| Patent Number |
Title Of Patent |
Date Issued |
| 5874678 |
Wire breaking detection equipment for wire saw |
February 23, 1999 |
| A contact detecting bar is placed in a proximity to a wire wound on grooved rollers so that the broken wire can come into contact with the contact detecting bar. By detecting the contact between the broken wire and the contact detecting bar, the breaking of the wire can be detected. The |
| 5857454 |
Wire saw and method of slicing ingot by wire saw |
January 12, 1999 |
| An ingot mounting block consists of an attachment block, a horizontal rocking block and a vertical rocking block. The horizontal rocking block is provided in such a manner to rock horizontally with regard to the attachment block. The vertical rocking block is provided in such a manner |
| 5853533 |
Wafer slice base peeling system |
December 29, 1998 |
| The hot water is stored in the hot-water tank and kept at the predetermined temperature. The clamp base is provided in the hot water of the hot-water tank for receiving the substrate portion of the wafer and the lifter is arranged for moving the wafer from the upper part of the hot-water |
| 5849147 |
Wafer slice base peeling system |
December 15, 1998 |
| The hot water is stored in the hot-water tank and kept at the predetermined temperature. The clamp base is provided in the hot water of the hot-water tank for receiving the substrate portion of the wafer and the lifter is arranged for moving the wafer from the upper part of the hot-water |
| 5842461 |
Dicing machine |
December 1, 1998 |
| A dicing machine of the present invention is provided with two spindles, which are arranged parallel to one another in the direction of the Y-axis and face one another. A workpiece is moved toward the spindles in the direction of the X-axis, and two blades fitted to the two spindles cut |
| 5836808 |
Slicing machine with built-in grinder |
November 17, 1998 |
| The rotational center of a grinding wheel is eccentric to a slicing side in a slice feed direction with regard to the rotational center of an inner diameter saw. As a result, the diameter of the grinding wheel can be smaller, and the slice movement distance of the ingot can be shorter. |
| 5816895 |
Surface grinding method and apparatus |
October 6, 1998 |
| A semiconductor wafer is placed on a table, and a grinding wheel grinds the surface of the semiconductor wafer. Non-contact sensors are arranged above the semiconductor wafer to detect the thickness of the semiconductor wafer during grinding. Each piece of information relating to the thi |
| 5809986 |
Wire derailment detecting apparatus for wire saw |
September 22, 1998 |
| A microswitch is provided near each end of each grooved roller. The microswitch has a rod-shaped contact shoe, and is operated if a wire derailed from the grooved roller contacts the contact shoe. An operational signal is sent from the microswitch to a control apparatus, and the cont |
| 5791976 |
Surface machining method and apparatus |
August 11, 1998 |
| A wafer is rotated on its axis, which is biased with regard to an axis of a grinding wheel, and revolves around an axis which is biased with regard to the axis of the wafer and the axis of the grinding wheel. In this state, the grinding wheel is abutted against the surface of the wafer. |
| 5778751 |
Mounting structure for cutting blade of dicing apparatus |
July 14, 1998 |
| A blade mounting structure in which a mounted blade is rotated in a well-balanced condition and further the blade can be easily attached to and detached from the apparatus is provided, which structure comprises a mount including a flange and a first cylindrical engagement portion and a |
| 5769695 |
Chamfer grinding system for wafer |
June 23, 1998 |
| Picking up means pick up a wafer from a first cassette one by one and carry the wafer to a pre-processing means. The wafer is picked up from the pre-processing means after the measuring and deciding the position has been completed in the pre-processing means. First carrying means receive |
| 5759344 |
Wafer slicer base peeling system |
June 2, 1998 |
| The hot water is stored in the hot-water tank and kept at the predetermined temperature. The clamp base is provided in the hot water of the hot-water tank for receiving the substrate portion of the wafer and the lifter is arranged for moving the wafer from the upper part of the hot-water |
| 5694050 |
Multiprobing semiconductor test method for testing a plurality of chips simultaneously |
December 2, 1997 |
| The purpose of the test method is to improve test efficiency in a semiconductor test method utilizing multiprobing. The semiconductor test method involves placing probes into contact with the electrode pads of semiconductor chips on a semiconductor wafer with a test head providing an |
| 5673405 |
Icon relocation system and method thereof |
September 30, 1997 |
| An icon relocation system and a method relocating method applied to a three-dimensional coordinates measuring machine having measurement programs for performing various measurements and measuring based on a specified measurement program. The icon menu table indicating the various mea |
| 5658189 |
Grinding apparatus for wafer edge |
August 19, 1997 |
