| Patent Number |
Title Of Patent |
Date Issued |
| RE39018 |
High speed method of aligning cutting lines of a workplace using patterns |
March 21, 2006 |
| Two imaging equipment are provided at a pair of cutting blade units, and the two imaging equipment image patterns at first positions in proximity to the center of a wafer at the same time. A controller drives drive mechanisms to align the wafer in such a way that current image patterns |
| 7601615 |
Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatu |
October 13, 2009 |
| A semiconductor wafer back-surface grinding method, for grinding a back surface of a semiconductor wafer, an opposed front surface of the semiconductor wafer being adhered to a support base material and being provided with a circuit pattern, including: measuring an initial thickness |
| 7565002 |
Wafer surface observation apparatus |
July 21, 2009 |
| A dicing apparatus for moving a wafer quickly to a desired observation position before the wafer surface is observed. The apparatus comprises imaging means for imaging the surface of a wafer, display means for displaying the image picked up by the imaging means, input means for input |
| 7563643 |
Wafer processing apparatus |
July 21, 2009 |
| A wafer processing apparatus (10), for processing a wafer (20) with a surface protective film (110) attached on the front surface (21) on which at least one circuit pattern is formed, includes a dicing tape application unit (30) for attaching a dicing tape (3) on a frame (36) and the |
| 7546218 |
Dimension measuring device |
June 9, 2009 |
| A dimension measuring device that has improved operability when an expensive display device, such as, a bar graph is used. The device includes plural dimension measuring sections and a display section for displaying dimension measurements generated by the plural dimension measuring s |
| 7521384 |
Method and apparatus for peeling surface protective film |
April 21, 2009 |
| A method and an apparatus for peeling a surface protective film attached on the surface of a semiconductor wafer are provided. A heating block is set in proximity to the whole surface of the semiconductor wafer, and the whole surface protective film is heated by the heating block. Thus, |
| 7503365 |
Dicing tape attaching apparatus and dicing tape attaching method |
March 17, 2009 |
| A dicing tape attaching apparatus (10) comprises a fixed table (38) for supporting a mount frame (36), a movable table (31) for supporting a wafer (20) with the reverse surface thereof ground, and a height adjusting unit (70) such as a screw jack for adjusting the height of the movab |
| 7501843 |
Movement amount operation correction method for prober, movement amount operation correction pro |
March 10, 2009 |
| A movement amount operation correction method of a prober capable of easily performing an error measurement for the movement distance. In the method, the position of a probe of a probe card is detected by a probe position detection means, the position of an electrode is detected by a |
| 7492942 |
Image defect inspection method, image defect inspection apparatus, and appearance inspection app |
February 17, 2009 |
| In an image defect inspection method and apparatus, which detects a gray level difference between the corresponding portions of two images, automatically sets a threshold value based on the distribution of the detected gray level difference, compares the detected gray level differenc |
| 7492176 |
Prober and probe contact method |
February 17, 2009 |
| A prober and a method for reducing errors in the contact position between a probe and an electrode without lowering throughput when conducting a test of a wafer at a high or low temperature. The prober includes a wafer chuck for holding a wafer, a movement mechanism for moving the wafer |
| 7490650 |
Workpiece processing device |
February 17, 2009 |
| A workpiece processing device (10) for processing a workpiece (60; 20, 36) comprises: a surface protection film peeling means (50) for peeling a surface protection film (110), which is adhered to a front surface (21) of a workpiece, with a peeling tape (4); a bar code adhering means (11) |
| 7438776 |
Tape adhering method and tape adhering apparatus |
October 21, 2008 |
| A method and an apparatus for adhering a tape (3) on a wafer (20) are disclosed. The wafer is supported on a table (31), and the tape is supplied, between a tape adhering surface (20') and a tape adhering unit (46), from a tape supply unit (42). The table is moved toward the tape adh |
| 7426876 |
