| Patent Number |
Title Of Patent |
Date Issued |
| 7431071 |
Fluid circuit heat transfer device for plural heat sources |
October 7, 2008 |
| A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive material to which the |
| 7414844 |
Liquid cooled heat sink with cold plate retention mechanism |
August 19, 2008 |
| A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to |
| 7407083 |
Bonded silicon, components and a method of fabricating the same |
August 5, 2008 |
| A heat pipe housing assembly (22) includes a pair of silicon housing pieces (24, 26) and a bond joint (42) between the housings (24, 26), with the bond joint (42) preferably including a eutectic layer (43). |
| 7306028 |
Modular heat sink |
December 11, 2007 |
| A modular based heat sink which can be easily optimized for a given heat source relies upon both phase change based heat transfer and condenser modules that combine the efficiency of folded fin cooling and the efficiency of the two phase heat transfer. |
| 7159649 |
Air-to-air heat exchanger |
January 9, 2007 |
| An air-to-air heat exchanger, is provided that comprises a folded fin core formed from a continuous sheet of thermally conductive material that has been folded into alternating flat ridges and troughs; an insert overlay having an opening including two sets of uniform fingers, wherein eac |
| 7149087 |
Liquid cooled heat sink with cold plate retention mechanism |
December 12, 2006 |
| A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to |
| 7143818 |
Heat pipe evaporator with porous valve |
December 5, 2006 |
| An evaporator includes an enclosure having a fluid inlet manifold and a vapor outlet manifold. At least one blind passageway is arranged within the enclosure so as to open into a portion of the vapor outlet manifold. The interior surface of the enclosure that defines each passageway is |
| 7143511 |
Method of forming a heat pipe |
December 5, 2006 |
| A method for forming a heat pipe is provided comprising coating the interior surface of the vessel with a wicking material and partially saturating the wick with a working fluid. The vessel is then partially evacuated. A portion of the vessel is pinched-off so as to seal the vessel. |
| 7137443 |
Brazed wick for a heat transfer device and method of making same |
November 21, 2006 |
| A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. In this way, a network of |
| 7129731 |
Heat pipe with chilled liquid condenser system for burn-in testing |
October 31, 2006 |
| A burn-in testing cooling system includes a heat pipe having a tubular body. A capillary wick is disposed on an evaporator portion of the tubular body, and a base seals off the evaporator portion. The base is sized and shaped so as to be releasably thermally engaged with a semiconduc |
| 7124809 |
Brazed wick for a heat transfer device |
October 24, 2006 |
| A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. In this way, a network of |
| 7117930 |
Heat pipe fin stack with extruded base |
October 10, 2006 |
| A heat sink has a base plate to be clamped against a heat source and one or more heat pipes containing a phase change fluid. Each heat pipe has an elongated tubular evaporator fitted in a channel in the base plate, and a columnar condenser part perpendicular to the base plate forming a |
| 7111394 |
Hybrid loop heat pipe |
September 26, 2006 |
| A heat pipe assembly (100) has a combined reservoir (102) and evaporator (104), the evaporator (104) having ducts of a vapor manifold (106) that exhausts vapor toward the condenser (108) instead of opposing the flow of liquid condensate to the reservoir (102), and the evaporator (104) ha |
| 7100680 |
Integrated circuit heat pipe heat spreader with through mounting holes |
September 5, 2006 |
| The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they |
| 7100679 |
Integrated circuit heat pipe heat spreader with through mounting holes |
September 5, 2006 |
| A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located |
| 7096928 |
Flexible loop thermosyphon |
August 29, 2006 |
| A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor |
| 7090002 |
Deformable end cap for heat pipe |
August 15, 2006 |
| A heat pipe is provided having a vessel with a closed first end, a second end, and a wick on an inner surface that defines a passageway. A convex wall is positioned at the second end so as to block the passageway. The convex wall is deformable so as to move from a first position wherein |
| 7080681 |
Heat pipe component deployed from a compact volume |
July 25, 2006 |
| A component of a heat pipe assembly (100) has hollow fluid transport sections (108) communicating with hollow bendable fluid transport sections (110); the bendable fluid transport sections (110) being bendable to deploy the transport sections (108) from a compact volume. |
| 7071408 |
Thermal management system and method for electronics system |
July 4, 2006 |
| A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat |
| 7069978 |
Chemically compatible, lightweight heat pipe |
July 4, 2006 |
| The present invention provides an apparatus including a magnesium alloy vessel that is substantially free of aluminum and zinc, but including magnesium in combination with a gettering metal. The magnesium alloy vessel has a hollow interior cavity containing a working fluid, with a st |
| 7066240 |
Integrated circuit heat pipe heat spreader with through mounting holes |
June 27, 2006 |
| The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they |
| 7048039 |
CTE-matched heat pipe |
May 23, 2006 |
| A heat pipe having a mounting surface with a coefficient of thermal expansion matching that of silicon is disclosed, the heat pipe including a base containing aluminum nitride, a metal body, and a metal wick. |
| 7044199 |
Porous media cold plate |
May 16, 2006 |
| A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet openin |
| 7028760 |
Integrated circuit heat pipe heat spreader with through mounting holes |
April 18, 2006 |
| A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each |
| 7028759 |
Heat transfer device and method of making same |
April 18, 2006 |
| A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles and one or more vapor vents |
| 7013958 |
Sintered grooved wick with particle web |
March 21, 2006 |
| A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle lay |
| 7013956 |
