| Patent Number |
Title Of Patent |
Date Issued |
| 7403023 |
Apparatus and method of measuring defects in an ion implanted wafer by heating the wafer to a tr |
July 22, 2008 |
| The invention relates to the use of the metrology methods and the related apparatus disclosed herein that incorporate thermal treatment devices and methods that improve defect detection. Specifically, in one aspect the invention relates to method of thermally treating a semiconductor waf |
| 7160742 |
Methods for integrated implant monitoring |
January 9, 2007 |
| The invention relates to a method for real-time in-situ implantation and measurement incorporating a feedback loop to adjust the implantation dose of a substrate during the manufacturing and testing of semiconductor wafers. During processing, the substrate, such as a silicon wafer, is |
| 7119569 |
Real-time in-line testing of semiconductor wafers |
October 10, 2006 |
| A method and apparatus for measuring damage of an ion implanted semiconductor wafer during semiconductor processing. The method includes the steps of conveying the wafer such that a surface of the wafer is substantially parallel to a surface photovoltage electrode of a head assembly |
| 6967490 |
Real-time in-line testing of semiconductor wafers |
November 22, 2005 |
| An apparatus and method for the real-time, in-line testing of semiconductor wafers during the manufacturing process. In one embodiment the apparatus includes a probe assembly within a semiconductor wafer processing line. As each wafer passes adjacent the probe assembly, a source of modul |
| 6924657 |
Real-time in-line testing of semiconductor wafers |
August 2, 2005 |
| An apparatus and method for the real-time, in-line testing of semiconductor wafers during the manufacturing process. In one embodiment the apparatus includes a probe assembly within a semiconductor wafer processing line. As each wafer passes adjacent the probe assembly, a source of modul |
| 6911350 |
Real-time in-line testing of semiconductor wafers |
June 28, 2005 |
| An apparatus and method for the real-time, in-line testing of semiconductor wafers during the manufacturing process. In one embodiment the apparatus includes a probe assembly within a semiconductor wafer processing line. As each wafer passes adjacent the probe assembly, a source of modul |
| 6909302 |
Real-time in-line testing of semiconductor wafers |
June 21, 2005 |
| An apparatus and method for the real-time, in-line testing of semiconductor wafers during the manufacturing process. In one embodiment the apparatus includes a probe assembly within a semiconductor wafer processing line. As each wafer passes adjacent the probe assembly, a source of modul |
| 6803588 |
Apparatus and method for rapid photo-thermal surfaces treatment |
October 12, 2004 |
| An apparatus for surface treating a semiconductor wafer includes a surface treatment chamber and a source of radiation. The semiconductor wafer disposed inside the chamber is illuminated with radiation sufficient to create a plurality of electron-hole pairs near the surface of the wafer |
| 6388455 |
Method and apparatus for simulating a surface photo-voltage in a substrate |
May 14, 2002 |
| This invention relates to a method and apparatus for simulating a surface photo-voltage, more particularly with a photodiode on a process sized disk for calibrating surface photo-voltage measurement devices. The device for simulating a surface photo-voltage includes the photodiode, the d |
| 6325078 |
Apparatus and method for rapid photo-thermal surface treatment |
December 4, 2001 |
| An apparatus for surface treating a semiconductor wafer includes a surface treatment chamber and a source of radiation. The semiconductor wafer disposed inside the c amber is illuminated with radiation sufficient to create a plurality of electron-hole pairs near the surface of the wafer |
| 6315574 |
Method for real-time in-line testing of semiconductor wafers |
November 13, 2001 |
| An apparatus and method for the real-time, in-line testing of semiconductor wafers during the manufacturing process. In one embodiment the apparatus includes a probe assembly within a semiconductor wafer processing line. As each wafer passes adjacent the probe assembly, a source of modul |
| 6069017 |
Method for real-time in-line testing of semiconductor wafers |
May 30, 2000 |
| An apparatus and method for the real-time, in-line testing of semiconductor wafers during the manufacturing process. In one embodiment the apparatus includes a probe assembly within a semiconductor wafer processing line. As each wafer passes adjacent the probe assembly, a source of modul |
| 5661408 |
Real-time in-line testing of semiconductor wafers |
August 26, 1997 |
| An apparatus and method for the real-time, in-line testing of semiconductor wafers during the manufacturing process. In one embodiment the apparatus includes a probe assembly within a semiconductor wafer processing line. As each wafer passes adjacent the probe assembly, a source of modul |
