| Patent Number |
Title Of Patent |
Date Issued |
| 7459343 |
Method of manufacturing semiconductor device and support structure for semiconductor substrate |
December 2, 2008 |
| A method of manufacturing a semiconductor device is disclosed. The method comprises a first step of grinding a second principle surface of a semiconductor substrate opposite to a first principle surface of the semiconductor substrate on which semiconductor device elements are formed, |
| 7456576 |
Discharge tube |
November 25, 2008 |
| A discharge tube comprises a pair of discharge electrodes opposed to each other with a discharge space in-between, an airtight cylinder in which the discharge space is formed, the pair of the electrodes respectively being mounted on both ends of the airtight cylinder, and a coating film |
| 7456497 |
Electronic devices and its production methods |
November 25, 2008 |
| An electronic device having mounted thereon an MEMS element or other functional elements, in which a device body and lid define an element-carrying space, the element-carrying space is sealed air-tight by an ultrasonic bonded part bonding the device body and the lid, and the element- |
| 7453141 |
Semiconductor device package, method of manufacturing the same, and semiconductor device |
November 18, 2008 |
| A semiconductor device package is provided which can achieve speeding-up thereof. The semiconductor device package includes: a board which has at least one of a ground plane and a power plane; at least one connecting conductor portion which is formed on an inner wall surface of an openin |
| 7445965 |
Method of manufacturing radiating plate and semiconductor apparatus using the same |
November 4, 2008 |
| A method of manufacturing a radiating plate using In as a thermal conducting bonding material 20 provided between a semiconductor device and a radiating plate 14 and serving to bond a back surface of the semiconductor device to the radiating plate, includes the steps of carrying out |
| 7445862 |
Solid oxide fuel cell device |
November 4, 2008 |
| A solid oxide fuel cell C including a solid oxide fuel cell having a planar solid oxide substrate, a cathode electrode layer formed on one surface of the substrate, and an anode electrode layer formed on a surface opposite the one surface, is disposed so that the anode electrode laye |
| 7442477 |
Exposing apparatus and exposing method, for maskless exposure of substrate to be exposed, and pl |
October 28, 2008 |
| An exposing apparatus for irradiating desired spots on a substrate to be exposed relatively moving with respect to two or more light sources arranged along the direction of the relative movement to form a desired exposure pattern using the light sources comprises a control means for |
| 7440080 |
Method and apparatus for automatic correction of direct exposure apparatus |
October 21, 2008 |
| An automatic correction method for a direct exposure apparatus illuminates two exposure elements, which are included in adjacent exposure heads separately and which are to expose an identical line on an exposure target, among exposure elements arranged in a two-dimensional manner with |
| 7438945 |
Method of producing multilayer interconnection board |
October 21, 2008 |
| A method of producing a multilayer interconnection board is disclosed that includes the steps of processing a resin member on an interconnection layer by imprinting press, and removing residue of the resin member at the bottom of a via hole after forming the via hole. In the method of |
| 7435680 |
Method of manufacturing a circuit substrate and method of manufacturing an electronic parts pack |
October 14, 2008 |
| A method of manufacturing a circuit substrate of the present invention, includes the steps of forming an n-layered (n is an integer of 1 or more) wiring layer connected electrically to a metal plate on the metal plate, forming an electroplating layer on a connection pad portion of an |
| 7432602 |
Semiconductor device |
October 7, 2008 |
| A semiconductor device includes: a semiconductor chip connected onto a surface of a printed wiring board in a flip-chip connection; a dam for preventing an outflow of underfill, the dam being provided on the surface of the printed wiring board and surrounding an entire circumference of |
| 7423513 |
Circuit board having resistor and method for manufacturing the circuit board |
September 9, 2008 |
| A circuit board high in reliability and a method for manufacturing the circuit board are provided. The electrical resistance is accurately adjustable without damaging the circuit body even if it is made of resinous material and is free from a change over time. A circuit board in whic |
| 7422449 |
Wiring board with lead pins, and lead pin |
September 9, 2008 |
| A wiring board with lead pins having high reliability is provided. When the lead pins are attached to electrode pads, the lead pins are attached to the electrode pads without leaving voids in a conductive agent, and bonding strength of the lead pins are improved. When the wiring board to |
| 7420128 |
Electronic component embedded substrate and method for manufacturing the same |
September 2, 2008 |
| An electronic component embedded substrate and a method for manufacturing the substrate are disclosed. The electronic component embedded substrate includes a substrate main body and an electronic component embedded in the substrate main body. The center plane of the electronic component |
| 7417311 |
Semiconductor device and method of fabricating the same |
August 26, 2008 |
| A semiconductor wafer is thinned to a predetermined thickness by grinding the backside thereof (which is opposite to the side where a plurality of devices are formed and metal posts are further formed), and then a metal layer made of metal having a linear thermal expansion coefficient cl |
| 7416647 |
Plating processing device |
August 26, 2008 |
| A plating processing device comprises: a plating bath, on which an object to be plated is mounted; and a sparger provided with plating nozzle and washing nozzle for jetting plating solution and washing solution, respectively, toward the object in such a manner that the used plating s |
| 7415762 |
