| Patent Number |
Title Of Patent |
Date Issued |
| 6261962 |
Method of surface treatment of semiconductor substrates |
July 17, 2001 |
| A sidewall passivation layer is deposited on an etched feature in a semiconductor substrate with a hydrocarbon deposition gas by introducing H.sub.2, determining certain mixture percentages for the hydrocarbon gas/H.sub.2 mix at which the etch rate for the substrate peaks, the etch r |
| 6259209 |
Plasma processing apparatus with coils in dielectric windows |
July 10, 2001 |
| A wafer processing chamber 11 includes a wafer support 12, a dielectyric window 13 and coaxial coils 15 and 16 located outside the dielectric window 13 for inducing a plasma within the chamber. A variety of coil/dielectric windows are described together with protocols for their contr |
| 6239404 |
Plasma processing apparatus |
May 29, 2001 |
| Plasma processing apparatus frequently incorporates an antenna fed from a power supply and in this invention a power supply feeds a conventional matching circuit (10), which in turn is connected to the primary (11) of a transformer (12). The antenna (15) is coupled across the secondary w |
| 6187685 |
Method and apparatus for etching a substrate |
February 13, 2001 |
| There is disclosed a method and apparatus for etching a substrate. The method comprises the steps of etching a substrate or alternately etching and depositing a passivation layer. A bias frequency, which may be pulsed, may be applied to the substrate and may be at or below the ion plasma |
| 6051503 |
Method of surface treatment of semiconductor substrates |
April 18, 2000 |
| This invention relates to methods for treatment of semiconductor substrates and in particular a method of etching a trench in a semiconductor substrate in a reactor chamber using alternatively reactive ion etching and depositing a passivation layer by chemical vapour deposition, wherein |
| 5330301 |
Loading mechanisms |
July 19, 1994 |
| A processing apparatus 10 has chambers 11 and 12 and a loading mechanism 13 for transferring workpieces into and out of the chambers. The workpieces are carried on a pallet 16 which is slotted so that, when it is inserted into the chambers 11 or 12 the slots are aligned with lines A-H on |
