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Class Information
Number: 140/105
Name: Wireworking > Crimping
Description: Forming crimps or kinks in wire or wire fabrics. This subclass includes all but the implements which are classified in the subclass immediately following.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7562550 |
Cable bulbing apparatus and method for forming bulbs in a cable bolt |
Jul. 21, 2009 |
| 7490502 |
Punch for cold forming operations |
Feb. 17, 2009 |
| 7247520 |
Microelectronic component assemblies and microelectronic component lead frame structures |
Jul. 24, 2007 |
| 7185414 |
Apparatus for forming wave windings for rotor and stator lamination packets of electrical machines |
Mar. 6, 2007 |
| 7162906 |
Method and apparatus for removing a carrier part from a carrier |
Jan. 16, 2007 |
| 7134311 |
Device and method for fabricating lead frame by press forming |
Nov. 14, 2006 |
| 7077170 |
Method of forming leads of a semiconductor device |
Jul. 18, 2006 |
| 6842977 |
Method of manufacturing metallic wire segment |
Jan. 18, 2005 |
| 6837710 |
Bent tip dental root canal implement and method thereof |
Jan. 4, 2005 |
| 6820657 |
Apparatus for the manufacture of rock bolts |
Nov. 23, 2004 |
| 6654658 |
System and method for conditioning leads |
Nov. 25, 2003 |
| 6640606 |
All-purpose pressing-bending machine |
Nov. 4, 2003 |
| 6619097 |
Machine for stamping, bending and/or mounting sheet metal parts |
Sep. 16, 2003 |
| 6532783 |
Clamping device, tool and method of mounting tools |
Mar. 18, 2003 |
| 6435222 |
Method and apparatus for manufacturing electronic parts |
Aug. 20, 2002 |
| 6412522 |
Bending die and bending machine using the same |
Jul. 2, 2002 |
| 6401765 |
Lead frame tooling design for exposed pad features |
Jun. 11, 2002 |
| 6363976 |
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
Apr. 2, 2002 |
| 6085804 |
Apparatus and method for forming leads and removing tin dust from leads |
Jul. 11, 2000 |
| 6035529 |
Header pin pre-loaded method |
Mar. 14, 2000 |
| 6016852 |
Leaded grid array IC package having coplanar bent leads for surface mount technology |
Jan. 25, 2000 |
| 6014993 |
Method and apparatus for configuring component leads |
Jan. 18, 2000 |
| 5979510 |
Forming tool and method |
Nov. 9, 1999 |
| 5950687 |
Lead forming apparatus and lead forming method |
Sep. 14, 1999 |
| 5878789 |
Mechanical press machine for forming semiconductor packages |
Mar. 9, 1999 |
| 5867893 |
Clinch assembly lift mechanism |
Feb. 9, 1999 |
| 5862838 |
Lead conditioning system |
Jan. 26, 1999 |
| 5860455 |
Lead bending machine for electronic components |
Jan. 19, 1999 |
| 5832963 |
Shaftless roller for lead forming apparatus |
Nov. 10, 1998 |
| 5826628 |
Form tooling and method of forming semiconductor package leads |
Oct. 27, 1998 |
| 5806571 |
Apparatus and method for forming the external leads of an integrated circuit |
Sep. 15, 1998 |
| 5777886 |
Programmable lead conditioner |
Jul. 7, 1998 |
| 5741260 |
Cable system for bone securance |
Apr. 21, 1998 |
| 5720747 |
Apparatus for crimping a surgical wire |
Feb. 24, 1998 |
| 5715872 |
Process and device for the shaping of leads of integrated circuits |
Feb. 10, 1998 |
| 5675884 |
Apparatus for multilayer conductor chip packaging |
Oct. 14, 1997 |
| 5673730 |
Form tooling and method of forming semiconductor package leads |
Oct. 7, 1997 |
| 5626169 |
Device for bending leads of a lead frame |
May. 6, 1997 |
| 5615571 |
Device for cambering conductive fingers on an integrated circuit |
Apr. 1, 1997 |
| 5582215 |
Ceramic die for cutting and shaping lead frames and method of cleaning the same |
Dec. 10, 1996 |
| 5570727 |
PLCC reforming and reconditioning system, method and apparatus |
Nov. 5, 1996 |
| 5535789 |
Lead wire forming apparatus capable of preventing the peeling of the solder from the lead wire |
Jul. 16, 1996 |
| 5487416 |
Lead conditioning system for semiconductor devices |
Jan. 30, 1996 |
| 5467803 |
Outer lead bending apparatus for a semiconductor package device having a package and outer leads extending from the package |
Nov. 21, 1995 |
| 5458158 |
Lead cutting apparatus and an anticorrosive coat structure of lead |
Oct. 17, 1995 |
| 5443101 |
Modular electromechanical press and method therefor |
Aug. 22, 1995 |
| 5431197 |
SOJ reforming and reconditioning method and apparatus |
Jul. 11, 1995 |
| 5396933 |
Package for a semiconductor device including a lead shaping assembly |
Mar. 14, 1995 |
| 5386620 |
Punching and shaping machine tool with cam gear |
Feb. 7, 1995 |
| 5375630 |
Process for forming lead frame of quad flat semiconductor package |
Dec. 27, 1994 |
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