Interposer, method of fabricating the same, and semiconductor device using the same |
August 26, 2008 |
| An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor and an interposer portion provided around the foregoing interposer portion integrally therewith. On both surfaces of the interpose |
| 7414799 |
Manufacturing method of camera module |
August 19, 2008 |
| A lens holder, which supports a light receiving lens, is screwed into a barrel portion of a body holder by respectively engaging hooks, which are provided in a screwing piece, with engaging-grooves formed in an end surface of the lens holder and then rotating the screwing piece. The |
| 7414309 |
Encapsulated electronic part packaging structure |
August 19, 2008 |
| An encapsulated electronic part packaging structure includes a step of mounting an electronic part having a connection terminal and a passivating film to cover the connection terminal, mounted on a body to direct the connection terminal upward. An insulating layer is formed to cover |
| 7410837 |
Method of manufacturing mounting substrate |
August 12, 2008 |
| A method for manufacturing a mounting substrate on which a semiconductor chip is mounted includes: forming a wiring section by electrolytic plating on a first face of a supporting substrate which is made of an insulating material, by supplying electric power from a first power supply |
| 7408248 |
Lead frame for semiconductor device |
August 5, 2008 |
| A lead frame for semiconductor device is provided with an inner lead part and an outer lead part. A composite plating layer is provided on the entire plane of a base material constituting the lead frame or at least on the outer lead part. The composite plating layer includes a base layer |
| 7403370 |
Capacitor parts |
July 22, 2008 |
| A capacitor parts of the present invention, includes a substrate, a plurality of capacitor elements arranged on the substrate and composed of a lower electrode, a dielectric layer, and an upper electrode respectively, a lower electrode rewiring layer formed over the plurality of capa |
| 7402900 |
Semiconductor device substrate, semiconductor device, and manufacturing method thereof |
July 22, 2008 |
| A method of manufacturing a semiconductor device substrate includes the steps of: arranging on a base a temporary fixing member for temporarily fixing an electronic component; temporarily fixing the electronic component on the base by the temporary fixing member; forming a substrate |
| 7402232 |
Silver electroplating solution |
July 22, 2008 |
| A silver electroplating solution containing a cyanide as a silver source, said silver electroplating solution characterized by containing at least one type of compound of As, Tl, Se, and Te as a brightener and a brightness adjuster having a benzothiazole skeleton or benzoxazole skele |
| 7397537 |
Exposure apparatus and exposure method |
July 8, 2008 |
| An exposure apparatus for performing direct exposure on a relatively moving exposure target substrate comprises: a plurality of exposure heads arranged so that an overlapping exposed area occurs between exposed areas formed on the exposure target substrate as a result of exposure by the |
| 7394026 |
Multilayer wiring board |
July 1, 2008 |
| In a wiring layer of a first layer of a multilayer wiring board, respective wiring patterns are drawn out from pads in an outermost portion of a pad placement region, from pads located on diagonal lines in the vicinities of the corners of the relevant region, and from pads located in |
| 7384458 |
Non-cyanide electroless gold plating solution and process for electroless gold plating |
June 10, 2008 |
| The non-cyanide electroless gold plating solution according to the invention is a non-cyanide electroless gold plating solution free from a cyanide compound, wherein bis-(3-sulfopropyl)disulfide is added, as a complexing agent for gold stabilization, to the electroless gold plating s |
| 7378732 |
Semiconductor package |
May 27, 2008 |
| A plurality of semiconductor packages is collectively fabricated on a wafer in a batch process and the wafer is then diced to obtain discrete semiconductor packages. The semiconductor package is a stacked body formed by bonding two or more semiconductor devices. Each semiconductor de |
| 7375433 |
Semiconductor device packaging substrate and semiconductor device packaging structure |
May 20, 2008 |
| A packaging substrate for a semiconductor device includes: a solder resist on a surface of the packaging substrate, the solder resist having a first opening portion for mounting the semiconductor device; and a speed adjusting opening portion for adjusting a flow speed of an underfill |
| 7375022 |
Method of manufacturing wiring board |
May 20, 2008 |
| A method of manufacturing a wiring board is disclosed. The wiring board has: a capacitor, having multiple electrode layers which oppose each other with a dielectric layer in between, that is connected to a semiconductor chip; one or more via wirings which pierce the electrode layers |
| 7370411 |
Wiring board manufacturing method |
May 13, 2008 |
| A method of manufacturing a wiring board includes: forming a first insulating layer on a supporting board; mounting at least one reinforcing member on the first insulating layer; mounting at least one semiconductor chip on the first insulating layer; forming a second insulating layer on |
| 7365436 |
Substrate having a penetrating via and wiring connected to the penetrating via and a method for |
April 29, 2008 |
| A disclosed substrate includes a base member having a through-hole, and a conductive metal filling in the through-hole so as to form a penetrating via. The penetrating via contains a conductive core member that is substantially at the central axis of the through-hole. |
| 7358591 |
Capacitor device and semiconductor device having the same, and capacitor device manufacturing me |
April 15, 2008 |
| In a capacitor device of the present invention, a capacitor parts that has a pair of terminals on both end sides respectively is embedded in an insulating film in a state that a lower surface of the capacitor parts is not covered with the insulating film, then upper wiring patterns that |
