Resources Contact Us Home
Browse by Category: Main > Firearms & Weapons
Class Information
Number: 102/397
Name: Ammunition and explosives > Drop bombs > Igniting means > With target contact anticipator
Description: Subject matter including means which projects a distance for the bomb so that when it contacts a target the firing means will actuate before the bomb comes into contact with the target.

Patents under this class:

Patent Number Title Of Patent Date Issued
6378435 Variable target transition detection capability and method therefor Apr. 30, 2002
5515786 Projectiles for attacking hard targets and method for controlling initiation of a projectile May. 14, 1996
4825766 Fuzing arrangements May. 2, 1989
4803928 Tandem charge projectile Feb. 14, 1989
4750426 Submunition Jun. 14, 1988
4669386 Spreadable telescopic head for appliances, projectiles, bombs or missiles Jun. 2, 1987
4640194 Airborne arrangement for producing a projectile Feb. 3, 1987
4567829 Shaped charge projectile system Feb. 4, 1986
4367680 Standoff munition Jan. 11, 1983
4175491 Warhead and anti-tank missile construction Nov. 27, 1979

  Recently Added Patents
Myoglobin blooming agents, films, packages and methods for packaging
Hand-held optical probe based imaging system with 3D tracking facilities
Switch redundancy in systems with dual-star backplanes
Liquid composite compositions using non-volatile liquids and nanoparticles and uses thereof
Hybrid coatings and associated methods of application
Chemical method of making a suspension, emulsion or dispersion of pyrithione particles
Stretchable elastic laminate having increased CD elongation zones and method of production
  Randomly Featured Patents
Data management system including user-independent generic database
BiCMOS ECL-to-CMOS conversion circuit
Apparatus for obtaining improved dental castings
Thermoplastic polyesters with improved shock-proof properties and impact modifying composition
Magnetic media with embedded optical servo tracks
Servo data driven motor speed control
Method of transporting a semiconductor wafer in a wafer polishing system
Method and software system for modularizing software components for business transaction applications
Debonder and softener compositions
Digital offset printing media