| Patent Number |
Title Of Patent |
Date Issued |
| RE39975 |
Surface acoustic wave device and communication device |
January 1, 2008 |
| A surface acoustic wave device including a LiTaO.sub.3 substrate, and an interdigital transducer is provided on the LiTaO.sub.3 substrate. The interdigital transducer includes as a major component at least one of Au, Ag, Ta, Mo, Cu, Ni, Cr, Zn, and W, and the interdigital transducer has |
| D602480 |
Antenna for wireless tag |
October 20, 2009 |
|
| D602479 |
Antenna for wireless tag |
October 20, 2009 |
|
| D534133 |
Semiconductor module |
December 26, 2006 |
|
| 7623009 |
Boundary acoustic wave filter device |
November 24, 2009 |
| A boundary acoustic wave filter device capable of increasing an out-of-band attenuation includes a dielectric film formed on a piezoelectric substrate, at least one longitudinally coupled resonator boundary acoustic wave filter having a plurality of IDTs disposed along a boundary bet |
| 7621980 |
Carbon dioxide absorbent and carbon dioxide absorption method using the same |
November 24, 2009 |
| A carbon dioxide absorbent that can absorb carbon dioxide at a temperature lower than that of a conventional Ba.sub.2TiO.sub.4 absorbent, as well as at a high temperature of at least 700.degree. C., and desorb carbon dioxide at a temperature lower than that of the conventional absorbent |
| 7619491 |
Elastic wave duplexer |
November 17, 2009 |
| An elastic wave duplexer includes a transmission filter chip and a reception filter chip each defined by an elastic wave filter chip and flip-chip bonded to a laminated board. A coil-shaped line including coil-shaped line patterns is provided inside the laminated board. The coil-shap |
| 7618843 |
Method of fabricating multilayer ceramic substrate |
November 17, 2009 |
| A method of fabricating a multilayer ceramic substrate includes stacking one or a plurality of unfired ceramic greensheets on one or both sides of a previously fired ceramic substrate, thereby forming a stack, each unfired ceramic greensheet having a firing temperature substantially |
| 7616427 |
Monolithic ceramic capacitor |
November 10, 2009 |
| A monolithic ceramic capacitor includes a first same-polarity-electrode-connecting conductor and a second same-polarity-electrode-connecting conductor that are provided inside a ceramic laminate. The first same-polarity-electrode-connecting conductor is electrically connected to all |
| 7615874 |
Electronic component module |
November 10, 2009 |
| An electronic component module is provided with a ceramic substrate and a plurality of bonding material applying lands. The ceramic substrate has a rear surface that is substantially rectangular. The plurality of bonding material applying lands are arranged on the rear surface. The plura |
| 7612983 |
Monolithic ceramic electronic component and method for manufacturing the same |
November 3, 2009 |
| A monolithic ceramic electronic component includes a ceramic laminate provided with ceramic layers and internal electrode layers disposed between the ceramic layers such that a portion of each internal electrode is led to an end surface of the ceramic laminate and the external electr |
| 7609383 |
Optical spectrum analyzer |
October 27, 2009 |
| An optical spectrum analyzer detects a light output that is dependent on the frequency of light in a wavelength range of light to be measured. The optical spectrum analyzer includes a waveguide acousto-optic tunable filter including a piezoelectric substrate, optical waveguides, and an |
| 7609130 |
High-frequency module including connection terminals arranged at a small pitch |
October 27, 2009 |
| In a high-frequency module, mounting lands arranged to mount at least one filter device having at least one set of an unbalanced terminal and two balanced terminals are provided at one side of a substrate top surface, and mounting lands arranged to mount at least one element electrically |
| 7608477 |
Process for substrate incorporating component |
October 27, 2009 |
| In a process for producing the component-embedded substrate, a first electronic component is connected and fixed onto a first electrode pattern with a conductive bonding material, the first electrode pattern being provided on a first supporting layer. A second supporting layer includ |
| 7607216 |
Method for manufacturing monolithic ceramic electronic component |
October 27, 2009 |
| A multilayer composite including a core made of a magnetic ceramic sintered compact disposed therein, and shrinkage restraining layers including an inorganic powder that is not substantially sintered at the sintering temperature of the green ceramic layers are sintered in order to re |
| 7605683 |
Monolithic electronic component |
October 20, 2009 |
| In a monolithic electronic component in which a resistive element is incorporated by forming a resistor film on a terminal electrode, a plating film can be formed on the terminal electrode having the resistor film via electroplating in an efficient manner and with a uniform film thic |
| 7605678 |
Multiple-mode dielectric resonator, dielectric filter, and communication device |
October 20, 2009 |
| A multiple-mode dielectric resonator in which a through hole is formed in a substantially cubic dielectric core so as to pass through opposing surfaces thereof. A conductive support bar is inserted into the through hole. Both ends of the support bar are secured to a cavity, and opposing |
| 7605677 |
Noise filter having filter components fitted into depressions in a base member |
October 20, 2009 |
| In a noise filter, an input side of a signal-line lead is inserted in a first substantially cylindrical ferrite bead, and an output side of the signal-line lead is inserted in a second substantially cylindrical ferrite bead. An input side of a ground lead is inserted in a third subst |