| 7358114 |
Semiconductor device substrate, semiconductor device, and manufacturing method thereof |
April 15, 2008 |
| A method of manufacturing a semiconductor device substrate includes the steps of: arranging on a base a temporary fixing member for temporarily fixing an electronic component; temporarily fixing the electronic component on the base by the temporary fixing member; forming a substrate |
| 7352060 |
Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring subst |
April 1, 2008 |
| A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin material mixed with an inorganic filler, wherein the inorganic filler is fabricated by mixing |
| 7347949 |
Method of manufacturing a wiring board by utilizing electro plating |
March 25, 2008 |
| A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern. The method comprises: first electroless plating layers |
| 7345244 |
Flexible substrate and a connection method thereof that can achieve reliable connection |
March 18, 2008 |
| A flexible substrate is connectable to electrodes of an external member. The flexible substrate includes a base material having flexibility and including an insulative base film and a conductive film. Lead parts are arranged on an end of the base material. Slits are formed between the |
| 7342248 |
Semiconductor device and interposer |
March 11, 2008 |
| A semiconductor device characterized in that connection pads for wire bonding are arranged at peripheral regions of an electrode terminal formation surface of a semiconductor chip, test pads for testing the semiconductor chip are arranged in an inside region surrounded by said periph |
| 7341919 |
Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconduc |
March 11, 2008 |
| A capacitor element configured to mount a semiconductor element thereon includes a base. A capacitor part is provided on the base. The base is made of a resin whose coefficient of linear expansion is adjusted in accordance with a coefficient of linear expansion of the semiconductor e |
| 7340121 |
Optoelectric composite substrate and method of manufacturing the same |
March 4, 2008 |
| An optoelectric composite substrate of the present invention includes an insulating film, an optical waveguide embedded in the insulating film in a state that an upper surface is exposed from the insulating film, a via hole formed to pass through the insulating film, a conductor formed i |
| 7335531 |
Semiconductor device package and method of production and semiconductor device of same |
February 26, 2008 |
| A semiconductor device including a semiconductor device package providing a capacitor in its circuit board and a semiconductor chip mounted on that package, wherein the capacitor is provided directly under a semiconductor chip mounting surface of the circuit board on which the semiconduc |
| 7330037 |
Electrical characteristic measuring probe and method of manufacturing the same |
February 12, 2008 |
| In an electrical characteristic measuring probe of the present invention constructed by assembling a plurality of probe parts, each comprising a base portion, a plurality of terminal portions extended outward from one end of the base portion, wiring patterns extended from a plurality of |
| 7329944 |
Leadframe for semiconductor device |
February 12, 2008 |
| A leadframe for a semiconductor device of the present invention is a leadframe for a semiconductor device having a stage section where a semiconductor chip is to be mounted, an inner lead section connected to the stage section, and an outer lead section connected to the inner lead se |
| 7329568 |
Method of forming active device on substrate that includes embossing insulating resin layer with |
February 12, 2008 |
| There are provided the steps of forming, on a substrate 10, a semiconductor layer 12 to be a base of a device, forming each of electrodes 14 to be a source electrode and a drain electrode on a surface of the semiconductor layer 12 provided on the substrate, covering a surface of the |
| 7319049 |
Method of manufacturing an electronic parts packaging structure |
January 15, 2008 |
| A method of manufacturing an electronic parts packaging structure of the present invention, includes the steps of forming a first uncured resin layer on a substrate, arranging an electronic parts on the first uncured resin layer, forming a second uncured resin layer that covers the e |
| 7314780 |
Semiconductor package, method of production of same, and semiconductor device |
January 1, 2008 |
| A semiconductor package, provided with a multilayer interconnect structure, for mounting a semiconductor chip on its top surface, wherein a topmost stacked structure of the multilayer interconnect structure includes a capacitor structure, the capacitor structure having a dielectric l |
| 7312536 |
Substrate having a built-in chip and external connection terminals on both sides and a method fo |
December 25, 2007 |
| A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90% by weight of spherical fille |
| 7307691 |
Maskless direct exposure system and user interface |
December 11, 2007 |
| A direct exposure system comprises: a data mask that is a data object including drawing data; and a control mask that is a data object including at least one logical layer in which information about exposure conditions applied according to regions on a substrate is specified, and per |
| 7303243 |
Pattern drawing apparatus and pattern drawing method for forming patterns, that have mirror imag |
December 4, 2007 |
| A pattern drawing apparatus for forming patterns, that have a mirror image relationship to each other with respect to a substrate, on both sides of the substrate forms the patterns on both sides of the substrate by drawing the patterns directly on both sides of the substrate in accor |
| 7301226 |
Conductor substrate, semiconductor device and production method thereof |
November 27, 2007 |
| A conductor substrate for mounting a semiconductor element, at least a portion thereof mounting the semiconductor element being sealed with an insulating resin, wherein an uppermost surface layer of the conductor substrate comprises copper or an alloy thereof, and the conductor subst |