Heat pipe evaporator with porous valve |
March 21, 2006 |
| An evaporator includes an enclosure having a fluid inlet manifold and a vapor outlet manifold. At least one blind passageway is arranged within the enclosure so as to open into a portion of the vapor outlet manifold. The interior surface of the enclosure that defines each passageway is |
| 7013955 |
Flexible loop thermosyphon |
March 21, 2006 |
| A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor |
| 7005738 |
Semiconductor package with lid heat spreader |
February 28, 2006 |
| The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device |
| 6997245 |
Vapor chamber with sintered grooved wick |
February 14, 2006 |
| A heat pipe heat spreader is provided having a substantially L-shaped enclosure with an internal surface and a plurality of post projecting from the surface. A working fluid is disposed within the enclosure, and a grooved wick is formed on at least a portion of the internal surface. The |
| 6994152 |
Brazed wick for a heat transfer device |
February 7, 2006 |
| A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. In this way, a network of |
| 6972365 |
Thermal management system and method for electronics system |
December 6, 2005 |
| A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat s |
| 6966361 |
Bi-level heat sink |
November 22, 2005 |
| A bi-level assembly comprises a heat sink, a processor and a power supply. The heat sink includes a base and at least one fin structure attached to the base. The base may be a plate with attached heat pipes or the base may be a vapor chamber. The base is connected to the top of the proce |
| 6945317 |
Sintered grooved wick with particle web |
September 20, 2005 |
| A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle lay |
| 6938680 |
Tower heat sink with sintered grooved wick |
September 6, 2005 |
| A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular enclosure is sealed at one end by a base having a |
| 6926072 |
Hybrid loop heat pipe |
August 9, 2005 |
| A heat pipe assembly (100) has a combined reservoir (102) and evaporator (104), the evaporator (104) having ducts of a vapor manifold (106) that exhausts vapor toward the condenser (108) instead of opposing the flow of liquid condensate to the reservoir (102), and the evaporator (104) ha |
| 6907918 |
Deformable end cap for heat pipe |
June 21, 2005 |
| A heat pipe is provided having a vessel with a closed first end, a second end, and a wick on an inner surface that defines a passageway. A convex wall is positioned at the second end so as to block the passageway. The convex wall is deformable so as to move from a first position wherein |
| 6905499 |
Heat pipe for cautery surgical Instrument |
June 14, 2005 |
| A heat pipe for a cautery surgical instrument such as a surgical forceps including a pair of elongate arms joined at an end so as to provide for resilient compressible movement of the arms between a normally open position and a squeezed closed position. The heat pipe provides for con |
| 6896039 |
Integrated circuit heat pipe heat spreader with through mounting holes |
May 24, 2005 |
| A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each |
| 6889755 |
Heat pipe having a wick structure containing phase change materials |
May 10, 2005 |
| A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly |
| 6883594 |
Cooling system for electronics with improved thermal interface |
April 26, 2005 |
| A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from |
| 6880626 |
Vapor chamber with sintered grooved wick |
April 19, 2005 |
| A heat pipe heat spreader is provided having a substantially L-shaped enclosure with an internal surface and a plurality of post projecting from the surface. A working fluid is disposed within the enclosure, and a grooved wick is formed on at least a portion of the internal surface. The |
| 6858929 |
Semiconductor package with lid heat spreader |
February 22, 2005 |
| The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device |
| 6830098 |
Heat pipe fin stack with extruded base |
December 14, 2004 |
| A heat sink has a base plate to be clamped against a heat source and one or more heat pipes containing a phase change fluid. Each heat pipe has an elongated tubular evaporator fitted in a channel in the base plate, and a columnar condenser part perpendicular to the base plate forming a |
| 6817097 |
Flat plate fuel cell cooler |
November 16, 2004 |
| A heat pipe assembly includes a base plate and a corrugated lid joined to the base plate to form a plurality of tubes between the base plate and the corrugated lid. Each of the plurality of tubes forms an envelope of a respective heat pipe within the heat pipe assembly. The heat pipe ass |
| 6808011 |
Heat pipe system for cooling flywheel energy storage systems |
October 26, 2004 |
| A system for cooling a canister has first, second and third heat pipes. The first heat pipe has an evaporator and a condenser. The first heat pipe is mounted with its evaporator inside the canister and its condenser outside the canister. The second heat pipe has an evaporator conductivel |
| 6804117 |
Thermal bus for electronics systems |
October 12, 2004 |
| A thermal management system for an electronic device is provided a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from the heat generating structure. |
| 6802362 |
Fin with elongated hole and heat pipe with elongated cross section |
October 12, 2004 |
| An assembly includes a heat pipe and one or more fins. The heat pipe has an envelope with two elongated flat sides and two curved portions connecting the flat sides. The elongated sides have a length that is substantially greater than the radius of curvature of the curved portions. Each |
| 6800077 |
Heat pipe for cautery surgical instrument |
October 5, 2004 |
| A heat pipe for a cautery surgical instrument such as a surgical forceps including a pair of elongate arms joined at an end so as to provide for resilient compressible movement of the arms between a normally open position and a squeezed closed position. The heat pipe provides for con |
| 6793009 |
CTE-matched heat pipe |
September 21, 2004 |
| A heat pipe having a mounting surface with a coefficient of thermal expansion matching that of silicon is disclosed, the heat pipe including a base containing aluminum nitride, a metal body, and a metal wick. |
