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Class Information
Number: 106/1.22
Name: Compositions: coating or plastic > Coating or plastic compositions > Metal-depositing composition or substrate-sensitizing compositions for metal-depositing compositions > Metal-depositing composition contains mixtures of metal compounds other than solely as group ia metal compounds, e.g., electroless
Description: Subject matter wherein the metal-depositing composition contains mixtures of metal compounds and wherein at least two metal compounds contain metal atoms other than Group IA metal compounds generally used in the electroless metal deposition process.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7204871 |
Metal plating process |
Apr. 17, 2007 |
| 7189341 |
Electrochemical sensor ink compositions, electrodes, and uses thereof |
Mar. 13, 2007 |
| 7087104 |
Preparation of electroless deposition solutions |
Aug. 8, 2006 |
| 6936302 |
Electroless Ni-B plating liquid, electronic device and method for manufacturing the same |
Aug. 30, 2005 |
| 6911067 |
Solution composition and method for electroless deposition of coatings free of alkali metals |
Jun. 28, 2005 |
| 6908504 |
Electroless plating bath composition and method of using |
Jun. 21, 2005 |
| 6902605 |
Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper |
Jun. 7, 2005 |
| 6860925 |
Printed circuit board manufacture |
Mar. 1, 2005 |
| 6837980 |
Bond enhancement antitarnish coatings |
Jan. 4, 2005 |
| 6837923 |
Polytetrafluoroethylene dispersion for electroless nickel plating applications |
Jan. 4, 2005 |
| 6824597 |
Stabilizers for electroless plating solutions and methods of use thereof |
Nov. 30, 2004 |
| 6821324 |
Cobalt tungsten phosphorus electroless deposition process and materials |
Nov. 23, 2004 |
| 6818313 |
Corrosion-inhibiting coating |
Nov. 16, 2004 |
| 6800121 |
Electroless nickel plating solutions |
Oct. 5, 2004 |
| 6782650 |
Nodular nickel boron coating |
Aug. 31, 2004 |
| 6776826 |
Composition and method for electroless plating of non-conductive substrates |
Aug. 17, 2004 |
| 6733679 |
Method of treating an electroless plating waste |
May. 11, 2004 |
| 6726827 |
Electroplating solution for high speed plating of tin-bismuth solder |
Apr. 27, 2004 |
| 6620304 |
Bath system for galvanic deposition of metals |
Sep. 16, 2003 |
| 6596888 |
MOCVD of WNx thin films using imido precursors |
Jul. 22, 2003 |
| 6527843 |
Fine colored particles and ink jet ink |
Mar. 4, 2003 |
| 6464762 |
Aqueous solution for the formation of an indium oxide film by electroless deposition |
Oct. 15, 2002 |
| 6399208 |
Source reagent composition and method for chemical vapor deposition formation or ZR/HF silicate gate dielectric thin films |
Jun. 4, 2002 |
| 6331201 |
Bismuth coating protection for copper |
Dec. 18, 2001 |
| 6319308 |
Coating compositions containing nickel and boron and particles |
Nov. 20, 2001 |
| 6290088 |
Corrosion resistant gas cylinder and gas delivery system |
Sep. 18, 2001 |
| 6277180 |
Method of replacing evaporation losses from colloidal catalyst baths |
Aug. 21, 2001 |
| 6273943 |
Electroless composite Plating Solution and Electroless composite plating method |
Aug. 14, 2001 |
| 6235093 |
Aqueous solutions for obtaining noble metals by chemical reductive deposition |
May. 22, 2001 |
| 6183545 |
Aqueous solutions for obtaining metals by reductive deposition |
Feb. 6, 2001 |
| 6183546 |
Coating compositions containing nickel and boron |
Feb. 6, 2001 |
| 6174353 |
Pretreating solution for electroless plating, electroless plating bath and electroless plating process |
Jan. 16, 2001 |
| 6143059 |
Self-catalytic bath and method for the deposition of a nickel-phosphorus alloy on a substrate |
Nov. 7, 2000 |
| 6113771 |
Electro deposition chemistry |
Sep. 5, 2000 |
| 6090493 |
Bismuth coating protection for copper |
Jul. 18, 2000 |
| 6086790 |
Transparent conductive film and composition for forming same |
Jul. 11, 2000 |
| 6063172 |
Aqueous immersion plating bath and method for plating |
May. 16, 2000 |
| 6048585 |
Removal of orthophosphite ions from electroless nickel plating baths |
Apr. 11, 2000 |
| 6045604 |
Autocatalytic chemical deposition of zinc tin alloy |
Apr. 4, 2000 |
| 6037485 |
CVD precursors and film preparation method using the same |
Mar. 14, 2000 |
| 5944879 |
Nickel hypophosphite solutions containing increased nickel concentration |
Aug. 31, 1999 |
| 5910340 |
Electroless nickel plating solution and method |
Jun. 8, 1999 |
| 5858073 |
Method of treating electroless plating bath |
Jan. 12, 1999 |
| 5810913 |
Activating catalytic solution for electroless plating and method of electroless plating |
Sep. 22, 1998 |
| 5798060 |
Static-dissipative polymeric composition |
Aug. 25, 1998 |
| 5755859 |
Cobalt-tin alloys and their applications for devices, chip interconnections and packaging |
May. 26, 1998 |
| 5718745 |
Electroless plating bath for forming black coatings and process for forming the coatings |
Feb. 17, 1998 |
| 5716553 |
Polytype electroconductive powders |
Feb. 10, 1998 |
| 5705099 |
Resistive material composition, resistive paste, and resistor |
Jan. 6, 1998 |
| 5631091 |
Bismuth coating protection for copper |
May. 20, 1997 |
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