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Rogers Corporation Patents
Assignee:
Rogers Corporation
Address:
Rogers, CT
No. of patents:
197
Patents:


1 2 3 4










Patent Number Title Of Patent Date Issued
RE36396 Electrical substrate material comprising amorphous fused silica powder November 16, 1999
A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials and integrated circuit chip carriers is presented which exhibits improved electrical performance over other printed wiring board materials and cir
RE34190 Connector arrangement March 9, 1993
A connector system for electrically connecting contacts of a flexible printed circuit carried by a daughter board with fixed contacts carried by a mother board, the flexible circuit serving as a connector to circuits on the daughter board, and the contacts of the flexible printed circuit
H416 High capacitance flexible circuit January 5, 1988
A multilayer flexible circuit is provided with integral capacitors. These capacitors are in the form of rigid dielectric elements embedded within the flexible circuit at appropriate locations between two circuit patterns. The circuit pattern may include inductors which cooperate with
D261114 Level indicating float October 6, 1981
8578599 Method of making a supported foam circuit laminate November 12, 2013
A method of making a supported foam circuit laminate comprises fitting a dielectric foam substrate having a shape defined by edges to a support frame having a thickness, an inner rim and an outer rim, wherein the edges of the dielectric foam substrate are flush with the inner rim of
7876399 Liquid crystal display with split electrode January 25, 2011
A light shutter includes a first electrode, a second electrode, and a third electrode, wherein the first and second electrodes are capacitively coupled to each other by the third electrode. The first electrode and the second electrode can be segmented and the segments separately addresse
7843140 AC switch with zero off current for EL panel November 30, 2010
A power supply for driving an EL panel includes an inverter that produces a polarity reversing voltage at a pair of output terminals. A switching circuit coupled to the output terminals and to at least one EL lamp applies alternating current to the at least one EL lamp in the on state
5922453 Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit su July 13, 1999
A ceramic-filled fluoropolymer composite is presented, suitable for use as an electrical substrate material. In accordance with the present invention, a ceramic-filled fluoropolymer composite further comprises high temperature, high modulus, finely powdered polymeric material. The median
5855818 Electrically conductive fiber filled elastomeric foam January 5, 1999
An electrically conductive elastomeric foam is presented. Preferably, the elastomeric foam comprises polyurethane foam and in accordance with an important feature of this invention, the elastomeric foam is rendered electrically conductive by incorporating therein electrically conductive
5733945 Process for manufacturing polyurethane using a metal acetyl acetonate/acetyl acetone catalyst sy March 31, 1998
Nickel acetyl acetonate catalysts used in the manufacture of polyurethanes and particularly polyurathane foam, is replaced with a more environmentally friendly organo-metallic catalyst, specifically other metal acetyl acetonates such as iron or copper. In accordance with an important
5571609 Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereo November 5, 1996
An electrical substrate material is presented which comprises a thermosetting matrix which includes a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene containing polymer in an amount of 25 to 50 vol. %; a woven glass fabric in an amount of 10 to 40 vol. %;
5552210 Ceramic filled composite polymeric electrical substrate material exhibiting high dielectric cons September 3, 1996
A high dielectric (K'.gtoreq.5), comparatively low thermal coefficient (absolute value of TCK'.ltoreq.200 ppm/.degree.C.) polymeric composite matrix is presented comprising commonly available and low cost fillers such as titania, alumina and magnesium oxide.
