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iFire Technologies, Inc. Patents |
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Assignee: iFire Technologies, Inc.
Address: Austin, TX
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7118992 |
Wafer thinning using magnetic mirror plasma |
October 10, 2006 |
| A method for manufacturing integrated circuits uses an atmospheric magnetic mirror plasma etching apparatus to thin a semiconductor wafer. In addition the process may, while thinning, both segregate and expose through-die vias for an integrated circuit chip. To segregate, the wafer m |
| 6794272 |
Wafer thinning using magnetic mirror plasma |
September 21, 2004 |
| A method for manufacturing integrated circuits uses an atmospheric magnetic mirror plasma etching apparatus to thin a semiconductor wafer. In addition the process may, while thinning, both segregate and expose through-die vias for an integrated circuit chip. To segregate, the wafer may b |
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