| Patent Number |
Title Of Patent |
Date Issued |
| RE39975 |
Surface acoustic wave device and communication device |
January 1, 2008 |
| A surface acoustic wave device including a LiTaO.sub.3 substrate, and an interdigital transducer is provided on the LiTaO.sub.3 substrate. The interdigital transducer includes as a major component at least one of Au, Ag, Ta, Mo, Cu, Ni, Cr, Zn, and W, and the interdigital transducer has |
| D602480 |
Antenna for wireless tag |
October 20, 2009 |
|
| D602479 |
Antenna for wireless tag |
October 20, 2009 |
|
| D534133 |
Semiconductor module |
December 26, 2006 |
|
| 7630685 |
Wireless IC device and component for wireless IC device |
December 8, 2009 |
| A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation |
| 7629942 |
Antenna |
December 8, 2009 |
| An antenna includes inductance elements that are magnetically coupled together, an LC series resonant circuit that includes one of the inductance elements capacitance elements, and an LC series resonant circuit that includes another of the inductance elements and capacitance elements |
| 7629867 |
Filter element and method for manufacturing the same |
December 8, 2009 |
| A filter element includes a flat dielectric substrate, a ground electrode on a back main surface of the dielectric substrate, resonant lines each having a shorting end in the vicinity of a border between a side of the dielectric substrate and the ground electrode and extending from the s |
| 7629866 |
Method for manufacturing surface acoustic wave device and surface acoustic wave device |
December 8, 2009 |
| A method for manufacturing a surface acoustic wave filter device includes a step of forming grooves in one principal surface of a piezoelectric substrate, a step of embedding a metallic film in the grooves to form IDT electrodes, a step of performing a process of removing a portion of th |
| 7629581 |
Infrared sensor and method of producing the same |
December 8, 2009 |
| A method of producing an infrared sensor includes the steps of preparing a base integrally provided with a first electrode, and a plurality of supporting portions made of a material with low thermal conductivity, on one of principal surfaces of the base, preparing a pyroelectric element |
| 7626803 |
Dielectric ceramic and multilayer ceramic capacitor |
December 1, 2009 |
| A dielectric ceramic is provided having a high relative dielectric constant, and in the case in which it is used for a multilayer ceramic capacitor, high insulating properties and superior reliability can be obtained even when the thickness of a dielectric ceramic layer is decreased. |
| 7626475 |
Saw filter device |
December 1, 2009 |
| A SAW filter device includes a SAW filter chip in which one-port surface acoustic wave resonators each including an IDT made of Al or an Al alloy, are provided on a .theta.-rotated Y-cut X-propagation LiNbO.sub.3 substrate. The cutting angle .theta. of the .theta.-rotated Y-cut X-pro |
| 7626314 |
Surface acoustic wave device |
December 1, 2009 |
| A surface acoustic wave device which uses a Rayleigh wave as a surface acoustic wave includes an IDT electrode provided on a piezoelectric substrate composed of quartz having Euler angles of (0.degree..+-.5.degree., 0.degree. to 140.degree., 0.degree..+-.40.degree.), a piezoelectric |
| 7626313 |
Surface acoustic wave device |
December 1, 2009 |
| A surface acoustic wave device includes a LiNbO.sub.3 substrate having a plurality of grooves formed in the upper surface thereof, an IDT electrode formed by filling the grooves with a metal, and a SiO.sub.2 layer arranged to cover an upper surface of the LiNbO.sub.3 substrate and th |
| 7626167 |
Infrared sensor |
December 1, 2009 |
| A small infrared sensor has a wide infrared light-receiving area (viewing angle), high electromagnetic shielding characteristics, and excellent electromagnetic-wave resistance characteristics. In the infrared sensor, supporting portions are disposed at four corners of a substantially |
| 7626127 |
Shield structure |
December 1, 2009 |
| A shield structure having a plurality of hollow columnar base members arranged with intervals therebetween along the periphery of a section to be shielded on a surface of a circuit board, and a shield cover with a peripheral wall having insertion pieces arranged along the edge thereof |
| 7624639 |
Acceleration sensor |
December 1, 2009 |
| An acceleration sensor includes a detection element having a plurality of piezoelectric ceramic layers laminated together and a pair of retaining members that retain an end portion of the detection element in a longitudinal direction thereof at two principal surfaces of the end porti |
| 7624492 |
Method for manufacturing electronic parts |
December 1, 2009 |
| An elastic material, in which at least the surface thereof is adhesive and conductive, is provided on a plate, and while a substrate constituting a component of an electronic part is held on the surface of the elastic material by the adhesiveness of the elastic material, an element such |
| 7623009 |
Boundary acoustic wave filter device |
November 24, 2009 |
| A boundary acoustic wave filter device capable of increasing an out-of-band attenuation includes a dielectric film formed on a piezoelectric substrate, at least one longitudinally coupled resonator boundary acoustic wave filter having a plurality of IDTs disposed along a boundary bet |
| 7621980 |
Carbon dioxide absorbent and carbon dioxide absorption method using the same |
November 24, 2009 |
