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Class Information
Number: 125/13.02
Name: Stone working > Sawing > Rotary > Having internal cutting edge
Description: Subject matter including a rotary blade having an opening with a cutting edge on the internal edge of the opening, the workpiece being projected into the opening for cutting.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8701646 System and method for cutting ceramic ware Apr. 22, 2014
8607775 Cutting machine for stone materials Dec. 17, 2013
8469016 Rotary stone cutting method Jun. 25, 2013
8360047 Cutting machine for blocks of natural stone and similar into slabs with diamond wires Jan. 29, 2013
8353278 Rotary stone cutting tool Jan. 15, 2013
8235032 Apparatus for cutting and processing V-grooves Aug. 7, 2012
6907874 Concrete hole cutting machine Jun. 21, 2005
6883511 Portable stone cutter Apr. 26, 2005
6792934 V grooving machine for natural or engineered stone Sep. 21, 2004
6581586 Cutting machine Jun. 24, 2003
6442841 Device in connection with hand-operated working machine Sep. 3, 2002
6390889 Holding strip for a semiconductor ingot May. 21, 2002
6367467 Holding unit for semiconductor wafer sawing Apr. 9, 2002
6360737 Annular saw and method of protecting the clamping edge and of cleaning the saw blade of an annular saw Mar. 26, 2002
6318352 Dust and particle control attachment for a saw Nov. 20, 2001
6216682 Cutting apparatus Apr. 17, 2001
6142046 Knife projection sensing system Nov. 7, 2000
6021772 Bandsaw and process for cutting off slices from a workpiece Feb. 8, 2000
6006736 Method and apparatus for washing silicon ingot with water to remove particulate matter Dec. 28, 1999
5993292 Production of notchless wafer Nov. 30, 1999
5944007 Wire type slicing machine and method Aug. 31, 1999
5927263 Method for manufacturing completely circular semiconductor wafers Jul. 27, 1999
5902171 Method and apparatus for slicing a work May. 11, 1999
5836808 Slicing machine with built-in grinder Nov. 17, 1998
5832914 Ingot trimming method and apparatus Nov. 10, 1998
5827113 Cutting machine Oct. 27, 1998
5681204 Device for detecting a displacement of a blade member of a slicing apparatus Oct. 28, 1997
5667423 Method and apparatus for slicing workpiece Sep. 16, 1997
5642159 Method for tensioning ID saw blades and an apparatus for monitoring tensioning of an ID saw blades Jun. 24, 1997
5632666 Method and apparatus for automated quality control in wafer slicing May. 27, 1997
5628673 Dicing machine with non-contact setup function May. 13, 1997
5582536 Apparatus and method for manufacturing wafer Dec. 10, 1996
5524604 Method and apparatus for slicing semiconductor wafers Jun. 11, 1996
5484326 Semiconductor ingot machining method Jan. 16, 1996
5458526 Method of slicing a semiconductor wafer and an apparatus Oct. 17, 1995
5427644 Method of manufacturing semiconductor wafer and system therefor Jun. 27, 1995
5405285 Machining error correction apparatus Apr. 11, 1995
5383444 Slicing machine Jan. 24, 1995
5351444 Blade track control system Oct. 4, 1994
5351446 Method and apparatus for the rotary sawing of brittle and hard materials Oct. 4, 1994
5329733 Wafer slicing and grinding machine and a method of slicing and grinding wafers Jul. 19, 1994
5313741 Method of and an apparatus for slicing a single crystal ingot using an ID saw slicing machine therein May. 24, 1994
5303687 Blade mount for an inner diameter saw blade Apr. 19, 1994
5287843 Slicing machine employing an axial force to provide rigidity to a rotary blade Feb. 22, 1994
5285597 Method and arrangement for subdividing semiconductor bars into semiconductor wafers Feb. 15, 1994
5235960 Clamping system for an annular-saw blade and its use in the sawing of bars, in particular of semiconductor material, into wafers Aug. 17, 1993
5226403 Method of using an ID saw slicing machine for slicing a single crystal ingot and an apparatus for carrying out the method Jul. 13, 1993
5218947 Annular cutting disc Jun. 15, 1993
5185956 Wafer slicing and grinding system Feb. 16, 1993
5174270 Slicing machine and a slicing method by the same Dec. 29, 1992

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