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Y.K.C. Co., Ltd. Patents |
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Assignee: Y.K.C. Co., Ltd.
Address: Tokyo, JP
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5358017 |
Method, system and apparatus for forming leads for semiconductors packages |
October 25, 1994 |
| A forming apparatus for bending the leads of a semiconductor package including a body portion, and a plurality of leads extending from the sides of the body portion to a predetermined configuration. The forming die includes a series of walls arranged in a predetermined pattern having |
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