| Patent Number |
Title Of Patent |
Date Issued |
| 7144385 |
Discharging implement for medical care |
December 5, 2006 |
| For safely inserting a catheter into a chest cavity of a child or corpulent patient to be retained therein and for preventing atmospheric air from proceeding into the chest cavity during a removal of a penetrating needle, discharge equipment for medical procedures is provided which e |
| 7077640 |
Method of and apparatus for manufacturing molded materials of thermosetting resin composition |
July 18, 2006 |
| A method of manufacturing molded materials of a thermosetting resin composition in a method of granulating a molding material of the thermosetting resin composition, in which a sheet producing step for transferring the molding material in a molten state to a subsequent stage while pr |
| 7074738 |
Curing accelerator, epoxy resin composition, and semiconductor device |
July 11, 2006 |
| A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provid |
| 6946421 |
Latent catalyst |
September 20, 2005 |
| This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a la |
| 6908717 |
Positive photosensitive resin composition, process for its preparation, and semiconductor device |
June 21, 2005 |
| The present invention provides a positve photosensitive resin composition of high sensitivity which can form a pattern of high resolution and high residual film ration and which can give a cured film superior in mechanical properties, adhesivity and water absorptivity. That is, the p |
| 6838030 |
Method of and apparatus for manufacturing molded materials of thermosetting resin composition |
January 4, 2005 |
| A method of manufacturing molded materials of a thermosetting resin composition in a method of granulating a molding material of the thermosetting resin composition, in which a sheet producing step for transferring the molding material in a molten state to a subsequent stage while pr |
| 6831146 |
Resin composition for use in manufacturing wet friction materials and wet friction material |
December 14, 2004 |
| A resin composition for wet friction materials contains as a main component a phenolic resin formed as a result of the reaction between phenols and aldehydes in the presence of a basic catalyst, and a particulate filler having a specific surface area of 35 to 410 m.sup.2 /g as an additiv |
| 6787224 |
Cover tape for packaging electronic components |
September 7, 2004 |
| A cover tape for packaging electronic components, which can prevent troubles associated with the peeling strength or trouble appearing during mounting of the electronic components, which can be produced at a low cost, and which is transparent; that is, a cover tape has a peeling stre |
| 6780960 |
Method of making a polyimide in a low-boiling solvent |
August 24, 2004 |
| A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80.degree. C. and about 160.degree. C. is prepared. The solution or slurry is hea |
| 6765051 |
Phenol resin forming material for pulley used in motor vehicles and phenol resin pulley for moto |
July 20, 2004 |
| A phenol resin composition for forming pulleys used in motor vehicles is disclosed. The composition comprises 35 to 45 wt % of resol, 35 to 45 wt % of glass fiber, 5 to 15 wt % of one or more inorganic powders selected from the group consisting of calcium carbonate, clay, and wallastonit |
| 6750315 |
Polyether aromatic ketone resin composition and its film and sheet |
June 15, 2004 |
| The present invention is envisioned to improve sliding characteristics of polyether aromatic ketone resins and to provide their molded articles which are themselves resistant to damage and abrasion, cause no such damage or abrasion to their partner parts and can be easily molded. Thus, |
| 6733901 |
Process for production of epoxy resin composition for semiconductor encapsulation, epoxy resin c |
May 11, 2004 |
| The present invention provides a process for producing an epoxy resin composition for semiconductor encapsulation which, when used in encapsulation of a semiconductor chip, can minimize voids appearing in the semiconductor device obtained. That is, the present invention provides a pr |
| 6688472 |
Container for electric device |
February 10, 2004 |
| A container for receiving an electric device in a recess. The container includes a pair of projections for restraining a movement of the electric device in a first direction perpendicular to a second direction and directed from a top opening area of the recess toward a bottom area of the |
| 6667104 |
Phenol resin composition for wet friction material and wet friction material |
December 23, 2003 |
| A phenol resin composition for wet friction material comprising a curable resin composition obtained by mixing a resol-type phenol resin and a hydrolysis solution of an alkoxysilane or a condensate thereof, wherein the ratio by weight of the nonvolatile components of the resol-type pheno |
| 6664344 |
Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular associ |
December 16, 2003 |
| The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That is, the present invention is an epoxy resin composition comprising a compound (A) having t |
| 6639307 |
Cover tape for packaging electronic elements |
October 28, 2003 |
| A cover tape for packaging electronic elements capable of being heat-sealed to a polycarbonate carrier tape having regularly formed pockets for containing electronic elements, which cover tape comprises (A) a substrate layer comprising a thermoplastic resin having a load deflection t |
| 6635138 |
Method of immobilizing circuitry fingers |
October 21, 2003 |
| Disclosed is a method of immobilizing the fingers of circuitry. A coating is formed of a liquid adhesive on the surface of a release film in a pattern of strips in positions perpendicular to and across the positions the fingers of the circuitry will have when the pattern of adhesive is |
| 6632523 |
Low temperature bonding adhesive composition |