5506049 Particulate filled composite film and method of making same April 9, 1996
A particulate filled fluoropolymeric matrix composite article and method of making the same is presented. Preferably, the article comprises an electrical substrate material. The method for making the particulate filled polymeric matrix composite film includes mixing a polymeric matrix
5459634 Area array interconnect device and method of manufacture thereof October 17, 1995
An area array interconnect device (such as of the TAB type) has a plurality of input/output (I/O) leads for connection to an electronic device such as an IC. The interconnect device also has arrays of lead lines in areas remote from the I/O leads, e.g., central or internal areas, which a
5440805 Method of manufacturing a multilayer circuit August 15, 1995
In accordance with the present invention, a circuit assembly is manufactured in an additive process using at least one layer of a fluoropolymer composite material and a conductive material. The conductive layers are plated, and the fluoropolymer composite layers are laminated. The us
5413687 Method for metallizing fluoropolymer substrates May 9, 1995
In accordance with the present invention, it has been discovered that bias sputtering a metal layer (e.g., copper or aluminum) in an atmosphere of a mixture of ammonia and a noble gas leads to dramatically improved adhesion between deposited metal and a fluoropolymer substrate. Preferabl
5384181 Low volume fraction ceramic filled fluoropolymeric composite material January 24, 1995
A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a silane and the ceramic has a volume % fraction of between about 26-45. The composite of this invention exhibits excellent chemical resistance, particularly to alkaline e
5374453 Particulate filled composite film and method of making same December 20, 1994
A method for making a particulate filled polymeric matrix composite film includes mixing a polymeric matrix material with a dispersion of particulate filler in a carrier liquid to form a casting composition and adjusting the viscosity of the casting composition to retard separation of
5358775 Fluoropolymeric electrical substrate material exhibiting low thermal coefficient of dielectric c October 25, 1994
A high dielectric constant (K'.gtoreq.4), low thermal coefficient of dielectric constant (TCK'.ltoreq.150 ppm/.degree. C.) electrical substrate material comprises a fluoropolymer (preferably PTFE) filled with particulate ceramic material (powder) which exhibits low loss, comparativel
5354611 Dielectric composite October 11, 1994
A composite material is disclosed. The material comprises a polymeric matrix and from about 20 volume percent to about 70 volume percent inorganic particles distributed throughout the matrix. Suitable inorganic particles include hollow inorganic microspheres and porous inorganic part
5329695 Method of manufacturing a multilayer circuit board July 19, 1994
Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers are stacked, one on top of the other. At least one of the circuit layers comprise a substrate composed of a polymeric material capable of undergoing bonding
5312576 Method for making particulate filled composite film May 17, 1994
A method for making a particulate filled polymeric matrix composite film includes mixing a polymeric matrix material with a dispersion of particulate filler in a carrier liquid to form a casting composition and adjusting the viscosity of the casting composition to retard separation of
5309629 Method of manufacturing a multilayer circuit board May 10, 1994
Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers are stacked, one on top of the other. At least one of the circuit layers comprise a substrate composed of a polymeric material capable of undergoing bonding
5306181 Planer fuse panel April 26, 1994
A planer fuse panel is presented. In accordance with the present invention, a section of conductive metal of the desired thickness, temper and shape is stamped out from a sheet of conductive metal. Simultaneously, fuse holding spring or bent tabs are formed in the same stamping operation
5287619 Method of manufacture multichip module substrate February 22, 1994
In accordance with the present invention, an MCM substrate product is manufactured in an additive process using multiple layers of a fluoropolymer composite material and copper. The copper layers are plated, and the fluoropolymer composite layers are laminated. A seeding process prom
5281466 Low volume fraction ceramic filled fluoropolymeric composite material January 25, 1994
A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a zirconate coupling agent and/or a titanate coupling agent and the ceramic has a volume % fraction of between about 26-45.
5274912 Method of manufacturing a multilayer circuit board January 4, 1994
Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers comprised of a dielectric substrate having a circuit formed thereon are stacked, one on top of the other. The dielectric substrate is composed of a polymeric
5233067 Metallized polymeric substrates August 3, 1993
A method for metallizing a polymeric substrate is disclosed. The method includes contacting a surface of an etched polymeric substrate with a silane coupling agent and depositing a metallic layer over the surface. The silane coupling agent forms a chemical linkage between the substrate
5227959 Electrical circuit interconnection July 13, 1993
A high frequency electrical connector system for electrically interconnecting corresponding first and second circuit elements includes a first planar array of pad-type contact terminals disposed on a substrate and connected to a first circuit on the substrate, together with first gui
5223568 Process for forming hard shaped molded article of a cross-linked liquid polybutadiene or polyiso June 29, 1993
A forming process for producing a hard shaped molded article that includes subjecting a moldable thermosetting composition to a high temperature cure condition at a temperature greater than about 250.degree. C. and less than the decomposition temperature of the composition to form a cros
5219640 Flexible circuit having flexing section of reduced stiffness, and method of manufacture thereof June 15, 1993
A flexible circuit is presented having a flexing (cyclic bending) section of lower stiffness than adjacent parts of the circuit. The lower stiffness in the flexing section is achieved by reducing the thickness of the flexing section, either by omitting or removing some or all of the
5198295 Ceramic filled fluoropolymeric composite material March 30, 1993
A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a titanate and/or zirconate and the ceramic has a volume % fraction of between about 45-50.
