| Patent Number |
Title Of Patent |
Date Issued |
| RE30399 |
Method for soldering, fusing or brazing |
September 9, 1980 |
| .[.Article.]. .Iadd.An article .Iaddend.to be soldered, fused or brazed is placed in hot saturated vapors generated by continuously boiling .Iadd.a .Iaddend.heat transfer liquid having selected properties including .Iadd.a .Iaddend.boiling point at least equal to, and preferably above, . |
| RE29593 |
Production of multiple elongated products such as wire |
March 28, 1978 |
| A bundle of hexagonal billets, each billet being coated with a shear transmitting medium, is extruded through one form of die having a plurality of hexagonal die apertures, to produce simultaneously a plurality of individual hexagonal wires. The bundle may be extruded through another |
| RE28798 |
Methods of and apparatus for aligning and bonding workpieces |
May 4, 1976 |
| Bonding machines have transparent elements on their bonding axes. Magnified optical means are positioned to view bonding tips and integrated-circuit chips simultaneously through the transparent elements thereby facilitating alignment of the chips to the tips. In one embodiment a bonding |
| D273637 |
Acoustic telephone enclosure and canopy therefor |
May 1, 1984 |
|
| 4445360 |
Method for ultrasonically determining characteristics of a body |
May 1, 1984 |
| An ultrasonic technique for remotely inspecting a body is described. A transducer (14), capable of generating and detecting ultrasonic signals, is coupled to the body. An ultrasonic signal (A.sub.o) is launched by the transducer (14) into the body (e.g. 10, 11) and is reflected by any |
| 4444848 |
Adherent metal coatings on rubber-modified epoxy resin surfaces |
April 24, 1984 |
| A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from t |
| 4439918 |
Methods of packaging an electronic device |
April 3, 1984 |
| An electronic device assembly (11) includes a heat dissipating substrate (18) having a seat (16). A device (14) is uniformly spaced from a base surface of the seat (16), and a layer of solder of uniform thickness occupies a gap between the surface of the seat and the device. Leads (31) |
| 4439632 |
Bonded sheath cable |
March 27, 1984 |
| A cable which is capable of being made in a large pair size and yet which has excellent mechanical properties that maintain its integrity notwithstanding extremes in temperature during installation and shipping as well as during the rigors of installation includes a sheath system hav |
| 4437605 |
Methods of and apparatus for pumping solder |
March 20, 1984 |
| The formation of dross in a molten solder bath (28) by surface agitation of the bath, and the adverse effects of dross on a solder pumping operation, are essentially eliminated by suspending a pump shaft (36) and an impeller (38) thereon for free rotation within a housing (96) in the mol |
| 4437362 |
Tools for handling magnetic articles |
March 20, 1984 |
| A tool (10) for handling a magnetic article (50) includes a member (12) having a jaw (18) which is movable toward and away from a member (14) having a corresponding jaw (14). A holder (34) is associated with jaw (20) of member (14) for releasably holding an article (50) in cooperation wi |
| 4437148 |
Peak voltage clamped power supply |
March 13, 1984 |
| The cost and energy efficiency of a power supply are optimized in a semi-regulated circuit wherein regulation occurs only under a high voltage, low current condition when peak output voltage would otherwise exceed a maximum specified voltage. The circuit includes a full wave rectifie |
| 4436474 |
Selecting articles from an array thereof |
March 13, 1984 |
| An assembly is provided for selecting at least one vertically oriented planate article such as a disc-shaped wafer (10) from an array of such wafers. A carrier (20) holds the wafers (10) in a mutually spaced, substantially parallel relationship along a single horizontal file. Periphe |
| 4435258 |
Method and apparatus for the recovery of palladium from spent electroless catalytic baths |
March 6, 1984 |
| A method is described for recovering palladium from spent catalytic colloidal palladium baths by dissolving the palladium to form a true solution followed by electrodeposition employing a nickel anode and a nickel or copper cathode. |
| 4435199 |
Exhaust system for a vapor deposition chamber |
March 6, 1984 |
| An exhaust system (3) for a vapor-phase axial deposition (VAD) system (5) is comprised of the serial combination of an exhaust tube (26), an outlet pipe (27), a soot collection chamber (32) and a discharge line (34). The exhaust tube (26) has a constricted central portion (48) and a flar |
