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Picopak Oy Patents
Picopak Oy
Lohja, FI
No. of patents:

Patent Number Title Of Patent Date Issued
5804456 Method and apparatus for chemically generating terminal bumps on semiconductor wafers September 8, 1998
The invention relates to a method and an apparatus for forming bonding bumps on wafers (5) to be plated in an electroless process (not requiring an externally applied voltage). According to the method, the object to be plated is immersed in a vessel (2) containing a desired solution (10)

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