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Sawtek, Inc. Patents
Assignee:
Sawtek, Inc.
Address:
West Chester, OH
No. of patents:
40
Patents:












Patent Number Title Of Patent Date Issued
D472116 Ready ratchet March 25, 2003
D431983 Ratchet wrench October 17, 2000
7109635 Wafer level packaging of materials with different coefficients of thermal expansion September 19, 2006
An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate
7105980 Saw filter device and method employing normal temperature bonding for producing desirable filter September 12, 2006
A SAW filter includes a piezoelectric substrate of Lithium Niobate or optionally Lithium Tantalate having a thickness of at least twice an acoustic wavelength. The piezoelectric substrate is bonded to a surrogate substrate of a silicon material. The surrogate substrate is characterized
7100451 Surface acoustic wave sensing system and method for measuring pressure and temperature September 5, 2006
A surface acoustic wave (SAW) sensor and an interrogator that transmits a noise source to the sensor for receiving an interrogation signal that is processed and compared to the source signal provides pressure and temperature measurements. One SAW sensor a single interdigital transducer
6861927 Longitudinally coupled leaky surface acoustic wave resonator filter March 1, 2005
A longitudinally coupled leaky surface acoustic wave (LSAW) resonator filter has a wide bandwidth, low insertion loss and return loss characteristics, and high power handling capability. The LSAW resonator filter includes a plurality of longitudinally coupled LSAW resonator tracks di
6833774 Surface acoustic wave filter December 21, 2004
A SAW filter includes a piezoelectric substrate of a single crystal LiNbO.sub.3 and SAW resonators having an electrode thickness ranging from about 8% to about 9% of an acoustic wavelength of a high velocity SAW excited on the surface of the substrate. The piezoelectric substrate has
6798318 Hybrid leaky surface acoustic wave resonator filter September 28, 2004
A hybrid leaky surface acoustic wave (LSAW) resonator filter has a wide bandwidth, low insertion loss and return loss, and excellent rejection of frequencies outside the passband, and includes one or more longitudinally coupled LSAW resonator filter tracks with chirp-type resonant caviti
6698318 Wrench set March 2, 2004
A wrench set includes a hollow body containing a tray. The tray includes a plurality of different size wrench heads held in a nesting relationship within said tray. The tray is easily removed from the hollow interior allowing a wrench head to be removed. Each wrench head is adapted to fi
6661313 Surface acoustic wave devices using optimized cuts of lithium niobate (LiNbO3) December 9, 2003
A surface acoustic wave device includes a piezoelectric substrate of a single crystal LiNbO.sub.3 and an electrode pattern provided on a surface of the piezoelectric substrate which forms a resonator having an electrode thickness in a range of about 0.1% to about 8% of an acoustic wavele
6571638 Surface-acoustic-wave pressure sensor and associated methods June 3, 2003
A pressure and temperature sensor includes a sealed insulating package and an elastic, piezoelectric substrate deformably supported within the package. At least three surface-acoustic-wave resonators are affixed to a bottom of the substrate. A first and a second resonator are positioned
6566980 Die layout for SAW devices and associated methods May 20, 2003
A surface-acoustic-wave die includes a generally rectangular die that comprises a piezoelectric material, atop which is positioned a surface-acoustic-wave electrode pattern. The pattern has a generally rectangular footprint, and the footprint has a top edge that is positioned at an a
6559739 String weighted surface acoustic wave transducer May 6, 2003
Surface-acoustic-wave transducers include interdigital electrode fingers alternately connected to hot and ground bus bars. The gap between two adjacent electrodes has a relative tap weight proportional to the voltage difference between the two electrodes. A set of subtransducers connecte
6556104 Surface acoustic wave devices using optimized cuts of a piezoelectric substrate April 29, 2003
A surface acoustic wave device includes a piezoelectric substrate of a single crystal LiTaO.sub.3 and an electrode pattern provided on a surface of the piezoelectric substrate which forms a resonator having an electrode thickness in a range of about 1% to about 15% of an acoustic wavelen
6349623 Socket wrench and socket set February 26, 2002
A socket set includes a socket wrench having a tapered hollow handle. A tapered tray fits within said handle. The tapered tray holds a plurality of sockets resting on their sides. This enables one to combine the socket set with the wrench so the sockets are always present when needed.