| A carbon dioxide absorbent that can absorb carbon dioxide at a temperature lower than that of a conventional Ba.sub.2TiO.sub.4 absorbent, as well as at a high temperature of at least 700.degree. C., and desorb carbon dioxide at a temperature lower than that of the conventional absorbent |
| 7619491 |
Elastic wave duplexer |
November 17, 2009 |
| An elastic wave duplexer includes a transmission filter chip and a reception filter chip each defined by an elastic wave filter chip and flip-chip bonded to a laminated board. A coil-shaped line including coil-shaped line patterns is provided inside the laminated board. The coil-shap |
| 7618843 |
Method of fabricating multilayer ceramic substrate |
November 17, 2009 |
| A method of fabricating a multilayer ceramic substrate includes stacking one or a plurality of unfired ceramic greensheets on one or both sides of a previously fired ceramic substrate, thereby forming a stack, each unfired ceramic greensheet having a firing temperature substantially |
| 7616427 |
Monolithic ceramic capacitor |
November 10, 2009 |
| A monolithic ceramic capacitor includes a first same-polarity-electrode-connecting conductor and a second same-polarity-electrode-connecting conductor that are provided inside a ceramic laminate. The first same-polarity-electrode-connecting conductor is electrically connected to all |
| 7615874 |
Electronic component module |
November 10, 2009 |
| An electronic component module is provided with a ceramic substrate and a plurality of bonding material applying lands. The ceramic substrate has a rear surface that is substantially rectangular. The plurality of bonding material applying lands are arranged on the rear surface. The plura |
| 7612983 |
Monolithic ceramic electronic component and method for manufacturing the same |
November 3, 2009 |
| A monolithic ceramic electronic component includes a ceramic laminate provided with ceramic layers and internal electrode layers disposed between the ceramic layers such that a portion of each internal electrode is led to an end surface of the ceramic laminate and the external electr |
| 7609383 |
Optical spectrum analyzer |
October 27, 2009 |
| An optical spectrum analyzer detects a light output that is dependent on the frequency of light in a wavelength range of light to be measured. The optical spectrum analyzer includes a waveguide acousto-optic tunable filter including a piezoelectric substrate, optical waveguides, and an |
| 7609130 |
High-frequency module including connection terminals arranged at a small pitch |
October 27, 2009 |
| In a high-frequency module, mounting lands arranged to mount at least one filter device having at least one set of an unbalanced terminal and two balanced terminals are provided at one side of a substrate top surface, and mounting lands arranged to mount at least one element electrically |
| 7608477 |
Process for substrate incorporating component |
October 27, 2009 |
| In a process for producing the component-embedded substrate, a first electronic component is connected and fixed onto a first electrode pattern with a conductive bonding material, the first electrode pattern being provided on a first supporting layer. A second supporting layer includ |
| 7607216 |
Method for manufacturing monolithic ceramic electronic component |
October 27, 2009 |
| A multilayer composite including a core made of a magnetic ceramic sintered compact disposed therein, and shrinkage restraining layers including an inorganic powder that is not substantially sintered at the sintering temperature of the green ceramic layers are sintered in order to re |
| 7605683 |
Monolithic electronic component |
October 20, 2009 |
| In a monolithic electronic component in which a resistive element is incorporated by forming a resistor film on a terminal electrode, a plating film can be formed on the terminal electrode having the resistor film via electroplating in an efficient manner and with a uniform film thic |
| 7605678 |
Multiple-mode dielectric resonator, dielectric filter, and communication device |
October 20, 2009 |
| A multiple-mode dielectric resonator in which a through hole is formed in a substantially cubic dielectric core so as to pass through opposing surfaces thereof. A conductive support bar is inserted into the through hole. Both ends of the support bar are secured to a cavity, and opposing |
| 7605677 |
Noise filter having filter components fitted into depressions in a base member |
October 20, 2009 |
| In a noise filter, an input side of a signal-line lead is inserted in a first substantially cylindrical ferrite bead, and an output side of the signal-line lead is inserted in a second substantially cylindrical ferrite bead. An input side of a ground lead is inserted in a third subst |
| 7605522 |
Piezoelectric device |
October 20, 2009 |
| A piezoelectric device is formed by simultaneously firing a piezoelectric ceramic mainly composed of a perovskite complex oxide represented by general formula ABO.sub.3 and electrodes mainly composed of copper. The piezoelectric ceramic is represented by Pb.sub..alpha.-aMe.sub.a[(M.s |
| 7605352 |
Method for sorting positive temperature coefficient (PTC) elements |
October 20, 2009 |
| In a method for sorting PTC elements having different resistance-temperature characteristics, a predetermined voltage that allows a current to sufficiently decay is applied to each of PTC elements A and B, and the PTC elements are sorted on the basis of the difference between the tim |
| 7605103 |
Translucent ceramic and method for manufacturing the same, and optical component and optical dev |