Machine tool |
September 23, 2008 |
| A machine tool in which a tool holder having a tool is attached to a main spindle and the main spindle is rotated to conduct machining on a workpiece, comprises: a displacement sensor, the impedance of which is changed according to a distance from the displacement sensor to the tool |
| 7415362 |
Image defect inspection apparatus |
August 19, 2008 |
| An image defect inspection apparatus which performs a defect detection for detecting a defect on a surface of a sample by comparing corresponding portions in a captured image of the surface of the sample. The apparatus includes a plurality of processor elements which perform the defect |
| 7410831 |
Method and device for dividing plate-like member |
August 12, 2008 |
| In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like member formed from a hard and brittle material or in the interior of the plate-like member and |
| 7405584 |
Prober and probe contact method |
July 29, 2008 |
| A prober that has improved positional precision of probing without reducing throughput is disclosed. The prober comprises a probe card having a probe, a wafer stage, a stage temperature adjustment mechanism, a wafer stage movement mechanism, a movement control section, and an alignme |
| 7383869 |
Film peeling method and film peeling device |
June 10, 2008 |
| A film peeling device for peeling a film which has been stuck onto a film sticking face of a wafer including: a wafer sucking means for sucking the wafer so that the film sticking face of the wafer can become an upper face; a peeling tape feeding means for feeding a peeling tape onto the |
| 7370895 |
Work transfer device and method of transferring work |
May 13, 2008 |
| Provided are a work transfer device and a method of transferring work which are capable of safely transferring work without letting the work to fall even when poor adhesion of a frame occurs due to troubles. By providing an adsorption part which adsorbs a frame, and a plurality of fr |
| 7370841 |
Rocking fulcrum member |
May 13, 2008 |
| The crisscross fulcrum according to the present invention is formed as a continuous member by fabricating one elastic member in the form of a plate. Therefore, the rocking fulcrum member can be obtained as a precise fulcrum member at a low cost with reduced variations in the spring c |
| 7366343 |
Pattern inspection method and apparatus |
April 29, 2008 |
| A pattern inspection method and a pattern inspection apparatus, which has an improved precision in detecting and correcting the positional deviation of images for a die comparison, have been disclosed. The quantity of correction of positional deviation of the images for the die compa |
| 7354337 |
Pad conditioner, pad conditioning method, and polishing apparatus |
April 8, 2008 |
| The present invention provides: a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising a bending or deflecting or elastic member and a supporting section to support a base end of the bending or deflecting or |
| 7346207 |
Image defect inspection method, image defect inspection apparatus, and appearance inspection app |
March 18, 2008 |
| In an image defect inspection method and apparatus which detects a gray level difference between corresponding portions of two images, automatically sets a threshold value based on the distribution thereof, compares the gray level difference with the threshold value, and judges one o |
| 7336815 |
Image defect inspection method, image defect inspection apparatus, and appearance inspection app |
February 26, 2008 |
| In an image defect inspection method and apparatus which detects a gray level difference between corresponding portions of two images, automatically sets a threshold value based on the distribution thereof, compares the gray level difference with the threshold value, and judges one o |
| 7330581 |
Image defect inspection method, image defect inspection apparatus and appearance inspection appa |
February 12, 2008 |
| A new image defect inspection method and a new image defect inspection apparatus capable of being used for automatic setting of a threshold value for an appearance inspection apparatus with a high throughput have been disclosed. According to the image defect inspection method and the |
| 7330265 |
Appearance inspection apparatus and projection method for projecting image of sample under inspe |
February 12, 2008 |
| An object of the present invention is to provide an appearance inspection apparatus that can change the method of illumination, the shape of illumination light, and a spatial filter for the projection of an image of a sample dynamically during inspection, and also to provide a projec |