6105226 Leadless ceramic chip carrier crosstalk suppression method August 22, 2000
A leadless ceramic chip carrier useful in surface mounting of SAW devices includes electrically conductive vias and metalization between input and output bond pads for improved crosstalk suppression between input and output device connections. A protrusion extending from a top layer of a
6097131 Optimal cut for SAW devices on langatate August 1, 2000
A lanthanum gallium tantalate single crystal substrate, referred to as langatate, has a prescribed range of Euler angles for substrate and crystal orientation for improving signal processing for a surface acoustic wave (SAW) device. When a voltage is applied to an input interdigital
6072264 Optimal cut for surface wave propagation on langasite substrate June 6, 2000
A lanthanum gallium silicate single crystal substrate, referred to as langasite, has a prescribed range of Euler angles for substrate and crystal orientation for improving signal processing for a surface acoustic wave (SAW) device. When a voltage is applied to an input interdigital t
6054794 Optimal cut for wave propagation surface on langanite substrate April 25, 2000
A lanthanum gallium niobate single crystal substrate, referred to as langanite, has a prescribed range of Euler angles for substrate and crystal orientation for improving signal processing for a surface acoustic wave (SAW) device. When a voltage is applied to an input interdigital tr
6031315 Optimal cut for saw devices on quartz February 29, 2000
A quartz single crystal substrate (12), includes a prescribed range of Euler angles for substrate and crystal orientation which improves signal processing for surface acoustic wave (SAW) devices (10). When a voltage is applied to an input inter digital transducer (IDT) (16) of the SAW de
6011693 Slotted printed circuit board surface mount stress relief system January 4, 2000
A surface mounting stress relief system for mounting a surface mount package such as a leadless ceramic chip carrier on a printed circuit board includes a printed circuit board having a top layer attached to a bottom layer. The top layer includes cavities for exposing top surface portion
5917265 Optimal cut for saw devices on langasite June 29, 1999
A lanthanum gallium silicate single crystal substrate, referred to as langasite, has a prescribed range of Euler angles for substrate and crystal orientation for improving signal processing for a surface acoustic wave (SAW) device. When a voltage is applied to an input interdigital t
5905325 Optimal cut for saw devices on langanite May 18, 1999
A lanthanum gallium niobate single crystal substrate, referred to as langanite, has a prescribed range of Euler angles for substrate and crystal orientation for improving signal processing for a surface acoustic wave (SAW) device. When a voltage is applied to an input interdigital tr
5866867 Surface mount package seam welder apparatus and method February 2, 1999
A seam welder for sealing a cover of a surface mount package to its carrier includes a table for receiving a fixture which itself carried surface mount packages to be welded for sealing an electronic component therein. Electrical current to welding electrodes is controlled for resistance
5864092 Leadless ceramic chip carrier crosstalk suppression apparatus January 26, 1999
A leadless ceramic chip carrier useful in surface mounting of SAW devices includes electrically conductive vias and metalization between input and output bond pads for improved crosstalk suppression between input and output device connections. A protrusion extending from a top layer of a
5831494 Dual track low-loss reflective saw filter November 3, 1998
A dual track, low signal loss surface acoustic wave filter includes tapered transducers and tapered reflectors within an axis of propagation for each track to achieve an improved pass band response associated with tapered transducers. The bandwidth of the filter is achieved by adjusting
5831492 Weighted tapered spudt saw device November 3, 1998
Selected transducer geometries including unbalanced split electrode and three electrode per wavelength structures are employed for use in wide band tapered SAW devices. Combining geometries useful in narrow bandwidth SAW filters for canceling reflected waves leading to triple transit
5831167 Time domain delay device measurement apparatus including sensor package November 3, 1998
A sensing apparatus includes a sensor package for generating an output signal responsive to a sensed quantity. The sensor package includes a surface acoustic wave (SAW) sensor and driver driver circuit mounted within a common package to facilitate connection to the associated process
