| Patent Number |
Title Of Patent |
Date Issued |
| 7622747 |
Light emitting device and manufacturing method thereof |
November 24, 2009 |
| A light emitting device is disclosed. The light emitting device includes a light emitting element (15), and a light emitting element container (11) having a concave section (20) for containing the light emitting element (15). The concave section (20) includes a side surface (20A) and a b |
| 7622317 |
Light emitting diode and method for manufacturing the same |
November 24, 2009 |
| A light emitting diode includes an LED element, a fluorescent material provided so as to cover the LED element, a substrate on which the LED element is mounted and made of ceramics or silicon, and a pair of electrode pads which are electrically connected to the LED element on the sub |
| 7621457 |
Reader / writer and method for manufacturing the same |
November 24, 2009 |
| A reader/writer includes a substrate, a communication control part on the substrate, a molded resin layer sealing the communication control part and an antenna connected to the communication control part. The antenna is provided on the molded resin layer. |
| 7619316 |
Semiconductor package and method for manufacturing the same |
November 17, 2009 |
| A semiconductor package includes: a build-up wiring layer including a metal wiring layer and an insulation resin layer; and a low thermal expansion material layer having a coefficient of thermal expansion closer to that of a semiconductor chip mounted on the build-up wiring layer as |
| 7615408 |
Method of manufacturing semiconductor device |
November 10, 2009 |
| An internal connecting terminal 12 is formed on electrode pads 23 of a plurality of semiconductor chips 11 formed on a semiconductor substrate 35, and there is formed a resin member 13 having a resin member body 13-1 and a protruded portion 13-2 and covering the semiconductor chips 11 on |
| 7605941 |
Drawing apparatus and drawing-data-generation apparatus therefor as well as drawing method and d |
October 20, 2009 |
| A drawing apparatus in which drawing data, which is required to perform a drawing operation on drawing blocks on a surface that can be drawn at one time by drawing heads moving relatively to said drawn surface, is sequentially generated based on design data and temporarily stored in a |
| 7605463 |
Interposer and method for producing the same and electronic device |
October 20, 2009 |
| An interposer includes a substrate made of an inorganic material; a through wiring including conductors embedded in through holes; and an upper wiring and (or)a lower wiring. The through wiring, the upper wiring and the lower wiring are respectively formed on preliminary wiring patte |
| 7605080 |
Semiconductor device and method of manufacturing the same |
October 20, 2009 |
| In a method of manufacturing a semiconductor device having a through electrode 56 that connects an electrode pad 20 of a semiconductor element 14, which has a device forming layer 18 and the electrode pad 20 on one surface side, and a rewiring pattern 52 on other surface side of the |
| 7599187 |
Semiconductor module and heat radiating plate |
October 6, 2009 |
| A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed between a module main body mounted to a board and outer faces of the semiconductor devic |
| 7598608 |
Mounting substrate |
October 6, 2009 |
| There is provided a mounting substrate on which a semiconductor chip is mounted using a flip chip bonding, having a plurality of connection pads which are connected to the semiconductor chip, and an insulation layer formed in such a manner as to cover the connection pads partially, w |
| 7597929 |
Method of manufacturing a wiring substrate |
October 6, 2009 |
| A method of manufacturing a wiring substrate of the present invention includes the steps of, preparing a laminated body having such a structure that a peelable metal foil in which a lower metal foil and an upper metal foil are laminated peelably and an opening portion is provided on a |
| 7597233 |
Apparatus and method of mounting conductive ball |
October 6, 2009 |
| There is provided a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of connection pads formed on a substrate. The conductive ball mounting apparatus includes: an outer frame; an inner cylinder provided in the outer frame, wherein an upper su |
| 7596289 |
Optical/electrical hybrid substrate |
September 29, 2009 |
| In an optical/electrical hybrid substrate 10 including a wiring board 11 having a wiring and a via, and an optical waveguide 12 including an optical waveguide body 80 having a first clad layer 81, a second clad layer 83 and a core portion 82 disposed between the first clad layer 81 a |
| 7594317 |
Method of manufacturing wiring substrate and method of manufacturing electronic component mounti |
September 29, 2009 |
| A method of manufacturing a wiring substrate including the steps of, obtaining a temporary substrate from a prepreg, and concurrently attaching a metal foil onto at least one surface of the temporary substrate, by disposing the metal foil on a prepreg through a underlying layer inter |
| 7592700 |
Semiconductor chip and method of manufacturing semiconductor chip |
September 22, 2009 |
| A semiconductor chip includes a semiconductor substrate having a first principal surface, and having a device layer on the first principal surface in which a semiconductor device is formed, an electrode pad disposed on the first principal surface of the semiconductor substrate and el |
| 7583870 |
Method for fabricating wiring board and an apparatus for fabricating wiring board |
September 1, 2009 |
| There is provided a method for fabricating a wiring board including: a mounting step of mounting a light transmitting member, the mounting step including: an arranging step of holding the light transmitting member by light transmitting holder to arrange the light transmitting member at a |
| 7582551 |
Wiring substrate and wiring substrate manufacturing method |
September 1, 2009 |