| 4434012 |
Treating articles in an array with streams of a medium |
February 28, 1984 |
| Articles such as substantially flat, electronic chips (10) are positioned in an array with surfaces (11) to be treated facing upward along a succession of specially selected tiers. Such tiers may preferably be horizontal rows (20-24) of top rims (19) of vertical suction tubes (18). A |
| 4433970 |
Method of heating a lightguide preform |
February 28, 1984 |
| This disclosure is directed to an oxy-hydrogen torch (10) comprised of a nozzle plate (16) captured between first and second outer members (12 and 14). Each outer member has a plenum (18) which open towards, and is separated by, the plate (16). The nozzle plate (16) has a plurality of |
| 4429298 |
Methods of trimming film resistors |
January 31, 1984 |
| A bar-type film resistor (40) is adjusted to a high degree of precision by longitudinally offset plunge cuts (41, 42 and 43) extending from alternately opposite edges (29, 49) into the resistive layer (13), by a trim cut (46) which extends from the most recently made plunge cut (43) |
| 4428815 |
Vacuum-type article holder and methods of supportively retaining articles |
January 31, 1984 |
| A vacuum-type holder (10) for retaining fragile articles such as semiconductor wafers (16) during a manufacturing operation, such as an electrolytic treatment includes a vacuum-operated support (36) at each of the seats (23) which exerts a supporting force against the underside (32) |
| 4427469 |
Methods of and apparatus for controlling plastic-to-conductor adhesion of plastic-insulated, tin |
January 24, 1984 |
| A tinned conductor is advanced through each of a plurality of successively smaller die openings in a drawing apparatus to reduce the diameter of the tinned conductor after which it is annealed. After the tinned conductor has been annealed, it is moved through the opening of a die which i |
| 4425074 |
Methods of and apparatus for transferring articles |
January 10, 1984 |
| Articles (18) are transferred from a first position, such as a feed track (37) on which they are located closely spaced, to a second position such as a heat seal apparatus. At the heat seal apparatus the spacing of the articles is to coincide with the spacing of frame members (32) to whi |
| 4424899 |
Instrument carrying case |
January 10, 1984 |
| The invention is for an instrument carrying case comprising an open-topped box, a lid having a substantially planar panel for covering the top of the box, and a flexible hinge joining the rear edge of the lid to the top edge of the rear wall of the box such that the lid is movable throug |
| 4424096 |
R-F Electrode type workholder and methods of supporting workpieces during R-F powered reactive t |
January 3, 1984 |
| Workpieces (11), such as semiconductor wafers, are treated in a plasma reaction apparatus (10). The wafers are loaded onto a workholder (18), where they become seated in contact with facing surfaces of a plurality of spaced, parallel plates (19, 21). Plasma is generated in each of the |
| 4422652 |
Releasably retaining articles for rotation thereof |
December 27, 1983 |
| Apparatus is provided for releasably retaining an article such as an optical cable (10) for rotation of the article. A chuck body (31) is provided along with components (24, 26 and 46-48) for rotating the body (31) and the cable (10) about a common central axis (33). A jaw (34) is af |
| 4421814 |
Strippable resists |
December 20, 1983 |
| A printed circuit board is formed from a metal-clad substrate by applying a solvent-free, non-dryable ink in a predetermined pattern on the substrate, dusting powdered resin over the surface, removing any resin powder not retained by the ink from the surface, heating the substrate having |
| 4419562 |
Nondestructive real-time method for monitoring the quality of a weld |
December 6, 1983 |
| Herein disclosed is a noncontact, nondestructive method for monitoring the quality of a high energy weld, e.g., laser beam weld. In accordance with the proposed method, an acoustic sensor (32) is positioned at a distance from the welding zone (34) and picks up airborne acoustic emission |
| 4417692 |
Vapor-phase axial deposition torch |
November 29, 1983 |