October 20, 2009 |
| A translucent ceramic containing a main component represented by Ba{M.sub.xB1.sub.yB2.sub.z}.sub.vO.sub.w (wherein B1 is a trivalent metallic element, B2 is a quintavalent metallic element, M is at least one selected from the group consisting of Ti, Sn, Zr and Hf, x+y+z=1, 0.ltoreq.x |
| 7601235 |
Manufacturing method of multilayer ceramic board |
October 13, 2009 |
| A method for manufacturing a multilayer ceramic board prevents damage to a wiring conductor formed on the surface of a multilayer ceramic board fabricated via a non-contraction process. On at least one principal surface of a layered body made up of a plurality of board ceramic green |
| 7598660 |
Monolithic piezoelectric element |
October 6, 2009 |
| A monolithic piezoelectric element includes a stack, and the stack includes a crack-forming conductive layer arranged to intentionally form a small crack in the stack. The small crack alleviates stress, thereby preventing the occurrence of a large crack that may extend to the piezoel |
| 7596009 |
Double-ended isolated DC-DC converter |
September 29, 2009 |
| In a double-ended isolated DC-DC converter, by using a main transformer and first and second pulse transformers, a first power switch of a primary side circuit and a first synchronous rectifier of a secondary side circuit are driven with complementary timing, and a second power switc |
| 7595997 |
Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufactur |
September 29, 2009 |
| In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a resin so that the pedestal portion is fixed to the first main surface with at least the res |
| 7595716 |
Electronic component and method for manufacturing the same |
September 29, 2009 |
| To provide an electronic component including a resistor element that can be efficiently produced with a range of resistances, and a method for manufacturing the electronic component, the electronic component includes a pair of terminals, and a resistor element disposed between the te |
| 7594316 |
Method of manufacturing composite electronic component |
September 29, 2009 |
| A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type |
| 7594307 |
Method for manufacturing piezoelectric resonator |
September 29, 2009 |
| A method of manufacturing a piezoelectric resonator includes forming first electrodes larger than vibrating electrodes in an area D1 including the vibrating electrodes on obverse and reverse surfaces of a piezoelectric substrate, and measuring the resonant frequency fr.sub.1 of a resonat |
| 7592818 |
Method and apparatus for measuring scattering coefficient of device under test |
September 22, 2009 |
| A measuring method and measurement system that includes a signal source that applies a signal to a device under test, a scalar measuring instrument that measures a reflected wave reflected from the device under test or a transmitted wave transmitted through the device under test as a |
| 7589952 |
Multilayer electronic device and method for manufacturing the same |
September 15, 2009 |
| A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 .mu.m or more is adhered to the end surface of the laminate, for example, by a |
| 7589951 |
Laminated electronic component and method for manufacturing the same |
September 15, 2009 |
| A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 .mu.m or less when |
| 7589527 |
Elongated magnetic sensor |
September 15, 2009 |
| A magnetoresistive device disposed in an elongated magnetic sensor, for example, has two parallel arrays of magnetosensitive elements arranged at regular intervals in the longitudinal direction. The magnetosensitive elements are connected in series through connection conductors, in a |
| 7586388 |
Filter module and communication apparatus |
September 8, 2009 |
| In a filter module, a common input/output portion of a switch circuit is set as a first port. A first filter arranged to pass a signal in a first frequency band is connected between a first input/output portion of the switch circuit and a second port. A second filter arranged to pass a |
| 7586302 |
Detection device and rotation angle sensor |
September 8, 2009 |
| A detection device and a rotation angle sensor include a case body and a cover member. A support portion in the case body is provided with fitting protuberances fitted in fitting holes of a printed board, on which a detection component is mounted, so as to position the printed board. Eac |
| 7586241 |
Electroacoustic transducer |
September 8, 2009 |
| An electroacoustic transducer having one end portion of a first piezoelectric element and one end portion of a second piezoelectric element fixed to a frame such that the first piezoelectric element and the second piezoelectric element are supported by the frame in an opening of the |
| 7583493 |
Monolithic semiconductor ceramic capacitor having varistor function and method for manufacturing |
September 1, 2009 |
| A monolithic semiconductor ceramic capacitor includes semiconductor ceramic layers made of a semiconductor ceramic having a Sr site and a Ti site. The semiconductor ceramic satisfies the inequality 1.000<m.ltoreq.1.020, wherein m represents the molar ratio of the Sr site to the Ti |
| 7583226 |
Dielectric antenna |
September 1, 2009 |
| A dielectric antenna is provided which uses a compounded material and exhibits a small change in relative dielectric constant at room temperature against a load due to temperature changes. The dielectric antenna includes a dielectric block, a radiation electrode, a feeding electrode |