| A slide table is slidably supported on the slide stage which is moved by a guide screw. The slide table is connected with the slide stage by means of pressurization means. A rotatable wafer table is provided on the slide table. A grinding wheel for chamfering is used. The pressurization |
| 5628301 |
Wire traverse apparatus of wire saw |
May 13, 1997 |
| A wire is put on a guide roller, which guides the wire in a direction of a wire reel's axis. A wire load, which changes according to the displacement of the supply angle of the wire on the guide roller, is detected sequentially. Then, the guiding speed of the guide roller is sequentially |
| 5621313 |
Wafer probing system and method that stores reference pattern and movement value data for differ |
April 15, 1997 |
| A method for aligning a wafer probing system includes securing a wafer to a movable table; moving the table a predetermined reference position below an image sensing device for sensing a wafer circuit pattern of the wafer; transmitting the sensed wafer circuit pattern to an alignment adj |
| 5609514 |
Wafer chamfering machine |
March 11, 1997 |
| There is provided a wafer chamfering machine, wherein chamfering of a notch of a wafer can be accurately performed the space of the wafer chamfering machine is compact size, the costs are reduced and the time required for chamfering is shorten. In a wafer chamfering machine, wherein a ro |
| 5582536 |
Apparatus and method for manufacturing wafer |
December 10, 1996 |
| It is an object of the present invention to provide an apparatus and a method for manufacturing a wafer, which are the most suitable for meeting the requirement for the mirror grinding surface of the wafer's chamfering portion. As a result, when the ingot is sliced, a wafer being sliced |
| 5568056 |
Wafer prober |
October 22, 1996 |
| A test head is rotatably supported by a main body of device. This test head is rotatable between an inspecting position electrically connected to a probe card and a retracted position being retracted from the inspecting position. The test head is connected thereto with a cylinder for wei |
| 5555091 |
Wafer diameter/sectional shape measuring machine |
September 10, 1996 |
| The present invention relates to a wafer diameter/sectional shape measuring machine in which the diameter and the sectional shape of the wafer can be measured together. The diameter/sectional shape measuring machine is arranged in the wafer chamfering machine so that the chamfering condi |
| 5524604 |
Method and apparatus for slicing semiconductor wafers |
June 11, 1996 |
| A method and apparatus for slicing semiconductor wafers. An inner peripheral cutting edge has a doughnut-shaped blade with electro-deposited diamond grains. The blade is attached to a moving trestle. The moving trestle moves along rails located on both sides of the inner peripheral c |
| 5501104 |
Method of measuring the depth of full-cut dicing grooves by using an ultrasonic detector and a d |
March 26, 1996 |
| The present invention provides a method of measuring the depth of a dicing groove capable of measuring the depth of the groove with a high accuracy when the groove is cut in a full-cut mode, which method employs an ultrasonic detector which emits ultrasonic waves, measures the time i |
| 5488292 |
Wafer inspecting system |
January 30, 1996 |
| A wafer inspecting system is provided, in which the inspecting time for one cassette stocking plurality of wafers are shortened. The wafer, which is stored in the cassette among four cassettes stocked in the cassette stocking part, is taken out from the cassette by the automated truck of |
| 5458526 |
Method of slicing a semiconductor wafer and an apparatus |
October 17, 1995 |
| The present invention aims at proposing a method of slicing a semiconductor wafer and an apparatus therefor which can manufacture a bowl-shaped wafer. When the blade displacement is detected with the sensor 32, the displacement value of the blade 14 to the outer peripheral edge of the |
| 5444386 |
Probing apparatus having an automatic probe card install mechanism and a semiconductor wafer tes |
August 22, 1995 |
| A probing apparatus including probes contacting with electrode pads of the semiconductor wafer for measuring a semiconductor wafer in which a probe card is safely and individually installed and a wafer testing system in which a plurality of probe cards are efficiently used are disclosed. |
| 5434803 |
Coordinate measuring machine and method of measuring therein |
July 18, 1995 |
| A coordinate measuring machine and the method of measuring therein wherein the instruction of the geometic shape is prevented from mistaking and the geometic shape of the workpiece is measured without interrupting the joystick operation. The measuring direction of the probe and the measu |
| 5427644 |
Method of manufacturing semiconductor wafer and system therefor |
June 27, 1995 |
| An ingot is conveyed to a slicing machine by an ingot loader. Then, the ingot is cut into a wafer by the slicing machine. And, the cut wafer is conveyed to a peel-off portion and soaked in a warm water tank for a predetermined time so that the adhesive of the slice base can be heat s |
| 5402230 |
Heterodyne interferometric optical fiber displacement sensor for measuring displacement of an ob |
March 28, 1995 |
| A heterodyne interferometric optical fiber displacement sensor using a laser diode. The frequency and the intensity of the laser diode beam are periodically modulated by an injection current. The laser diode beam is routed to a rod lens via a first optical fiber, an optical fiber coupler |