| A reactant deposition torch (10) has a plurality of concentric glass tubes (16, 18, 20, 24 and 26). Various gases pass through the tubes (18, 20, 24 and 26) while particle producing reactants pass through the inner tube (16). The concentricity of the tubes is accurately maintained by a |
| 4417478 |
Method for determining lead frame failure modes using acoustic emission and discriminant analysi |
November 29, 1983 |
| An automatic pull tester and an acoustic emission system are herein combined to analyze the failure modes of lead frames bonded to integrated circuits. By using a discriminant analysis technique, a specific failure mode can be determined in real-time by first measuring up to five var |
| 4412642 |
Cast solder leads for leadless semiconductor circuits |
November 1, 1983 |
| The attachment of leadless chip carriers to printed wiring boards by means of soldering techniques must provide for a spacing between the chip carrier and the board. Such spacing is required for cleaning the area under the chip carrier, protecting the underlying circuitry, and accoun |
| 4412502 |
Apparatus for the elimination of edge growth in liquid phase epitaxy |
November 1, 1983 |
| An apparatus for substantially eliminating excessive edge growth in liquid phase epitaxy utilizing a substrate carrier 11 and a source material carrier 13 slidable over the substrate carrier 11 including a well 24 around a recess 14 in the substrate carrier 11 wherein the substrate 16 is |
| 4411060 |
Method of manufacturing dielectrically-isolated single-crystal semiconductor substrates |
October 25, 1983 |
| In the manufacture of integrated circuits, it is often necessary to prepare dielectrically-isolated single-crystal silicon regions to be used as substrates in which various circuit elements may be formed. These regions or substrates are formed by attaching a single-crystal silicon wafer |
| 4409263 |
Methods of and apparatus for coating lightguide fiber |
October 11, 1983 |
| A coating material is applied to drawn lightguide fiber in a manner which substantially prevents the inclusion of bubbles and which causes the fiber to be disposed substantially concentrically within the coating layer. The lightguide fiber is advanced through a continuum of coating mater |
| 4402998 |
Method for providing an adherent electroless metal coating on an epoxy surface |
September 6, 1983 |
| A method of electrolessly plating a substrate having a rubber-modified epoxy surface includes the steps of preheating the substrate and while still warm, sputter etching at least 50A. from its surface. The substrate is then vacuum metalized with an adhesion promoting metal film, coated |
| 4397385 |
Centering articles |
August 9, 1983 |
| Articles (12) are loaded onto a movable article holder such as pedestals (18) mounted to a rotary table (20). The table is indexed to advance the articles (12) first to a centering station (41) and then to a work station (49) which may be, for example, a lead frame bonder. At the centeri |
| 4395219 |
Apparatus for forming compactible material into a body |
July 26, 1983 |
| In the growth of gadolinium gallium garnet monocrystals, a crucible is charged with a preformed body (65) of oxide powders to form a melt. In preparation therefor, the oxide powders are formulated into a typical particulate material (16) which is compacted into a body (65) having a d |
| 4394602 |
Enclosed electrical devices |
July 19, 1983 |
| An enclosed electrical device (42) includes an electrical circuit (50) having elements (48-68) which lie substantially in and along a plane (115). A member (70) is applied to a one side and a member (85) is applied to another side of the circuit (50) for at least partially enclosing the |
| 4391516 |
Method of determining an index of refraction profile of an optical fiber |
July 5, 1983 |
| A method is disclosed for determining the index of refraction profile of a stepped or graded index type optical fiber having a core encased within a surrounding cladding. An interferogram is formed with a beam of radiant energy passed transversely through the optical fiber. Fringe line s |
| 4389229 |
Methods and apparatus for fabricating a lightguide preform |
June 21, 1983 |
| Undeposited reactants (i.e., soot) passing through a glass substrate tube (12), during the fabrication of a lightguide perform by the Modified Chemical Vapor Deposition (MCVD) process, flow into a reactant exhaust system (50) and are carried therethrough by a uniformly flowing reacta |
| 4384893 |
Method of forming a tin-cuprous colloidal wetting sensitizer |
May 24, 1983 |
