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Y.K.C. Co., Ltd. Patents
Assignee:
Y.K.C. Co., Ltd.
Address:
Tokyo, JP
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
5358017 Method, system and apparatus for forming leads for semiconductors packages October 25, 1994
A forming apparatus for bending the leads of a semiconductor package including a body portion, and a plurality of leads extending from the sides of the body portion to a predetermined configuration. The forming die includes a series of walls arranged in a predetermined pattern having

 
 
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