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Tokyo Seimitsu Co., Ltd. Patents
Assignee:
Tokyo Seimitsu Co., Ltd.
Address:
Tokyo, JP
No. of patents:
192
Patents:


1 2 3 4


Patent Number Title Of Patent Date Issued
RE39018 High speed method of aligning cutting lines of a workplace using patterns March 21, 2006
Two imaging equipment are provided at a pair of cutting blade units, and the two imaging equipment image patterns at first positions in proximity to the center of a wafer at the same time. A controller drives drive mechanisms to align the wafer in such a way that current image patterns
7426876 Machine tool September 23, 2008
A machine tool in which a tool holder having a tool is attached to a main spindle and the main spindle is rotated to conduct machining on a workpiece, comprises: a displacement sensor, the impedance of which is changed according to a distance from the displacement sensor to the tool
7415362 Image defect inspection apparatus August 19, 2008
An image defect inspection apparatus which performs a defect detection for detecting a defect on a surface of a sample by comparing corresponding portions in a captured image of the surface of the sample. The apparatus includes a plurality of processor elements which perform the defect
7410831 Method and device for dividing plate-like member August 12, 2008
In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like member formed from a hard and brittle material or in the interior of the plate-like member and
7405584 Prober and probe contact method July 29, 2008
A prober that has improved positional precision of probing without reducing throughput is disclosed. The prober comprises a probe card having a probe, a wafer stage, a stage temperature adjustment mechanism, a wafer stage movement mechanism, a movement control section, and an alignme
7383869 Film peeling method and film peeling device June 10, 2008
A film peeling device for peeling a film which has been stuck onto a film sticking face of a wafer including: a wafer sucking means for sucking the wafer so that the film sticking face of the wafer can become an upper face; a peeling tape feeding means for feeding a peeling tape onto the
7370895 Work transfer device and method of transferring work May 13, 2008
Provided are a work transfer device and a method of transferring work which are capable of safely transferring work without letting the work to fall even when poor adhesion of a frame occurs due to troubles. By providing an adsorption part which adsorbs a frame, and a plurality of fr
7370841 Rocking fulcrum member May 13, 2008
The crisscross fulcrum according to the present invention is formed as a continuous member by fabricating one elastic member in the form of a plate. Therefore, the rocking fulcrum member can be obtained as a precise fulcrum member at a low cost with reduced variations in the spring c
7366343 Pattern inspection method and apparatus April 29, 2008
A pattern inspection method and a pattern inspection apparatus, which has an improved precision in detecting and correcting the positional deviation of images for a die comparison, have been disclosed. The quantity of correction of positional deviation of the images for the die compa
7354337 Pad conditioner, pad conditioning method, and polishing apparatus April 8, 2008
The present invention provides: a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising a bending or deflecting or elastic member and a supporting section to support a base end of the bending or deflecting or
7346207 Image defect inspection method, image defect inspection apparatus, and appearance inspection app March 18, 2008
In an image defect inspection method and apparatus which detects a gray level difference between corresponding portions of two images, automatically sets a threshold value based on the distribution thereof, compares the gray level difference with the threshold value, and judges one o
7336815 Image defect inspection method, image defect inspection apparatus, and appearance inspection app February 26, 2008
In an image defect inspection method and apparatus which detects a gray level difference between corresponding portions of two images, automatically sets a threshold value based on the distribution thereof, compares the gray level difference with the threshold value, and judges one o
7330581 Image defect inspection method, image defect inspection apparatus and appearance inspection appa February 12, 2008
A new image defect inspection method and a new image defect inspection apparatus capable of being used for automatic setting of a threshold value for an appearance inspection apparatus with a high throughput have been disclosed. According to the image defect inspection method and the
7330265 Appearance inspection apparatus and projection method for projecting image of sample under inspe February 12, 2008
An object of the present invention is to provide an appearance inspection apparatus that can change the method of illumination, the shape of illumination light, and a spatial filter for the projection of an image of a sample dynamically during inspection, and also to provide a projec
7328518 Surface roughness/contour shape measuring apparatus February 12, 2008
The present invention provides a surface roughness/contour shape measuring apparatus that can move a probe relative to a workpiece within an orthogonal X-Y plane while employing a relatively inexpensive construction. In the surface roughness/contour shape measuring apparatus (1), the
7327871 Defect inspecting method, defect inspecting apparatus and inspection machine February 5, 2008
According to a defect inspecting method implemented in a semiconductor circuit inspection machine, a difference in a gray-scale level of a pattern edge image is corrected. A procedure of determining a magnitude of correction is modified in efforts to improve the sensitivity in detect
7290348 Device for measuring circularity and cylindrical shape November 6, 2007
