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Tokyo Ohka Kogyo Co., Ltd. Patents
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
Address:
Kawasaki, JP
No. of patents:
363
Patents:


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Patent Number Title Of Patent Date Issued
RE38254 Positive resist composition September 16, 2003
Disclosed is an improved, chemically-amplifying positive resist composition for radiations, especially UV rays, deep-UV rays, excimer laser beams, X-rays, electron beams. The composition comprises (A) a resin component whose solubility in an alkaline aqueous solution is increased by the
D552565 Supporting plate October 9, 2007
D544452 Supporting plate June 12, 2007
7611581 Coating apparatus, coating method and coating-film forming apparatus November 3, 2009
A coating apparatus is provided in which a coating liquid supplied onto a surface of a substrate such as a semiconductor wafer and a glass substrate can be easily leveled so as to have a uniform thickness without any edge bead. The coating apparatus comprises a tray, a nozzle for sup
7608381 Polymer compound, positive resist composition and process for forming resist pattern October 27, 2009
The positive resist composition of the present invention is a polymer compound comprising at least one constituent unit (a1) selected from the group consisting of constituent units represented by the following general formulas (1) and (1)', a constituent unit (a2) derived from an (.a
7604920 Positive resist composition, method of forming resist pattern, polymeric compound, and compound October 20, 2009
A compound represented by general formula (I) shown below; and a polymeric compound having a structural unit (a0) represented by general formula (a0-1) shown below: ##STR00001## wherein R.sup.1 represents a hydrogen atom, a lower alkyl group or a halogenated lower alkyl group; A rep
7601396 Coating film forming method October 13, 2009
The object of the present invention is to provide a method for forming a coating film in which a coating film is prevented from drastically shrinking by controlling the temperature accurately when a SOG film is formed in a substrate with a coating liquid containing an alkoxysilane co
7598017 Negative resist composition and method of forming resist pattern October 6, 2009
A negative resist composition including: a fluorine-containing resin component (F) containing a structural unit (f1) represented by a general formula (f1-0) shown below, and a structural unit (f2) having an alkali-soluble group, an alkali-soluble resin component (A) excluding the f
7598014 Thick film photoresist composition and method of forming resist pattern October 6, 2009
A negative thick film photoresist composition with improved alkali developability is provided. The composition comprises: (A) a resin component containing (a) from 61 to 90% by weight of a structural unit derived from a cyclic alkyl (meth)acrylate ester, and (b) a structural unit der
7592123 Resin for photoresist composition, photoresist composition and method for forming resist pattern September 22, 2009
A resin for photoresist compositions is disclosed with excellent resolution and line edge roughness characteristics. A photoresist composition and a method for forming a resist pattern using such a resin are also disclosed. The resin has a hydroxyl group bonded to a carbon atom at a
7592122 Photoresist composition, and low-molecular compound and high-molecular compound for the photores September 22, 2009
A high-molecular compound and a low-molecular compound or both having an alkali-soluble site (i) wherein at least a part of the alkali-soluble site (i) is protected with (ii) a halogen atom-containing acetal type acid-dissociative, dissolution inhibiting group, as well as a photoresist
7591900 Nozzle for supplying treatment liquid and substrate treating apparatus September 22, 2009
A nozzle for supplying a treatment liquid which makes it possible to perform uniform cleaning to a surface of a substrate even in a case where the size of a substrate is large. A slit-shaped ejection hole is formed at the lower end of the nozzle for supplying a treatment liquid. In the
7582409 Negative resist composition and method of forming resist pattern September 1, 2009
A negative resist composition that includes an alkali-soluble resin component, an acid generator component that generates acid upon exposure, and a cross-linker component, wherein the alkali-soluble resin component is a copolymer that includes a structural unit containing an aliphatic
7582406 Resist composition and method for forming resist pattern September 1, 2009
A resist composition is obtained by dissolving a resin component (A) that exhibits changed alkali solubility under the action of acid, an oxime sulfonate-based acid generator (B), an amine compound (D) containing at least one alkyl group of 5 to 12 carbon atoms, and an organic acid (E),
7579138 Method for forming micropattern August 25, 2009
The present invention provides a method for forming a micropattern, enabling to narrow intervals between resist patterns, in which the narrowing extent of intervals between resist patterns can be increased while maintaining the controllability of resist pattern dimensions and the goo
7576046 Cleaning liquid for lithography and method of cleaning therewith August 18, 2009
A cleaning liquid for lithography that exhibits equally excellent cleaning performance for resists of a wide variety of compositions, such as various resists for i-line, KrF and ArF, silicic resist and chemical amplification type positive resist, and that excels in post-treatment dry
7572400 Production method for a nanomaterial August 11, 2009
