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Wavezero, Inc. Patents
Assignee:
Wavezero, Inc.
Address:
Sunnyvale, CA
No. of patents:
12
Patents:












Patent Number Title Of Patent Date Issued
7488901 EMI absorbing shielding for a printed circuit board February 10, 2009
The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.
7443693 Electromagnetic interference shielding for a printed circuit board October 28, 2008
The present invention provides shielded printed circuit boards and electronic devices. The printed circuit board may comprise an internal network of grounded conductive elements that are coupleable to an EMI shield that is mounted on the printed circuit board. The network of grounded
7414197 Electromagnetic interference shielding of electrical cables and connectors August 19, 2008
A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.
7374102 Radiofrequency antennae and identification tags and methods of manufacturing radiofrequency ante May 20, 2008
The present invention includes improved RFID antennae and tags and methods of manufacturing the RFID antennas. The RFID tags of the present invention include a substrate that comprises an antenna assembly. A radiofrequency integrated circuit is in electrical communication with a port
7358447 Electromagnetic interference shields for electronic devices April 15, 2008
An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.
7259969 Methods and devices for connecting and grounding an EMI shield to a printed circuit board August 21, 2007
The present invention provides electronic devices, kits, and connector assemblies for coupling an EMI shield to a ground trace. In one embodiment, the present invention provides an electronic device comprising a printed circuit board and an EMI shield that has a flange around at leas
7129422 EMI absorbing shielding for a printed circuit board October 31, 2006
The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.
7109410 EMI shielding for electronic component packaging September 19, 2006
The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully
7102082 Electromagnetic interference shielding of electrical cables and connectors September 5, 2006
A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over t
6909615 Equipment and methods for producing continuous metallized thermoformable EMI shielding material June 21, 2005
The present invention provides in-line equipment and methods for manufacturing an EMI/RFI shield that is integrated formed in a formable sheet. The EMI/RFI shield may comprise a shaped thermoform shell that has one or more conductive layers applied to one or more surfaces. The EMI/RFI
6833031 Method and device for coating a substrate December 21, 2004
Apparatus and methods for coating a substrate. In an exemplary embodiment, the apparatus are used to create a metallized substrate for use as an EMI/RFI shield. The apparatus typically includes a movable processing apparatus that is movable orthogonal to the substrate to treat the su
6768654 Multi-layered structures and methods for manufacturing the multi-layered structures July 27, 2004
Multi-layered molds and methods for manufacturing multi-layered molds. A metallized layer can be deposited on at least one side of a substrate. The substrate can be shaped and then the metal layer can be deposited onto the shaped substrate. Optionally, an injection molded resin can be de

 
 
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