| A method of manufacturing a wiring substrate comprises: a first step of forming, on a support plate, an electrode pad made of metal; a second step of etching the support plate in such a manner that the support plate has a shape which includes a projection portion to be contacted with the |
| 7576004 |
Semiconductor chip and method of manufacturing semiconductor chip |
August 18, 2009 |
| A semiconductor chip includes a semiconductor substrate having a first principal surface, and having a device layer on the first principal surface in which a semiconductor device is formed, an electrode pad disposed on the first principal surface of the semiconductor substrate and el |
| 7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substr |
August 11, 2009 |
| The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an element formation surface in the first resin film uncured in a state where the connection te |
| 7569930 |
Semiconductor module and radiator plate |
August 4, 2009 |
| A semiconductor module 10 in which respective upper surfaces of semiconductor elements 17, 17 on both sides of a rectangular circuit board 11 are covered with radiator plates 12a, 12b attached to both sides of the circuit board 11 so that their outer peripheral edges are not projecte |
| 7569924 |
Semiconductor device and manufacturing method thereof |
August 4, 2009 |
| A semiconductor chip 11 comprising an element formation layer which is formed on a first main surface 35A of a semiconductor substrate 35 and has a semiconductor element, through electrodes 15, 16 which are electrically connected to the semiconductor element and extend through the se |
| 7566513 |
Solid electrolyte fuel cell with a multi-layer cathode formed of a solid electrolyte and electro |
July 28, 2009 |
| A solid electrolyte fuel cell including a cathode layer formed on one surface of a solid electrolyte layer and an anode layer formed on the other surface of the solid electrolyte layer, wherein the cathode layer is a multi-layer structure including at least two layers, the outermost |
| 7563987 |
Electronic parts packaging structure and method of manufacturing the same |
July 21, 2009 |
| An electronic parts packaging structure of the present invention includes a core substrate having such a structure that a recess portion is provided by forming a prepreg insulating layer having an opening portion therein on a resin layer, and an electronic parts mounted on a bottom p |
| 7557450 |
Wiring substrate and electronic parts packaging structure |
July 7, 2009 |
| In a wiring substrate of the present invention in which a bump of an electronic parts is bonded to a connection pad of a wiring pattern provided on an insulating film by an ultrasonic flip-chip packaging, a via hole into which a via post acting as a strut to support the connection pa |
| 7557037 |
Method of manufacturing semiconductor chip |
July 7, 2009 |
| A insulation film removing tape 38 is pasted on a metal film 34 so as to cover an opening portion 32, then an insulation film 17 is formed so as to cover the side wall of a through hole 21 from the second major surface 11B side of the semiconductor substrate 11, and thereafter the insula |
| 7545049 |
Electronic parts packaging structure |
June 9, 2009 |
| An electronic parts packaging structure of the present invention includes a wiring substrate having a wiring pattern, a first insulating film which is formed on the wiring substrate and which has an opening portion in a packaging area where an electronic parts is mounted, the electronic |
| 7543374 |
Method of manufacturing wiring substrate |
June 9, 2009 |
| In a method of manufacturing a wiring substrate according to the present invention, a metal foil is tentatively fixed onto a temporary substrate, which is made of a nonwoven fabric impregnated with resin, by selectively attaching a peripheral side of the metal foil to an outer peripheral |
| 7543263 |
Automatic trace shaping method |
June 2, 2009 |
| An automatic trace shaping method comprises the steps of: setting sets of coaxial equiangular octagons each having sides parallel with a predetermined reference line; performing a process for tentatively disposing the traces each having segments passing between the adjacent vias so t |
| 7542006 |
Wiring board and semiconductor apparatus |
June 2, 2009 |
| An inverse F type antenna is provided and includes first wiring portions provided on an upper face of a board, second wiring portions provided on a lower face of the board, connecting portions electrically connecting the first wiring portions and the second wiring portions, in which the |
| 7536780 |
Method of manufacturing wiring substrate to which semiconductor chip is mounted |
May 26, 2009 |
| The present invention discloses a method of manufacturing a wiring substrate to which a semiconductor chip mounted. The method includes the steps of forming a base, forming a peeling layer on the base, forming a capacitor having a plurality of layers on the peeling layer, and forming |
| 7531011 |
Method of manufacturing capacitor device |
May 12, 2009 |
| In a capacitor device of the present invention includes a substrate, a plurality of lower electrodes formed on the substrate, a plurality of dielectric films formed on a plurality of lower electrodes respectively in a state that the dielectric films are separated mutually, and upper |
| 7530163 |
Electronic parts packaging structure and method of manufacturing the same |
May 12, 2009 |
| There is provided a electronic parts packaging structure that includes a mounted body on which an electronic parts is mounted, the electronic parts having a connection pad, which has an etching stopper film (a copper film, a gold film, a silver film, or a conductive past film) as an |
| 7524753 |
Semiconductor device having through electrode and method of manufacturing the same |
April 28, 2009 |
| A method of manufacturing a semiconductor device having a through electrode, includes forming through holes 36 in a substrate 31, forming a first metal layer 39 from one surface side of the substrate and pasting a protection film 40 on one surface of the substrate, forming through el |
| 7524702 |
