Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Silicon Microstructures, Inc. Patents
Assignee:
Silicon Microstructures, Inc.
Address:
Milpitas, CA
No. of patents:
6
Patents:












Patent Number Title Of Patent Date Issued
8132465 Sensor element placement for package stress compensation March 13, 2012
Circuits, methods, and systems that calibrate or account for packaging and related stress components in a pressure sensor. Further examples provide an improved sensor element or device. One example provides one or more sensing elements on the diaphragm and near the diaphragm-bulk bou
8082796 Temperature extraction from a pressure sensor December 27, 2011
Circuits, methods, and systems to compensate pressure sensor readings for changes in temperature. An example measures temperature in a field-effect-transistor-based pressure sensor or micro-electromechanical system by measuring the device's threshold voltage. This threshold voltage i
7487681 Pressure sensor adjustment using backside mask February 10, 2009
Methods and apparatus for an absolute or gauge pressure sensor having a backside cavity with a substantially vertical interior sidewall. The backside cavity is formed using a DRIE etch or other MEMS micro-machining technique. The backside cavity has an opening that is cross shaped, where
7111518 Extremely low cost pressure sensor realized using deep reactive ion etching September 26, 2006
Methods and apparatus for an absolute or gauge pressure sensor having a backside cavity with a substantially vertical interior sidewall. The backside cavity is formed using a DRIE etch or other MEMS micro-machining technique. One embodiment provides for a diaphragm having a boss manu
6467354 Anodically bonded, gas impervious cavity structures fabricated in silicon October 22, 2002
Glass with metal deposited on it in a pattern which is slightly larger than the cavity area of the corresponding silicon wafer. The metal layer has a thickness such that the glass can deform sufficiently to allow bonding of the glass to the silicon. The metal is then compressively bonded
6150681 Monolithic flow sensor and pressure sensor November 21, 2000
A monolithic, integrated circuit sensor combining both a differential pressure sensor and a flow sensor on the same silicon chip. The integrated circuit has a diaphragm with a number of piezo-resistive elements placed on it in the normal manner for a pressure sensor. In addition, a chann

 
 
  Recently Added Patents
Electrode composition with enhanced performance characteristics
Apparatus and method for recording reboot reason of equipment
Cryptographically generated addresses using backward key chain for secure route optimization in mobile internet protocol
Clock phase recovery apparatus
Organic elelectroluminescent display
Cell proliferation inhibitor
Wire guide
  Randomly Featured Patents
Piezoelectric damping mechanism
Process for forming a surface for contact with a flowing fluid and body with such surface regions
Combined keyed AGC and pulse amplitude comparator circuit
Method of defining packaging applicability
Surge current-suppressing circuit and magnetic device therein
Electrical assembly for use with a rotary transformer and method for making the same
Pail lid
Communication apparatus with telephone and data communication capability
Device for further processing after copying
Context synchronization method in mobile communication system