| A method of forming a colloidal wetting sensitizer is disclosed. The method comprises combining a stannous species and a cupric species in an aqueous medium maintained at a pH of between 0.4 and 1.5. |
| 4383357 |
Methods of aligning paramagnetic articles |
May 17, 1983 |
| Paramagnetic articles such as a stem (14) and an armature (17) are placed into mutual coextensive alignment with a gap (19) of a predetermined width between adjacent portions of such articles. To repetitively establish the predetermined gap between successive groups of such articles, a f |
| 4382456 |
Wrapping of insulated wire |
May 10, 1983 |
| A wire wrapping tool (10) includes a gun (20), a bit (24) for cutting, stripping and wrapping a wire (21), a sleeve (25) for receiving the bit and a wire softening device (26). The device (26) includes a pair of opposed rollers (28,30) for softening the wire (21) pulled therethrough. |
| 4381951 |
Method of removing contaminants from a surface |
May 3, 1983 |
| A method of removing contaminants from the surface is disclosed. The method comprises coating the surface with a surface active agent having a first surface energy and into which the contaminants are combined, applying thereover a higher surface energy colloidal sol and then allowing |
| 4378296 |
Flux filter |
March 29, 1983 |
| A filter (21) for removing flux from a hot heat transfer liquid-flux mixture. The heat transfers liquid-flux mixture is directed into a chamber (41) having a plurality of spaced, hollow members (64--64) through which a coolant passes. Upon being cooled the flux deposits on the surface of |
| 4377943 |
Extrusion die |
March 29, 1983 |
| A hydrostatic extrusion die includes a nose-cone section (21) of a high toughness tool steel and a mating rear section (22) of a high compressive strength material such as carbide. During extrusion, inwardly directed radial forces (F.sub.r ') are developed in the rear section which exact |
| 4377626 |
Breakaway registration pins |
March 22, 1983 |
| A breakaway registration pin (11, FIG. 2) comprises two sections, a first section (21) embedded in a glass art master (10) and a second section (22) bonded by a bonding agent to a top face (33) of the embedded first section (21). The bonding agent has a strength substantially less than t |
| 4376505 |
Methods for applying solder to an article |
March 15, 1983 |
| A thick solder blob (56) is bonded to a land area 34 on a metallized substrate (31) by (a) depositing a thick layer of solder paste on the land area; (b) confining the solder paste with a hard material; and (c) reflowing the solder paste to bond the solder blob (56) to the land area |
| 4376017 |
Methods of electrolytically treating portions of digitated strips and treating cell |
March 8, 1983 |
| A pair of opposite surfaces (17 and 18) of shaped, digitated edge features (12) of a metal strip (11) are selectively treated in an electrolytic treating cell (32) while adjacent edge surfaces (22 and 23) of such features are shielded from exposure to the treatment. The desired treat |
| 4373658 |
High pressure condensation soldering, fusing or brazing |
February 15, 1983 |
| A high pressure steam condensation soldering facility (10) is described. The facility (10) incorporates a chamber (12) having a centrally located heat processing zone (45) into which high pressure steam is injected to reflow solder on articles (43) therein. A baffle (41) having a conical |
| 4370294 |
Compacting particulate material into a body |
January 25, 1983 |
| In the growth of gadolinium gallium garnet monocrystals, a crucible is charged with a preformed body (65) of oxide powders to form a melt. In preparation therefor, the oxide powders are formulated into a typical particulate material (16) which is compacted into a body (65) having a d |
| 4363449 |
Process for reclaiming jelly-filled telecommunication cables |
December 14, 1982 |
| A process is disclosed for reclaiming a jelly-filled telecommunication cable. The process comprises the steps of cutting the cable into segments of jelly bearing insulated wires and forming the segments into a slurry heated to a temperature sufficient to soften the jelly. The slurry is |
| 4361749 |
Uniformly cooled plasma etching electrode |
November 30, 1982 |
| A planar electrode (17) having a plurality of concentric channels (34-34) therein through which coolant fluid passes to cool the electrode during a plasma etching process. The coolant is directed through at least two of the adjacent channels in opposite directions with the inputs (31) an |