| 5359784 |
Method of centering in roundness measuring instrument and system therefor |
November 1, 1994 |
| A centering system in a roundness measuring instrument comprises a computing section, a detecting device and a programming device. The computing section seeks an average circle of an article to be measured, a value of eccentricity and a direction of an angle of eccentricity in respon |
| 5353551 |
Blade position detection apparatus |
October 11, 1994 |
| The front end portion of a rotational blade is accurately located in a non-contact manner although the quantity of wear of the blade has been changed. The structure is so arranged that a pair of prisms are disposed to oppose each other at a predetermined interval, either of the two prism |
| 5339531 |
Coordinate measuring machine |
August 23, 1994 |
| A coordinate measuring machine wherein an X carriage and a Y carriage are rendered light in weight, and the center of gravity of the Y carriage including the X carriage and a Z carriage is disposed close to a driving source, to thereby smoothen the movements of the X carriage and the Y |
| 5295331 |
Method of chamfering semiconductor wafer |
March 22, 1994 |
| According to the present invention, the rotary axis O--O of a grindstone 22 is inclined to the rotary axis P--P of a semiconductor wafer 20 through an angle .theta. in a direction of the tangent line of the semiconductor wafer. Accordingly, a moving direction of abrasive grains of the |
| 5287843 |
Slicing machine employing an axial force to provide rigidity to a rotary blade |
February 22, 1994 |
| A slicing machine for slicing an ingot using a rotary blade that maintains the inner peripheral cutting edge of the blade in a highly rigid state. The slicing machine slices the ingot into thin pieces by use of an inner peripheral cutting edge of a doughnut-shaped rotary blade in which a |
| 5280567 |
Digital display device for displaying measuring data |
January 18, 1994 |
| A dimension display device displays the dimension of a machined member to be measured by means of a bar graph. The dimension display device includes a bar graph display part which is composed of a large number of display elements, and a plurality of scale display parts disposed in parall |
| 5175595 |
Non-contact measuring device |
December 29, 1992 |
| A non-contact measuring device which applies a scanning light moving parallel at a constant speed to an object to be measured and measures the shape of the object to be measured in accordance with the time for which the scanning light is shut off by the object to measured. To provide the |
| 5174270 |
Slicing machine and a slicing method by the same |
December 29, 1992 |
| A slicing method includes slicing an ingot by a rotary blade while the inner peripheral cutting edge of the blade is kept in a highly rigid state. A slicing machine slices the ingot into thin pieces by use of an inner peripheral cutting edge of a doughnut-shaped rotary blade, where an |
| 5074276 |
Slicing method by a slicing machine |
December 24, 1991 |
| A slicing method by use of a slicing machine in which, after a cylindrical material is moved by a predetermined amount of indexing, the cylindrical material is moved to a rotating blade in the slicing direction of the blade and is sliced into a wafer having a predetermined thickness, and |
| 5041988 |
Method and device for measuring a surface contour |
August 20, 1991 |
| A method and device for measuring the surface contour such as the surface roughness of a member to be measured having a curved surface shape. In the surface contour measuring device, a cubic curved line corresponding to the curved surface of the member to be measured is obtained from a m |
| 5000156 |
Method and device for dressing an inner peripheral blade in a slicing machine |
March 19, 1991 |
| A method and a device for dressing an inner peripheral blade used in a slicing machine which slices a silicone ingot or the like into thin wafers. In the method and device, the manner of dressing the inner peripheral blade can be determined from the career of the inner peripheral bla |
| 4985673 |
Method and system for inspecting plural semiconductor devices |
January 15, 1991 |
| A method of inspecting semiconductor devices, wherein a plurality of semiconductor devices of the same type are successively connected to a measuring-inspecting means in a manner to be exchanged over from one to another, and pass or fail of the plurality of semiconductor devices is s |
| 4838238 |
Internal peripheral edge type blade holding device |
June 13, 1989 |
| An internal peripheral edge type blade holding device for use in an internal peripheral edge type slicing machine used when a silicone ingot is sliced into thin pieces each having a thickness of the order of several hundred microns in a semiconductor manufacturing process. In the blade |
| 4765181 |
Surface texture measuring instrument |
August 23, 1988 |
| A surface texture measuring instrument comprises an immovable casing located on an object, a movable pick-up for detecting a surface roughness of the object, and a driving unit in the casing for driving the pick-up. The pick-up comprises a skid having a curved surface for absorbing a |
