| Patent Number |
Title Of Patent |
Date Issued |
| 7249992 |
Method, apparatus and system for use in processing wafers |
July 31, 2007 |
| The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage devi |
| 7238083 |
Wafer carrier with pressurized membrane and retaining ring actuator |
July 3, 2007 |
| A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. An inflatable memb |
| 7235154 |
Devices and methods for optical endpoint detection during semiconductor wafer polishing |
June 26, 2007 |
| A method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an optical sensor disposed within the polishing pad. The intensity of the reflected light is measured by a light detector |
| 7195541 |
Endpoint detection system for wafer polishing |
March 27, 2007 |
| An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off th |
| 7160808 |
Chuck for supporting wafers with a fluid |
January 9, 2007 |
| A method of relieving surface stress on a thin wafer by removing a small portion of the wafer substrate, the substrate being removed by applying a warm solution of KOH to the backside of the wafer while the wafer spins. The wafer may be supported on a rotatable platform adapted to direct |
| 7156946 |
Wafer carrier pivot mechanism |
January 2, 2007 |
| A pivoting wafer carrier having a minimum of internal friction and a smooth, continuous pivoting motion. The pivot mechanism includes a lower ring mounted on a pressure plate, an upper ring mounted on a housing upper plate and ball transfer units disposed on the lower ring. Correspon |
| 7131892 |
Wafer carrier with pressurized membrane and retaining ring actuator |
November 7, 2006 |
| A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. An inflatable memb |
| 7063605 |
Retaining ring for wafer carriers |
June 20, 2006 |
| A long-lasting retaining ring for wafer carriers used in chemical mechanical planarization. A groove is disposed around the retaining ring, with the groove opening facing the mounting plate. A ridge is disposed in the groove. A bladder is disposed in the groove and is pressed between |
| 7063604 |
Independent edge control for CMP carriers |
June 20, 2006 |
| A wafer carrier for controlling the edge effect during chemical mechanical planarization. A first bladder is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. A second bladder is disposed within the carrier |
| 7059942 |
Method of backgrinding wafers while leaving backgrinding tape on a chuck |
June 13, 2006 |
| A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rinsed on the backside, removed from the tape and then |
| 7052366 |
Endpoint detection system for wafer polishing |
May 30, 2006 |
| An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off th |
| 7040955 |
Chemical-mechanical planarization tool force calibration method and system |
May 9, 2006 |
| The methods and devices described below allow users of CMP tools to quickly calibrate Spindle Force, Wafer Force, and Retaining Ring Force using mechanisms, load cells, a control computer, and force equations. The control computer can test a variety of pressures in the inflatable sea |
| 7033252 |
Wafer carrier with pressurized membrane and retaining ring actuator |
April 25, 2006 |
| A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. An inflatable memb |
| 7018268 |
Protection of work piece during surface processing |
March 28, 2006 |
| The present invention provides an apparatus and method for protecting a work piece during surface processing. The apparatus employs a protective material to protect a wafer during backside grinding. The apparatus can further include a vacuum chuck that allows the passage of a vacuum |
| 7008309 |
Back pressure control system for CMP and wafer polishing |
March 7, 2006 |
| A wafer carrier with a back pressure applicator system adapted to provide high resolution back pressure control. A plurality of millimeter scale distensible elements are disposed between the wafer carrier pressure plate and a process wafer, and selectively distended to provide excess |
| 6986701 |
Polishing pad with built-in optical sensor |
January 17, 2006 |
| An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The ele |
| 6976901 |
In situ feature height measurement |
December 20, 2005 |
| Embodiments of the invention provide methods and apparatus for in situ feature height measurement of an object being planarized. In one embodiment, a method of planarizing an object comprises polishing a surface of the object to be planarized using a polishing pad having a cavity; an |
| 6945856 |
Subaperture chemical mechanical planarization with polishing pad conditioning |
September 20, 2005 |
| Embodiments of the present invention are directed to polishing an object with polishing pad conditioning. In one embodiment, a method for polishing an object comprises placing a contact portion of a polishing pad in contact with a target surface of the object to be planarized over a |
| 6887133 |
Pad support method for chemical mechanical planarization |
May 3, 2005 |