| 7328518 |
Surface roughness/contour shape measuring apparatus |
February 12, 2008 |
| The present invention provides a surface roughness/contour shape measuring apparatus that can move a probe relative to a workpiece within an orthogonal X-Y plane while employing a relatively inexpensive construction. In the surface roughness/contour shape measuring apparatus (1), the |
| 7327871 |
Defect inspecting method, defect inspecting apparatus and inspection machine |
February 5, 2008 |
| According to a defect inspecting method implemented in a semiconductor circuit inspection machine, a difference in a gray-scale level of a pattern edge image is corrected. A procedure of determining a magnitude of correction is modified in efforts to improve the sensitivity in detect |
| 7290348 |
Device for measuring circularity and cylindrical shape |
November 6, 2007 |
| The invention provides a circularity and cylindrical shape measuring device that can decrease the measurement errors generated due to the weight of a measured workpiece. A circularity and cylindrical shape measuring device (10) is configured such that a rotation axis of a rotary tabl |
| 7248732 |
Pattern inspection method and inspection apparatus |
July 24, 2007 |
| A pattern inspection method and apparatus, wherein the target area is limited to a line part, having a simplified configuration and capable of detecting a killer defect as a defect candidate and considerably reducing the number of non-killer defects to be detected as defect candidates, |
| 7239050 |
Uniaxial drive unit and surface shape measuring apparatus using the same |
July 3, 2007 |
| There is provided a uniaxial drive unit using a linear motor having a fixed part which is a rod-shaped magnet fixed to a unit body and formed so that the N poles and the S poles are arranged alternately; and a moving part which is a ring-shaped member having a coil member, fitted on |
| 7197835 |
Detector supporting mechanism |
April 3, 2007 |
| A detector supporting mechanism comprising a first arm having its one end fixed on a mount linearly movable relative to a workpiece, the first arm having a rotation axis at the other end and a second arm provided on the first arm so as to be turnable on the rotation axis relative to the |
| 7194819 |
Opposed type fulcrum member of lever detector |
March 27, 2007 |
| An opposed type fulcrum member of a lever detector is constituted by a main body part having a U-shaped section and thin-walled parts each formed in opposed positions of two sides of the main body part, and two ends of the U-shaped main body part can rock, with the tin-walled parts s |
| 7189149 |
Method of truing chamfering grindstone and chamfering device |
March 13, 2007 |
| A truing method for a chamfering grindstone for performing chamfering work on a peripheral edge of a plate-shaped object, comprising the steps of: performing chamfering work on a truing grindstone with a master grindstone having a desired groove shape and forming a peripheral edge sh |
| 7187454 |
Measuring device |
March 6, 2007 |
| While a ball 14 is inserted into a hole WA of a workpiece W and is moved in the longitudinal direction of the hole WA while automatically centripetally moved, a change of back pressure of a gas injected into the hole WA is detected by a converter 30, and at the same time reflected li |
| 7178260 |
Measuring head |
February 20, 2007 |
| A unit damper apparatus 18 is used as a damper apparatus 18 which absorbs an impact and a vibration conveyed from a contact 14 to a seesaw member 12, and a structure of this unit damper apparatus 18 is the structure which absorbs circular movement of the seesaw member 12 or performs the |
| 7175374 |
Machine tool |
February 13, 2007 |
| A method and a device for detecting the incorrect chucking of a machine tool capable of easily and surely detecting a chucking error; the method, comprising the steps of measuring, by a sensor (12), the change of a distance (d) between the sensor (12) and the outer peripheral surface of |
| 7162835 |
Gravity safety door for an apparatus for manufacturing or inspecting semiconductors |
January 16, 2007 |
| An apparatus for manufacturing or inspecting semiconductors comprising a main body, an opening arranged in the main body, and a safety door. The safety door includes a first door element for covering a first portion of the opening and a second door element for covering a second portion o |