A production method for a nanomaterial comprising the steps of: forming a template on a solid substrate using a metal oxide nanomaterial forming composition including an organic compound with a phenolic hydroxyl group and a molecular weight of at least 500, forming a metal oxide layer on
7569253 Film-forming method August 4, 2009
A film-forming method is provided in which generation of an edge bead can be prevented even in a case where the thickness of a coating solution is large, and includes the steps of applying a coating solution onto a substrate to be treated such that thickness of the coating solution is 20
7563146 Unbaked laminate for producing front plate of plasma display device, and method for producing fr July 21, 2009
The present invention provides an unbaked laminate for producing a front plate (1) of a plasma display device, and a method for producing such a front plate (1). The laminate includes a burnable intermediate layer (14), and may include an unbaked dielectric layer (12A) and a photosen
7554270 Composition for dielectric of plasma display panel, laminate for dielectric, and method for form June 30, 2009
A composition for a dielectric of a plasma display panel laminating a plurality of layers, includes: a lower layer composition containing inorganic powder and a binder resin, an upper layer composition containing inorganic powder, a binder resin, a photopolymerizable monomer and a ph
7553610 Method of forming fine patterns June 30, 2009
It is disclosed a method of forming fine patterns comprising: covering a substrate having photoresist patterns with an over-coating agent for forming fine patterns, applying heat treatment to cause thermal shrinkage of the over-coating agent so that the spacing between adjacent photo
7544460 Resist composition, multilayer body, and method for forming resist pattern June 9, 2009
A resist composition is disclosed that enables formation of a favorable resist pattern using a shrink process in which, following formation of the resist pattern, a treatment such as heating is used to narrow the resist pattern, and also disclosed are a laminate and a method for form
7541138 Resist composition June 2, 2009
A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in acc
7534550 Positive resist composition and process for formation of resist patterns May 19, 2009
A positive resist composition includes a resin component (A) and an acid generator component (B), wherein the component (A) is a copolymer that includes a structural unit (a1) derived from an (.alpha.-lower alkyl)acrylate ester that contains a monocyclic or polycyclic group-containin
7527909 Resist composition May 5, 2009
A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in acc
7524604 Positive resist composition and method of formation of resist patterns April 28, 2009
The invention provides a positive resist composition which has high etching resistance and attains high resolution, and a method of forming patterns by using the positive resist composition. The positive resist composition contains a resin component (A), which has acid dissociable, d
7504196 Positive resist composition, method for resist pattern formation and compound March 17, 2009
A positive resist composition that includes a base material component (A) that contains an acid-dissociable, dissolution-inhibiting group and exhibits increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid upon exposure, wherein
7501221 Positive type resist composition and resist pattern formation method using same March 10, 2009
There is provided a positive type resin composition comprising (A) a resin component comprising within the principal chain a structural unit derived from a (meth)acrylate ester and incorporating an acid dissociable, dissolution inhibiting group containing a polycyclic group on an ester
7501220 Resist composition March 10, 2009
A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in acc
7498520 Semiconductor multilayer wiring board and method of forming the same March 3, 2009
A silica-based interlayer insulating layer having a low dielectric constant is formed with SOG material on a substrate, in which a wiring-layer forming space is then formed. If necessary, a UV ray irradiation is performed under an oxidizing atmosphere. A Si--OH bond is formed on a su
7494762 Positive resist composition for immersion lithography and method for forming resist pattern February 24, 2009
Provided are a positive resist composition for immersion lithography, and a method for forming a resist pattern using the same, wherein the positive resist composition comprises a resin component (A) that increases its alkali solubility under action of an acid, an acid generator comp
7494759 Positive resist compositions and process for the formation of resist patterns with the same February 24, 2009
A positive resist composition comprising (A) a resin component and (B) an acid generator component, wherein the component (A) is a copolymer which comprises constituent units (a1) derived from a mono(.alpha.-lower alkyl)acrylate having an acid-dissociable dissolution-inhibiting group,
7491485 Resist composition and method of forming resist pattern February 17, 2009
This resist composition according to the present invention includes a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid, and an acid generator component (B) which generates an acid upon exposure, wherein the acid generator componen
7488568 Resist composition, method of forming resist pattern, compound and acid generator February 10, 2009
A resist composition including a base component (A) and an acid-generator component (B), the acid-generator component (B) including an acid generator (B1) including a compound represented by general formula (b1-8) shown below (wherein R.sup.401 represents an acid dissociable, dissolu
7482108 Polymer compound, acid generator, positive resist composition, and method for formation of resis January 27, 2009