The invention provides a circularity and cylindrical shape measuring device that can decrease the measurement errors generated due to the weight of a measured workpiece. A circularity and cylindrical shape measuring device (10) is configured such that a rotation axis of a rotary tabl
7248732 Pattern inspection method and inspection apparatus July 24, 2007
A pattern inspection method and apparatus, wherein the target area is limited to a line part, having a simplified configuration and capable of detecting a killer defect as a defect candidate and considerably reducing the number of non-killer defects to be detected as defect candidates,
7239050 Uniaxial drive unit and surface shape measuring apparatus using the same July 3, 2007
There is provided a uniaxial drive unit using a linear motor having a fixed part which is a rod-shaped magnet fixed to a unit body and formed so that the N poles and the S poles are arranged alternately; and a moving part which is a ring-shaped member having a coil member, fitted on
7197835 Detector supporting mechanism April 3, 2007
A detector supporting mechanism comprising a first arm having its one end fixed on a mount linearly movable relative to a workpiece, the first arm having a rotation axis at the other end and a second arm provided on the first arm so as to be turnable on the rotation axis relative to the
7194819 Opposed type fulcrum member of lever detector March 27, 2007
An opposed type fulcrum member of a lever detector is constituted by a main body part having a U-shaped section and thin-walled parts each formed in opposed positions of two sides of the main body part, and two ends of the U-shaped main body part can rock, with the tin-walled parts s
7189149 Method of truing chamfering grindstone and chamfering device March 13, 2007
A truing method for a chamfering grindstone for performing chamfering work on a peripheral edge of a plate-shaped object, comprising the steps of: performing chamfering work on a truing grindstone with a master grindstone having a desired groove shape and forming a peripheral edge sh
7187454 Measuring device March 6, 2007
While a ball 14 is inserted into a hole WA of a workpiece W and is moved in the longitudinal direction of the hole WA while automatically centripetally moved, a change of back pressure of a gas injected into the hole WA is detected by a converter 30, and at the same time reflected li
7178260 Measuring head February 20, 2007
A unit damper apparatus 18 is used as a damper apparatus 18 which absorbs an impact and a vibration conveyed from a contact 14 to a seesaw member 12, and a structure of this unit damper apparatus 18 is the structure which absorbs circular movement of the seesaw member 12 or performs the
7175374 Machine tool February 13, 2007
A method and a device for detecting the incorrect chucking of a machine tool capable of easily and surely detecting a chucking error; the method, comprising the steps of measuring, by a sensor (12), the change of a distance (d) between the sensor (12) and the outer peripheral surface of
7162835 Gravity safety door for an apparatus for manufacturing or inspecting semiconductors January 16, 2007
An apparatus for manufacturing or inspecting semiconductors comprising a main body, an opening arranged in the main body, and a safety door. The safety door includes a first door element for covering a first portion of the opening and a second door element for covering a second portion o
7158910 Device for calculating the quantity of light and method thereof January 2, 2007
A method of calculating a quantity of light by measuring, by using an adhering force measuring unit (71), the adhering force of an ultraviolet light-curable tape (11 or 21) relying upon the quantity of ultraviolet light with which the ultraviolet light-curable tape is irradiated from an
7137210 Measuring head November 21, 2006
According to the measuring head, the zero point and the amount of front travel settings are facilitated. Firstly, the amount of front travel is set by allowing contacts 34, 34 to abut a master 50. Then, rotating the lever 42 in a direction indicated by an arrow E, or a close position,
7129507 Chip mis-position detection method October 31, 2006
The invention is a method for detecting float or peel of semiconductor chips arranged in X and Y axes directions diced and bonded to a dicing tape on a stage. The method includes detecting float or peel of the semiconductor chips in a respective horizontal or longitudinal row arrange
7127938 Measuring head October 31, 2006
A unit damper apparatus 18 is used as a damper apparatus 18 which absorbs an impact and a vibration conveyed from a contact 14 to a seesaw member 12, and a structure of this unit damper apparatus 18 is the structure which absorbs circular movement of the seesaw member 12 or performs the
7126145 Frame transfer prober October 24, 2006
A frame transfer prober 1, for carrying out an electrical property test on a number of semiconductor chips 10 fixed on a dicing tape 11, comprises a separation detection unit 9 for detecting the separation and/or protrusion of the semiconductor chips 10 from the dicing tape. The sepa
7119560 Probe apparatus October 10, 2006
A probe apparatus 1 includes displacement detection means 6 disposed on a surface 4a of a probe card 4 from which probing needles 41 of the probe card 4 protrude, and control means 5 for receiving a signal of a positional change of the probe card 4 from the displacement detection mea
7117719 Hole shape measuring method and apparatus October 10, 2006
In a measuring apparatus 10, an arm 36 is lowered to insert a measuring sphere 30 into a hole 22A in a workpiece 22, and further the measuring sphere 30 is lowered in the depth direction of the hole 22A. Thereby, the back pressure of compressed air is detected at a plurality of locations
7098668 Digital measuring head August 29, 2006