5194326 Ceramic filled fluoropolymeric composite material March 16, 1993
A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a fluorosilane and the ceramic has a volume % fraction of between about 45-50.
5182173 Coated particles and method for making same January 26, 1993
A composite filler material is disclosed. The filler material includes an inorganic core and a layer of crosslinked silicone elastomer covering the core and chemically bonded to the core. A process for making the composite filler material is also disclosed.
5149590 Electrical substrate material September 22, 1992
A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials is presented which exhibits improved electrical performance over other printed wiring board materials. Also, the low coefficients of thermal expan
5147208 Flexible printed circuit with raised contacts September 15, 1992
A flexible printed circuit with raised contacts is presented. In accordance with this invention, a flexible circuit is disposed on a substrate. The substrate includes a pattern comprised of a plurality of raised features. Similarly, the flexible circuit has a corresponding pattern compri
5097393 Multilayer interconnect device and method of manufacture thereof March 17, 1992
An interconnect device for electronic components, such as integrated circuits, multichip modules and the like, and the method of manufacture thereof are presented. The interconnect device has at least three layers of circuitry, one for signal transmission and two for voltage planes (
5096426 Connector arrangement system and interconnect element March 17, 1992
A circuit board electrical interconnection system, including improved, elongated, bodily-rotatable interconnect elements, is disclosed. Each element has tab portions projection angularly from the opposing ends of the element, which tab portions define a pair of pad engagement surfaces.
5095402 Internally decoupled integrated circuit package March 10, 1992
A decoupling scheme is presented which is well suited for use with any type of integrated circuit package. In accordance with the present invention, a flat decoupling capacitor is attached directly to the top of an IC die and is electrically connected to the IC by means of raised conduct
5077115 Thermoplastic composite material December 31, 1991
A thermoplastic composite material is presented which comprises a thermoplastic matrix which is highly filled with a coated ceramic filler. In an important feature of the present invention, the ceramic filler has been coated with a rubbery polymer that bonds to the filler. In a prefe
5072520 Method of manufacturing an interconnect device having coplanar contact bumps December 17, 1991
An interconnect or circuit device having coplanar contact bumps, and the method of manufacture thereof are presented. The coplanar contact bumps are formed against a flat reference surface whereby the resulting bumps have coplanar means.
5071359 Array connector December 10, 1991
Connector and processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed elastomeric sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral
5065284 Multilayer printed wiring board November 12, 1991
A multilayer printed wiring board is presented for surface mounting or through hole technology, which includes one or more layers of a high capacitance flexible dielectric sheet material. The dielectric sheet is comprised of a monolayer of multilayer or single layer high dielectric c
5065281 Molded integrated circuit package incorporating heat sink November 12, 1991
A molded integrated circuit package includes an integrated circuit chip, a heat sink device attached directly to the chip or lead frame and a molded package encapsulating the chip. The heat sink preferably comprises a thermally conductive material having a stem which communicates between
5061548 Ceramic filled fluoropolymeric composite material October 29, 1991
A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a silane and the ceramic has a volume % fraction of between about 45-50.
5053921 Multilayer interconnect device and method of manufacture thereof October 1, 1991
An interconnect device for electronic components, such as integrated circuits, multichip modules and the like, and the method of manufacture thereof are presented. The interconnect device has at least three layers of circuitry, one for signal transmission and two for voltage planes (
5051542 Low impedance bus bar September 24, 1991
A bus bar is presented which sandwiches a high capacitance flexible dielectric sheet material between the conductive layers. The high capacitance dielectric sheet is comprised of a monolayer of multilayer or single layer high dielectric (e.g. ceramic) chips or pellets of relatively s
5049084 Electrical circuit board interconnect September 17, 1991
A connector arrangement for providing electrical interconnection between corresponding contact pads of opposed first and second circuit boards includes an electrically nonconductive support member disposed between the boards, a bodily-rotatable, electrically conductive interconnect eleme
5046238 Method of manufacturing a multilayer circuit board September 10, 1991
Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers comprised of a dielectric substrate having a circuit formed thereon are stacked, one on top of the other. The dielectric substrate is composed of a polymeric
5034850 Thin decoupling capacitor for mounting under integrated circuit package July 23, 1991
A rugged, highly reliable, leadless decoupling capacitor is provided which may be positioned between a circuit board and an integrated circuit package including, for example, a leaded surface mounted IC package or Pin Grid Array package. This decoupling capacitor is comprised of a rugged
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