5818310 Series-block and line-width weighted saw filter device October 6, 1998
Surface acoustic wave (SAW) filter performance is enhanced using series-block weighting and line-width weighting combined for providing a transducer having a finely adjusted uniform weighting across the beam profile. Such a transducer permits practical transducer pairing within a sur
5804729 Apparatus and associated method for measuring differences in delay measurements September 8, 1998
A sensing apparatus includes a pulse recirculating circuit operatively connected to at least one ultrasonic delay sensor or other device for recirculating pulses therethrough, and a measurement difference output circuit for generating an output signal based upon a difference between
5700952 Time domain delay measurement apparatus and associated method December 23, 1997
An embodiment of a sensing apparatus includes an ultrasonic delay sensor having a delay related to the sensed quantity; and a time domain analysis circuit for recirculating pulses through the ultrasonic delay sensor or device and for generating the output signal related to the sensed
5698786 Differential phase velocity determining delay measurement apparatus and associated method December 16, 1997
An apparatus includes an ultrasonic delay sensor or device having a delay related to the sensed quantity; a pulse recirculating circuit for recirculating pulses through the ultrasonic delay sensor for generating a pulse repetition signal having a frequency related to delay of the ult
5690270 Surface mounting stress relief device and method November 25, 1997
A device and method for mounting a surface mount package onto a printed circuit board includes inserting a pin through a printed circuit board feedthrough for providing movement of the pin within the feedthrough. One end of the pin is soldered to conductive surfaces on the bottom side of
5573172 Surface mount stress relief hidden lead package device and method November 12, 1996
A hidden lead package device is configured to be placed between a leadless component such as a surface mount package (SMP) used to house a SAW device and a standard printed circuit board configured for solder joints in a leadless contact with the printed circuit board. The hidden lead de
5369551 Surface mount stress relief interface system and method November 29, 1994
An interface printed circuit board is configured to be placed between a leadless component such as a surface mount package used to house a SAW device and a standard printed circuit board configured for solder joints in a leadless contact with the printed circuit board. The interface devi
5196811 Oscillator circuit employing quadrature networks for maintaining a constant impedance March 23, 1993
A coupled resonator filter oscillator having an impedance matching network coupled between an amplifier and a filter. The impedance value of the amplifier varies due to amplifier gain compression. The network maintains a constant impedance to the filter when said amplifier's impedance ch
5111167 Surface acoustic wave device and method utilizing plural multi-strip couplers May 5, 1992
A surface acoustic wave device employs in-line input and output transducers disposed on a piezoelectrically active surface. Two U-configured multi-strip couplers are disposed between the input and output transducers in an overlapped, opposing configuration in order to convolve the side
5077545 Surface acoustic wave waveguide-coupled resonator notch filter December 31, 1991
A surface acoustic wave (SAW) waveguide-coupled resonator filter is overcoupled to produce an essentially constant conductance and susceptance over at least the bandwidth of a desired notch filter. The SAW resonator filter is embedded in a bridged-T allpass circuit to provide the pair of
4684783 Environmental control apparatus for electrical circuit elements August 4, 1987
An environmental control apparatus for electronic circuit elements includes an enclosure for the element and standoff brackets supporting the enclosure, the enclosure and support brackets together defining an area of both high heat resistivity and high heat conductivity, with a heating
4622525 Low loss surface acoustic wave device and method November 11, 1986
A surface acoustic wave device in a piezoelectric medium includes input and output transducers for launching and detecting a surface acoustic wave along the piezoelectric medium. The device is arranged in a ring loop to process the bidirectional acoustic wave launched from the input

 
 
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