A digital measuring head in a measuring apparatus measures a work by making a contact element abut to the work. The digital measuring head includes an arm supported rotatably around a support point arranged on a base; a finger having the contact element at a tip end and mounted to a
7098118 Method and apparatus for machining substrate August 29, 2006
In a substrate machining method for machining a substrate, there are provided a substrate machining method in which a disk-like blade is rotated to cut the substrate from its one surface, and the cut surfaces of the substrate, which are positioned in the vicinity of the other surface
7071583 Uniaxial drive unit July 4, 2006
A uniaxial drive unit is provided with a tiltable pulse generating device having a joystick, which generates a continuous pulse of a frequency corresponding to the tilt angle of the joystick, and a rotary encoder having a knob, which generates a pulse of a frequency corresponding to
7056196 Wafer polisher June 6, 2006
A wafer polisher, wherein a retainer ring (28) is installed in a wafer holding head (14), a protective sheet material (52) is disposed inside the retainer ring (28), and a wafer (W) is pressed against a polishing pad (20) through the protective sheet material (52) for polishing, wher
7055373 Method and device for measuring inner diameter dimension of works June 6, 2006
A method and a device for measuring the inner diameter dimension of a work capable of easily and accurately measuring the inner diameter dimension of the work with a simple structure; the method, comprising the steps of feeding compressed air to the inner peripheral part of a master with
7037248 Machine tool May 2, 2006
A method and a device for detecting the incorrect chucking of a machine tool capable of easily and surely detecting a chucking error; the method, comprising the steps of measuring, by a sensor (12), the change of a distance (d) between the sensor (12) and the outer peripheral surface of
6987388 Digital measuring head January 17, 2006
A digital measuring head in a measuring apparatus measures a work by making a contact element abut to the work. The digital measuring head includes an arm supported rotatably around a support point arranged on a base; a finger having the contact element at a tip end and mounted to a
6980686 Pattern inspection method and inspection apparatus December 27, 2005
A pattern inspection method and a pattern inspection apparatus, which are able to detect a killer defect as a defect candidate and also reduce considerably the number of non-killer defects detected as a defect candidate, have been disclosed, wherein a differential image of two patter
6973208 Method and apparatus for inspection by pattern comparison December 6, 2005
Disclosed are a method and apparatus for inspection by pattern comparison enabling cell-cell comparison by software processing even when the array pitch R of the cells is not a whole multiple of the pixel pitch P, wherein provision is made of an imaging device for capturing an image of p
6969308 Method and apparatus for chemical and mechanical polishing November 29, 2005
A polishing device is hermetically accommodated in a chamber containing an atmosphere having a composition different from the ambient air, so that the atmosphere around the polishing device is altered into the composition different from the ambient air, and voltage is applied between a w
6955764 Method and apparatus for preparing slurry for CMP apparatus October 18, 2005
The method and apparatus are provided for preparing a slurry for a CMP apparatus with which mixing accuracy for a slurry is improved and accurate measurement is automatically accomplished for H.sub.2 O.sub.2 as a small amount of additive. A slurry preparation apparatus for a CMP apparatu
6946311 Processing apparatus and wafer processing method September 20, 2005
There are provide a wafer processing method comprising the steps of securing the entirety of a wafer which is provided, on its right side, with a surface protection tape adhered thereto, to a frame by a dicing tape adhered to the underside of the wafer; irradiating the dicing tape of
6935930 Polishing apparatus and method, and wafer evacuation program August 30, 2005
In a wafer polishing apparatus which polishes a wafer surface or in a wafer cleaner, there are provided a transfer and cleaning chamber which shuts off a wafer from the outside air and an inert gas supply device which fills an inert gas into the transfer and cleaning chamber. Thus, there
6913526 Polishing machine for polishing periphery of sheet July 5, 2005
A polishing machine for polishing a periphery of a sheet of the present invention comprises a grinding shaft tilting mechanism (1) capable of changing a tilting angle of a rotary shaft of a grinding stone (3) with respect to a rotary shaft of the sheet (2) and also capable of changing
6910943 Planarization apparatus and method June 28, 2005
A polishing stage is mounted on a body provided with a rough grinding stage and a fine grinding stage so that a wafer can be roughly ground, finely ground and polished in one planarization apparatus. The planarization apparatus also has a cleaning stage for cleaning a polishing pad of th
6910403 Method for cutting semiconductor wafer protecting sheet June 28, 2005
To cut a protecting sheet adhered over the obverse of a wafer, an inclination angle of a cutting tool is adjusted according to a form of a chamfered part of the wafer and a finishing thickness of the wafer so that the protecting sheet is cut into the required minimum size for protecting
6901678 Measuring head June 7, 2005
A measuring head is provided with a retracting device for a sensing pin, comprising an electric motor-driven feed screw, a nut shifted by the feed screw and an inclined face formed on the nut; a seesaw member to which the sensing pin is fitted is swung by the linear motion of the incline
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