Conductor substrate, semiconductor device and production method thereof |
April 28, 2009 |
| A conductor substrate for mounting a semiconductor element, at least a portion thereof mounting the semiconductor element being sealed with an insulating resin, wherein an uppermost surface layer of the conductor substrate comprises copper or an alloy thereof, and the conductor subst |
| 7524025 |
Inkjet printer |
April 28, 2009 |
| An inkjet printer which can be used for printing a resist pattern on a printed circuit board when wiring patterns are to be formed on the board. The inkjet printer has a liquid ejecting head which comprises: a liquid chamber filled with liquid and connected to a liquid storage tank; a |
| 7521283 |
Manufacturing method of chip integrated substrate |
April 21, 2009 |
| A manufacturing method of a chip integrated substrate is disclosed. The manufacturing method includes a first step that forms a wiring structure to be connected to a semiconductor chip on a first core substrate; a second step that disposes the semiconductor chip on a second core subs |
| 7515817 |
Camera module |
April 7, 2009 |
| A camera module is provided wherein an image pickup device, a camera optical system and a driver, for aligning and focusing the camera optical system, are mounted on a board; wherein a connection terminal, to be electrically connected to the driver, is formed on a mounting face of the |
| 7514772 |
Method of manufacturing a semiconductor apparatus |
April 7, 2009 |
| A resin layer in which adhesion to a conductive film is higher than that of a sealing resin to the conductive film is disposed on the sealing resin in which it is difficult to form the conductive film, and wiring patterns electrically connected to electronic components are disposed on |
| 7514351 |
Solder ball mounting method and solder ball mounting substrate manufacturing method |
April 7, 2009 |
| A solder resist having first opening portions on positions corresponding to electrodes and a second opening portion on a mask providing position is formed on the substrate. A flux mask whose thickness is substantially same as the solder resist is arranged in the second opening portion an |
| 7508492 |
Surface light source control apparatus and surface light source control method |
March 24, 2009 |
| A surface light source control apparatus for a direct exposure apparatus comprises a light-emission level determining means for determining the light-emission level of each point light source for each of a plurality of groups so that a uniform illuminance distribution is achieved at a |
| 7508057 |
Electronic component device |
March 24, 2009 |
| An electronic component device of the present invention includes: a silicon package unit having a structure in which a through electrode provided to a silicon substrate while an electrode post connected to the through electrode is provided upright on an upper side of the silicon subs |
| 7507655 |
Method of forming solder connection portions, method of forming wiring substrate and method of p |
March 24, 2009 |
| A method of forming solder connection portions on first electrode pads and on second electrode pads, comprises a first step of arranging solder balls on the first electrode pads by arranging a first mask on a base mask; a second step of arranging solder balls on the second electrode |
| 7507602 |
Semiconductor device and method of manufacturing the same |
March 24, 2009 |
| There are included the steps of preparing a wiring substrate having a wiring pattern on a surface, bonding a connection terminal of electronic chip, which has a predetermined element and the connection terminal on one surface, to the wiring pattern of the wiring substrate by a flip-chip |
| 7504670 |
Sealing structure for mounting a semiconductor device to a substrate |
March 17, 2009 |
| A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the substrate; and an adhesive for bonding the sealing structure and the substrate, wherei |
| 7501696 |
Semiconductor chip-embedded substrate and method of manufacturing same |
March 10, 2009 |
| A semiconductor chip-embedded substrate comprising a supporting substrate and an insulating layer thereon, members for the connection to external circuits, and a plurality of semiconductor chips embedded in the insulating layer, wherein at least some of the plurality of semiconductor |
| 7498259 |
Through electrode and method for forming the same |
March 3, 2009 |
| A method for forming a through electrode is disclosed. The through electrode integrally comprises a columnar electrode filling a through hole, a lower end electrode pad formed on a lower end side of a columnar electrode and having an area wider than the cross section of the through h |
| 7498200 |
Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substr |
March 3, 2009 |
| The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an element formation surface in the first resin film uncured in a state where the connection te |
| 7495745 |
Patterning method and computer readable medium therefor |
February 24, 2009 |
| A patterning method performed by a direct patterning apparatus, and a computer readable medium for controlling a computer of the direct patterning apparatus to perform the pattering method. The patterning method forms a desired pattern on the surface of the object by exposing the sur |
| 7494898 |
Method for manufacturing semiconductor device |
February 24, 2009 |
| A disclosed method for manufacturing a semiconductor device having a structure where a semiconductor element is mounted on a first substrate includes the steps of: bonding the first substrate on which the semiconductor element is mounted and a second substrate made of a material diff |
| 7488094 |
Semiconductor device and manufacturing method of semiconductor device |
February 10, 2009 |
| A semiconductor device made by mounting a light emitting element on a substrate, where an optically-transparent cover with a flat plate shape is installed on the light emitting element and a groove part for suppressing reflection of light emission of the light emitting element is for |