| Embodiments of the invention as directed to supporting a polishing pad that can be easily replaced. In one embodiment, a method for polishing an object comprises coupling a polishing head to a substrate for holding a polishing pad which is smaller in area than the object; applying a |
| 6885206 |
Device for supporting thin semiconductor wafers |
April 26, 2005 |
| A device for supporting and securing thin wafers comprising a housing having an upper shelf extending radially inwardly from the housing and a lower shelf extending radially inwardly from the upper shelf. An upper seal is disposed within the upper shelf and an inspection windowpane is |
| 6884150 |
Polishing pad sensor assembly with a damping pad |
April 26, 2005 |
| A polishing pad having an optical assembly that does not cause excess wear on a wafer workpiece. The optical assembly is disposed within the pad such that it may move in response to forces applied to the optical assembly. A damping pad may be disposed on the optical assembly to reduce vi |
| 6878037 |
Slurry pump control system |
April 12, 2005 |
| A CMP slurry pumping system and method which uses the slurry pump inlet pressure as input to the pump controller, and the controller adjusts pump speed to account for variations in inlet pressure. |
| 6869348 |
Retaining ring for wafer carriers |
March 22, 2005 |
| A long-lasting retaining ring for wafer carriers used in chemical mechanical planarization. A groove is disposed around the retaining ring, with the groove opening facing the mounting plate. A ridge is disposed in the groove. A bladder is disposed in the groove and is pressed between the |
| 6866564 |
Method of backgrinding wafers while leaving backgrinding tape on a chuck |
March 15, 2005 |
| A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, and then removed from the tape. A tool for applying tap |
| 6855030 |
Modular method for chemical mechanical planarization |
February 15, 2005 |
| Specific embodiments of the present invention are directed to a method of operating a modular chemical mechanical planarization process. The method comprises operating CMP apparatus comprising a docking station having at least one CMP module and at least one cleaning module to process on |
| 6743722 |
Method of spin etching wafers with an alkali solution |
June 1, 2004 |
| A method of relieving surface stress on a thin wafer by removing a small portion of the wafer substrate, the substrate being removed by applying a solution of KOH to the wafer while the wafer spins. |
| 6739945 |
Polishing pad with built-in optical sensor |
May 25, 2004 |
| An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electri |
| 6726528 |
Polishing pad with optical sensor |
April 27, 2004 |
| A polishing pad having an optical assembly that does not cause excess wear on a wafer workpiece. The optical assembly is disposed within the pad such that it may move in response to forces applied to the optical assembly. |
| 6696005 |
Method for making a polishing pad with built-in optical sensor |
February 24, 2004 |
| An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electri |
| 6695681 |
Endpoint detection system for wafer polishing |
February 24, 2004 |
| An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off th |
| 6692339 |
Combined chemical mechanical planarization and cleaning |
February 17, 2004 |
| Specific embodiments of the present invention provide a method for chemical-mechanical planarization of an object. The method comprises performing a first planarization of the object using a first polishing pad having a smaller surface area than the object being planarized in a proce |
| 6638389 |
Method for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, |
October 28, 2003 |
| A tool and method for applying an insert to the face of a chuck so that holes in the insert register with holes in the chuck, includes a removable vacuum chamber that is brought into sealing engagement with the chuck and that is indexed with respect to the chuck by means of locating pins |
| 6629874 |
Feature height measurement during CMP |
October 7, 2003 |
| Embodiments of the present invention provide a chemical-mechanical planarization method for planarizing a wafer. The method comprises polishing a surface of the wafer to be planarized, and optically measuring feature heights of features on the surface of the wafer to obtain measureme |
| 6602121 |
Pad support apparatus for chemical mechanical planarization |
August 5, 2003 |
| A system for chemical mechanical planarization comprises a platen assembly for holding an object to be planarized and a polishing head comprising a puck holder assembly for coupling to a substrate for holding a polishing pad. The polishing pad is smaller in surface area than the object. |
| 6551179 |
Hard polishing pad for chemical mechanical planarization |
April 22, 2003 |
| The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus for polishing an object comprises a pad having a |
| 6547651 |
Subaperture chemical mechanical planarization with polishing pad conditioning |