October 14, 2003 |
| An adhesive composition that bonds at low temperatures is disclosed. The composition is a solution in an organic solvent of a polyimide, an epoxy resin, and a cyanate. The polyimide can be a polyimidesiloxane, made from a dianhydride, an aromatic diamine that does not contain siloxane, a |
| 6631861 |
Grinding device for resin composition |
October 14, 2003 |
| In a rotor 1 provided with a cylinder 2 which can supply a molten and mixed resin composition to an upper portion of the rotor 1 from an opening portion and is formed by a magnetic material on an outer periphery thereof or is formed by a nonmagnetic material being contact with a magnetic |
| 6613699 |
Process for producing a semiconductor device |
September 2, 2003 |
| A process for producing a semiconductor device which comprises forming a layer of an organic polymer resin on a surface of a semiconductor element, treating the formed layer by pattern working and curing, etching the element using the patterned and cured layer as a mask, exposing an |
| 6592802 |
Process for production of polymer sheet and optical polymer sheet |
July 15, 2003 |
| The present invention provides a process for continuously producing a polymer sheet having an excellent surface smoothness, an apparatus for producing such a polymer sheet, and an optical polymer sheet produced by such a process. The process for producing a polymer sheet comprises co |
| 6579160 |
Holder for polished work and manufacturing method thereof |
June 17, 2003 |
| The inner circumferential surface of through holes in a metal plate is chamfered or put to anchor fabrication and a thermoplastic resin is injection molding to the inner circumferential surface of the through hole thereby forming a resin portion over the entire surface of the through |
| 6569513 |
Prepreg and process for manufacturing same |
May 27, 2003 |
| A prepreg exhibiting excellent formability and producing laminated boards and multiple layer circuit boards exhibiting high thickness precision is disclosed. The prepreg comprises an inner layer made from a glass fiber substrate, having a weight of 40 g or more and less than 115 g per sq |
| 6559218 |
Phenol resin forming material for pulley used in motor vehicles and phenol resin pulley for moto |
May 6, 2003 |
| A phenol resin composition for forming pulleys used in motor vehicles is disclosed. The composition comprises 35 to 45 wt % of resol, 35 to 45 wt % of glass fiber, 5 to 15 wt % of one or more inorganic powders selected from the group consisting of calcium carbonate, clay, and wallastonit |
| 6555174 |
Process for manufacturing prepreg |
April 29, 2003 |
| A process for manufacturing a prepreg exhibiting excellent formability and producing laminated boards and multiple layer circuit boards exhibiting high thickness precision is disclosed. The process of manufacturing the prepreg comprises (a) a step of impregnating a glass fiber substrate |
| 6551714 |
Flame-retardant resin composition, and prepregs and laminates using such composition |
April 22, 2003 |
| The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition. More specifically, the present invention provides a flame-retardant resin composition |
| 6538100 |
Method for producing polyimide resin |
March 25, 2003 |
| The object of the present invention is to provide a method capable of producing polyimide resins having excellent heat resistance, which can utilize inexpensive monomers and does not use solvents. The method comprises mixing, in the absence of a solvent, a diamine and at least one te |
| 6524989 |
Tetraorganophosponium dicyclic tetraorganoborate catalyst |
February 25, 2003 |
| This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a la |
| 6495260 |
Method of producing epoxy for molding semiconductor device, molding material, and semiconductor |
December 17, 2002 |
| The present invention provides a process for producing an epoxy resin molding material for semiconductor encapsulation, which is very low in voids generation; a molding material produced by the process; and a semiconductor device obtained by encapsulation with the molding material. T |
| 6486242 |
Flame-retardant resin composition and prepreg and laminate using the same |
November 26, 2002 |
| The present invention provides a flame-retardant resin composition having high flame retardancy without using any halogen compound and suited for printed circuit boards. Specifically, it provides a flame-retardant resin composition containing as its essential constituents: (A) a novol |
| 6483195 |
Transfer bump street, semiconductor flip chip and method of producing same |
November 19, 2002 |
| The invention relates to a low-cost transfer bump sheet which is capable of transferring copper-cored solder bumps with high reliability of bonding to a semiconductor chip and which is capable of transferring bumps of various structures. The invention also relates to a low-cost semicondu |
| 6469077 |
Polyphenylene ether resin composition |
October 22, 2002 |
| There is provided a polyphenylene ether resin composition, comprising: a component (A) containing a polyphenylene ether resin; a component (B) containing a phosphate compound represented by the following formula (I); and a component (C) containing a condensed phosphate compound represen |
| 6451955 |
Method of making a polyimide in a low-boiling solvent |
September 17, 2002 |
| A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80.degree. C. and about 160.degree. C. is prepared. The solution or slurry is hea |
| 6447915 |
Interlaminar insulating adhesive for multilayer printed circuit board |
September 10, 2002 |
| In order to provide a multilayer printed circuit board having a fine pitch circuit, the interlaminar insulating adhesive used therein must have heat resistance and low thermal expansion coefficient so that required accuracy can be obtained during circuit formation and mounting of compone |
| 6423815 |