| 7158910 |
Device for calculating the quantity of light and method thereof |
January 2, 2007 |
| A method of calculating a quantity of light by measuring, by using an adhering force measuring unit (71), the adhering force of an ultraviolet light-curable tape (11 or 21) relying upon the quantity of ultraviolet light with which the ultraviolet light-curable tape is irradiated from an |
| 7137210 |
Measuring head |
November 21, 2006 |
| According to the measuring head, the zero point and the amount of front travel settings are facilitated. Firstly, the amount of front travel is set by allowing contacts 34, 34 to abut a master 50. Then, rotating the lever 42 in a direction indicated by an arrow E, or a close position, |
| 7129507 |
Chip mis-position detection method |
October 31, 2006 |
| The invention is a method for detecting float or peel of semiconductor chips arranged in X and Y axes directions diced and bonded to a dicing tape on a stage. The method includes detecting float or peel of the semiconductor chips in a respective horizontal or longitudinal row arrange |
| 7127938 |
Measuring head |
October 31, 2006 |
| A unit damper apparatus 18 is used as a damper apparatus 18 which absorbs an impact and a vibration conveyed from a contact 14 to a seesaw member 12, and a structure of this unit damper apparatus 18 is the structure which absorbs circular movement of the seesaw member 12 or performs the |
| 7126145 |
Frame transfer prober |
October 24, 2006 |
| A frame transfer prober 1, for carrying out an electrical property test on a number of semiconductor chips 10 fixed on a dicing tape 11, comprises a separation detection unit 9 for detecting the separation and/or protrusion of the semiconductor chips 10 from the dicing tape. The sepa |
| 7119560 |
Probe apparatus |
October 10, 2006 |
| A probe apparatus 1 includes displacement detection means 6 disposed on a surface 4a of a probe card 4 from which probing needles 41 of the probe card 4 protrude, and control means 5 for receiving a signal of a positional change of the probe card 4 from the displacement detection mea |
| 7117719 |
Hole shape measuring method and apparatus |
October 10, 2006 |
| In a measuring apparatus 10, an arm 36 is lowered to insert a measuring sphere 30 into a hole 22A in a workpiece 22, and further the measuring sphere 30 is lowered in the depth direction of the hole 22A. Thereby, the back pressure of compressed air is detected at a plurality of locations |
| 7098668 |
Digital measuring head |
August 29, 2006 |
| A digital measuring head in a measuring apparatus measures a work by making a contact element abut to the work. The digital measuring head includes an arm supported rotatably around a support point arranged on a base; a finger having the contact element at a tip end and mounted to a |
| 7098118 |
Method and apparatus for machining substrate |
August 29, 2006 |
| In a substrate machining method for machining a substrate, there are provided a substrate machining method in which a disk-like blade is rotated to cut the substrate from its one surface, and the cut surfaces of the substrate, which are positioned in the vicinity of the other surface |
| 7071583 |
Uniaxial drive unit |
July 4, 2006 |
| A uniaxial drive unit is provided with a tiltable pulse generating device having a joystick, which generates a continuous pulse of a frequency corresponding to the tilt angle of the joystick, and a rotary encoder having a knob, which generates a pulse of a frequency corresponding to |
| 7056196 |
Wafer polisher |
June 6, 2006 |
| A wafer polisher, wherein a retainer ring (28) is installed in a wafer holding head (14), a protective sheet material (52) is disposed inside the retainer ring (28), and a wafer (W) is pressed against a polishing pad (20) through the protective sheet material (52) for polishing, wher |
| 7055373 |
Method and device for measuring inner diameter dimension of works |
June 6, 2006 |
| A method and a device for measuring the inner diameter dimension of a work capable of easily and accurately measuring the inner diameter dimension of the work with a simple structure; the method, comprising the steps of feeding compressed air to the inner peripheral part of a master with |
| 7037248 |
Machine tool |
May 2, 2006 |
| A method and a device for detecting the incorrect chucking of a machine tool capable of easily and surely detecting a chucking error; the method, comprising the steps of measuring, by a sensor (12), the change of a distance (d) between the sensor (12) and the outer peripheral surface of |