April 15, 2003 |
| Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a platen assembly for holding an object having a target surface to be planarized. A polishing pad is configured to contact the object during planarizat |
| 6527621 |
Pad retrieval apparatus for chemical mechanical planarization |
March 4, 2003 |
| A system provides a polishing pad to a polishing head for chemical mechanical planarization of an object which is larger in diameter than the polishing pad. The system comprises a polishing head and a plurality of magazines disposed in a first region. Each magazine houses at least one |
| 6520843 |
High planarity chemical mechanical planarization |
February 18, 2003 |
| Specific embodiments of the present invention are directed to a chemical mechanical planarization apparatus which comprises a platen assembly for holding an object to be planarized, and a polishing pad having a surface size at least as large as a surface size of the object, the polishing |
| 6517419 |
Shaping polishing pad for small head chemical mechanical planarization |
February 11, 2003 |
| Specific embodiments of the present invention are directed to a method of forming a polishing pad having a smaller diameter than an object to be planarized and to be used for planarizing the object by chemical-mechanical planarization. The method comprises placing a polishing surface |
| 6514129 |
Multi-action chemical mechanical planarization device and method |
February 4, 2003 |
| Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a shaft having a shaft axis and being connected with a polishing head which is coupled to a polishing pad. The polishing pad has a smaller diameter tha |
| 6514121 |
Polishing chemical delivery for small head chemical mechanical planarization |
February 4, 2003 |
| Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a shaft having a shaft axis and being connected with a polishing head which is coupled to a polishing pad. The polishing pad has a smaller diameter tha |
| 6511368 |
Spherical drive assembly for chemical mechanical planarization |
January 28, 2003 |
| The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus for polishing an object comprises a pad having a |
| 6495463 |
Method for chemical mechanical polishing |
December 17, 2002 |
| A method of polishing semiconductor wafers. The method includes spacing the polishing pad from the center of the wafer by a selected offset distance (406) and translating the polishing pad in a manner wherein the translation speed varies as the pad is moved across the surface of the |
| 6485354 |
Polishing pad with built-in optical sensor |
November 26, 2002 |
| An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the reflected light is detected by the detector. The |
| 6464574 |
Pad quick release device for chemical mechanical planarization |
October 15, 2002 |
| In a chemical-mechanical planarization apparatus, a pad spindle includes a pad chuck operative for selective attachment and detachment of a polishing pad. The pad chuck includes a plurality of pivoting links which cooperate to provide a clamping action to retain the polishing pad. A deta |
| 6450860 |
Pad transfer apparatus for chemical mechanical planarization |
September 17, 2002 |
| A system provides a polishing pad for chemical mechanical planarization of an object larger in diameter than the polishing pad. The system comprises a magazine including a bottom for exposing at least a portion of a puck which holds a polishing pad, and a transfer apparatus for transferr |
| 6361647 |
Method and apparatus for chemical mechanical polishing |
March 26, 2002 |
| A chemical mechanical polishing method and apparatus (100) includes a control mechanism (190) having control programs for operating the apparatus in accordance with the invention. The apparatus includes a memory store (192) for containing an offset distance and an additional memory s |
| 6346036 |
Multi-pad apparatus for chemical mechanical planarization |
February 12, 2002 |
| An apparatus for chemical mechanical planarization (100). The apparatus has a platen assembly for holding an object (e.g., wafer, disk, flat panel, glass) to be planarized. The apparatus (100) also has a polishing head coupled to a polishing pad, which has a smaller diameter than the obj |
| 6227956 |
Pad quick release device for chemical mechanical polishing |
May 8, 2001 |
| A chemical-mechanical polishing apparatus (100, 200) comprising a polishing pad assembly. The polishing pad assembly (300) comprises a removable cap (318) to be rotatably coupled to a drive device of a chemical mechanical polishing apparatus and a polishing pad comprising a fixed abrasiv |
| 6102057 |
Lifting and rinsing a wafer |
August 15, 2000 |
| A nozzle that extends telescopically upward is used to elevate a wafer without contacting the wafer. The nozzle includes a stationary hollow cylinder, closed at its lower end and open at its upper end, within which a spool is disposed to slide vertically. In its lowest position the spool |