Layer insulating film for multilayer interconnection, resin used therefor and process for produc |
July 23, 2002 |
| The present invention provides a layer insulating film for multilayer interconnection of semiconductors which is excellent in resistance to heat, resistance to moisture absorption as well as in electric characteristic properties, and a process for producing the film. That is, a layer |
| 6410677 |
Resin composition for insulating material, and insulating material produced from said resin comp |
June 25, 2002 |
| The present invention provides an insulating material showing excellent thermal propeties and electrical properties in semiconductor applications. That is, the present invention provides: a resin composition for insulating material, comprising, as essential components: (A) a compound |
| 6410623 |
Thermoplastic elastomer resin composition |
June 25, 2002 |
| A thermoplastic elastomer resin composition that is flexible and has superior wear resistant, oil resistant and appearance suited for automotive interior materials, and does not contain chlorine. The composition contains (a) 100 parts by weight of a block polymer composed of at least |
| 6380271 |
Material for electrical insulating organic film, electrical insulating organic film and process |
April 30, 2002 |
| The present invention provides a material for electrical insulating organic film, superior in electrical properties, thermal properties and low water absorption; an electrical insulating organic film made from the material; and a process for production of the film. That is, the present i |
| 6363539 |
Composite helmet |
April 2, 2002 |
| A helmet body is mounted or fixed detachably or undetachably a hollow molding or a ceramic-fixed hollow molding to enhance the impact resistance of the helmet body and weight-save the composite helmet, thereby increasing the adaptability. The composite helmet has excellent impact res |
| 6355195 |
Process for producing of phenolic resin-made pulley |
March 12, 2002 |
| The invention provides a process for producing a phenolic resin-made pulley having a metal insert embedded therein. The process includes a step of sealing a gate of a mold with a gate-sealing pin, and simultaneously therewith or thereafter moving forward the part or the whole of a movabl |
| 6306792 |
Evaluating moisture resistance reliability of phosphonium borate catalyst |
October 23, 2001 |
| The moisture resistance reliability of a latent catalyst is evaluated for a phosphonium borate wherein at least one group pendant on the boron atom is a group formed when a proton donor having at least one proton capable of being liberated out of the molecule has liberated one or at leas |
| 6297351 |
Polybenzoxazole resin and precursor thereof |
October 2, 2001 |
| A polybenzoxazole precursor having recurring units represented by the following general formula (1) and a polybenzoxazole resin having a structure obtained by cyclizing the polybenzoxazole precursor: ##STR1##wherein n denotes an integer of 1-1000, and (i) when X is selected from biva |
| 6296940 |
Laminate comprising a flame-retardant resin composition |
October 2, 2001 |
| The present invention provides a flame-retardant resin composition comprising:(A) an epoxy resin other than halogenated epoxy resins, having at least two epoxy groups in the molecule,(B) a curing agent, and(C) a product obtained by reacting (C1) a phosphorus compound having at least one |
| 6290677 |
Medicinal liquid injection port |
September 18, 2001 |
| A medicinal liquid injection port having an internal space for storing a medicinal liquid, a medicinal liquid inlet which communicates with the internal space, a septum which seals the medicinal liquid inlet, a medicinal liquid outflow path which communicates with the internal space, |
| 6284440 |
Alkaline aqueous solution and method for forming pattern of photosensitive resin composition usi |
September 4, 2001 |
| The present invention provides a method for formation of a pattern of a photosensitive resin composition, which method is superior in sensitivity and film-thinning ratio, generates no scum in pattern formation, and gives a high resolution. That is, the present invention lies in a method |
| 6265041 |
Cover sheet for PTP |
July 24, 2001 |
| The present invention provides a cover sheet for PTP which is not needed to be separated from the base material after use of PTP and is convenient in recycling and disposal after use and advantageous for environmental protection and which is excellent in push-through property. This cover |
| 6242110 |
Epoxy resin composition and semiconductor device using the same |
June 5, 2001 |
| The present invention provides an epoxy resin composition for encapsulating a semiconductor, which has excellent flame retardancy without containing any flame retardant such as halogen type, antimony trioxide or the like. The present invention lies in an epoxy resin composition for encap |
| 6235867 |
Aligning agents for liquid crystal |
May 22, 2001 |
| The present invention provides a liquid crystal-aligning agent including, as the resin component, a polyimide precursor containing a chemical structure represented by the following formula (1): ##STR1##The present invention further provides a liquid crystal-aligning agent including, |
| 6235436 |
Semiconductor device using positive photosensitive resin composition and process for preparation |
May 22, 2001 |
| A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): ##STR1##wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a divalent group represented by |
| 6216424 |
Methods for producing a self-supporting bag and package |
April 17, 2001 |
| The present invention provides, at low cost, a self-supporting package which is excellent in heat resistance and can be sterilized at high temperatures and the content of which is drunk through a straw. That is, the present invention provides a self-supporting bag which comprises front |