The invention provides a polymer compound capable of forming a positive resist composition that can form a high-resolution pattern with a reduced level of LER, an acid generator formed from such a polymer compound, a positive resist composition that includes such a polymer compound, and
7462436 Positive photoresist composition and method of forming resist pattern December 9, 2008
There is provided a positive photoresist composition capable of forming a pattern with excellent resolution, excellent resistance to reflection off the substrate, and excellent perpendicularity. The positive photoresist composition comprises (A) an alkali-soluble novolak resin in which a
7449276 Positive photoresist composition and method for forming resist pattern November 11, 2008
The invention provides a positive photoresist composition which exhibits a high level of etching resistance and attains high resolution, and enables the formation of a fine pattern using an electron beam exposure step, as well as a method for forming a resist pattern that uses the positi
7442675 Cleaning composition and method of cleaning semiconductor substrate October 28, 2008
A cleaning composition comprises at least quaternary ammonium hydroxide, a water-soluble organic solvent, water, an anticorrosive, and potassium hydroxide of 1 mass percent or less of a total amount of the solution. This cleaning composition can singly and effectively remove a photoresis
7435530 Positive type resist composition and resist pattern formation method using same October 14, 2008
A positive type resin composition comprising (A) a resin component comprising within the principal chain a structural unit derived from a (meth)acrylate ester and incorporating an acid dissociable, dissolution inhibiting group containing a polycyclic group on an ester side chain sect
7422839 Resin for positive resist composition, and positive resist composition using the same, laminate September 9, 2008
The use of a positive resist composition that includes a resin with a specific structure improves the resolution and yields a resist pattern with a favorable shape. In addition, when a resist layer is formed on either a magnetic film or a metallic oxidation prevention film formed on
7419769 Negative photoresist compositions for the formation of thick films, photoresist films and method September 2, 2008
A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 to 100 .mu.m thick.
7416832 Positive resist composition August 26, 2008
A positive resist composition capable of forming a resist pattern having excellent shape is provided. This composition is a positive resist composition including a base resin component (A) and an acid generator component (B) generating an acid under exposure, which are dissolved in a
7407739 Resist developer and resist pattern formation method using same August 5, 2008
A resist developer capable of forming a high resolution resist pattern with good shape and little film thinning is provided, together with a resist pattern formation method using such a developer. The resist developer is an aqueous solution comprising an ammonium hydroxide represente
7407734 Resist composition for electron beam or EUV August 5, 2008
A resist composition and a method of forming a resist pattern that enable contamination within the exposure apparatus to be prevented in lithography processes using an electron beam or EUV (extreme ultraviolet light). In this method, an organic solvent containing, as the principal co
7402376 Photosensitive resin composition and photosensitive dry film containing the same July 22, 2008
A photosensitive resin composition which gives a dry film having a sand blast proof property and a development property in a well-balanced manner. A photosensitive resin composition containing a carboxy group-containing urethane (meth)acrylate compound having two or more of (meth)acr
7402372 Positive resist composition and method of forming resist pattern July 22, 2008
A positive resist composition includes a resin (A) that increases alkali solubility due to action of an acid, wherein the resin comprises a copolymer containing a first structural unit (a1) derived from hydroxystyrene, and a second structural unit (a2) derived from a (meth)acrylate w
7399575 Laminated photosensitive relief printing original plate and method for producing the relief prin July 15, 2008
A relief printing original plate including a substrate, a photosensitive resin layer thereon that is photosensitive to ultraviolet radiations, and a mask layer thereon having both ultraviolet and non-ultraviolet absorbability, the ultraviolet absorbability being deactivatable in resp
7390612 Positive type resist composition and resist pattern formation method using same June 24, 2008
There is provided a positive type resin composition comprising (A) a resin component comprising within the principal chain a structural unit derived from a (meth)acrylate ester and incorporating an acid dissociable, dissolution inhibiting group containing a polycyclic group on an ester
7371510 Material for forming resist protecting film for use in liquid immersion lithography process, com May 13, 2008
Provided are a material for forming a resist protecting film which is for use in a liquid immersion lithography process and which is formed on a resist film, wherein the material has the following properties of: being transparent with respect to exposure light; having substantially no
7364831 Positive resist composition and resist pattern formation method April 29, 2008
A positive resist composition includes a resin component (A) whose alkaline solubility changes by an action of an acid, an acid generator component (B), and polypropylene glycol, wherein the component (A) includes a resin component (A1) including a constitutional unit (a1) represente
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