |
| 5891751 |
Hermetically sealed transducers and methods for producing the same |
Apr. 6, 1999 |
| 5866469 |
Method of anodic wafer bonding |
Feb. 2, 1999 |
| 5863832 |
Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system |
Jan. 26, 1999 |
| 5849627 |
Bonded wafer processing with oxidative bonding |
Dec. 15, 1998 |
| 5846638 |
Composite optical and electro-optical devices |
Dec. 8, 1998 |
| 5804494 |
Method of fabricating bonded wafer |
Sep. 8, 1998 |
| 5801084 |
Bonded wafer processing |
Sep. 1, 1998 |
| 5773355 |
Method for manufacturing semiconductor substrate |
Jun. 30, 1998 |
| 5769991 |
Method and apparatus for wafer bonding |
Jun. 23, 1998 |
| 5755914 |
Method for bonding semiconductor substrates |
May. 26, 1998 |
| 5728591 |
Process for manufacturing light valve device using semiconductive composite substrate |
Mar. 17, 1998 |
| 5710057 |
SOI fabrication method |
Jan. 20, 1998 |
| 5705421 |
A SOI substrate fabricating method |
Jan. 6, 1998 |
| 5702962 |
Fabrication process for a static induction transistor |
Dec. 30, 1997 |
| 5698471 |
Method of manufacturing a composite substrate and a piezoelectric device using the substrate |
Dec. 16, 1997 |
| 5693574 |
Process for the laminar joining of silicon semiconductor slices |
Dec. 2, 1997 |
| 5691231 |
Method of manufacturing silicon on insulating substrate |
Nov. 25, 1997 |
| 5688714 |
Method of fabricating a semiconductor device having a top layer and base layer joined by wafer bonding |
Nov. 18, 1997 |
| 5686319 |
Method for producing a diode |
Nov. 11, 1997 |
| 5683947 |
Method for producing a component according to the anodic bonding method and component |
Nov. 4, 1997 |
| 5681775 |
Soi fabrication process |
Oct. 28, 1997 |
| 5674758 |
Silicon on insulator achieved using electrochemical etching |
Oct. 7, 1997 |
| 5672518 |
Method of fabricating semiconductor device having stacked layered substrate |
Sep. 30, 1997 |
| 5668045 |
Process for stripping outer edge of BESOI wafers |
Sep. 16, 1997 |
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