| 7605522 |
Piezoelectric device |
October 20, 2009 |
| A piezoelectric device is formed by simultaneously firing a piezoelectric ceramic mainly composed of a perovskite complex oxide represented by general formula ABO.sub.3 and electrodes mainly composed of copper. The piezoelectric ceramic is represented by Pb.sub..alpha.-aMe.sub.a[(M.s |
| 7605352 |
Method for sorting positive temperature coefficient (PTC) elements |
October 20, 2009 |
| In a method for sorting PTC elements having different resistance-temperature characteristics, a predetermined voltage that allows a current to sufficiently decay is applied to each of PTC elements A and B, and the PTC elements are sorted on the basis of the difference between the tim |
| 7605103 |
Translucent ceramic and method for manufacturing the same, and optical component and optical dev |
October 20, 2009 |
| A translucent ceramic containing a main component represented by Ba{M.sub.xB1.sub.yB2.sub.z}.sub.vO.sub.w (wherein B1 is a trivalent metallic element, B2 is a quintavalent metallic element, M is at least one selected from the group consisting of Ti, Sn, Zr and Hf, x+y+z=1, 0.ltoreq.x |
| 7601235 |
Manufacturing method of multilayer ceramic board |
October 13, 2009 |
| A method for manufacturing a multilayer ceramic board prevents damage to a wiring conductor formed on the surface of a multilayer ceramic board fabricated via a non-contraction process. On at least one principal surface of a layered body made up of a plurality of board ceramic green |
| 7598660 |
Monolithic piezoelectric element |
October 6, 2009 |
| A monolithic piezoelectric element includes a stack, and the stack includes a crack-forming conductive layer arranged to intentionally form a small crack in the stack. The small crack alleviates stress, thereby preventing the occurrence of a large crack that may extend to the piezoel |
| 7596009 |
Double-ended isolated DC-DC converter |
September 29, 2009 |
| In a double-ended isolated DC-DC converter, by using a main transformer and first and second pulse transformers, a first power switch of a primary side circuit and a first synchronous rectifier of a secondary side circuit are driven with complementary timing, and a second power switc |
| 7595997 |
Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufactur |
September 29, 2009 |
| In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a resin so that the pedestal portion is fixed to the first main surface with at least the res |
| 7595716 |
Electronic component and method for manufacturing the same |
September 29, 2009 |
| To provide an electronic component including a resistor element that can be efficiently produced with a range of resistances, and a method for manufacturing the electronic component, the electronic component includes a pair of terminals, and a resistor element disposed between the te |
| 7594316 |
Method of manufacturing composite electronic component |
September 29, 2009 |
| A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type |
| 7594307 |
Method for manufacturing piezoelectric resonator |
September 29, 2009 |
| A method of manufacturing a piezoelectric resonator includes forming first electrodes larger than vibrating electrodes in an area D1 including the vibrating electrodes on obverse and reverse surfaces of a piezoelectric substrate, and measuring the resonant frequency fr.sub.1 of a resonat |
| 7592818 |
Method and apparatus for measuring scattering coefficient of device under test |
September 22, 2009 |
| A measuring method and measurement system that includes a signal source that applies a signal to a device under test, a scalar measuring instrument that measures a reflected wave reflected from the device under test or a transmitted wave transmitted through the device under test as a |
| 7589952 |
Multilayer electronic device and method for manufacturing the same |
September 15, 2009 |
| A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 .mu.m or more is adhered to the end surface of the laminate, for example, by a |
| 7589951 |
Laminated electronic component and method for manufacturing the same |
September 15, 2009 |
| A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 .mu.m or less when |
| 7589527 |
Elongated magnetic sensor |
September 15, 2009 |
| A magnetoresistive device disposed in an elongated magnetic sensor, for example, has two parallel arrays of magnetosensitive elements arranged at regular intervals in the longitudinal direction. The magnetosensitive elements are connected in series through connection conductors, in a |
| 7586388 |
Filter module and communication apparatus |
September 8, 2009 |
| In a filter module, a common input/output portion of a switch circuit is set as a first port. A first filter arranged to pass a signal in a first frequency band is connected between a first input/output portion of the switch circuit and a second port. A second filter arranged to pass a |
| 7586302 |
Detection device and rotation angle sensor |
September 8, 2009 |
| A detection device and a rotation angle sensor include a case body and a cover member. A support portion in the case body is provided with fitting protuberances fitted in fitting holes of a printed board, on which a detection component is mounted, so as to position the printed board. Eac |
| 7586241 |
Electroacoustic transducer |
September 8, 2009 |
| An electroacoustic transducer having one end portion of a first piezoelectric element and one end portion of a second piezoelectric element fixed to a frame such that the first piezoelectric element and the second piezoelectric element are supported by the frame in an opening of the |
| 7583493 |
Monolithic semiconductor ceramic capacitor having varistor function and method for manufacturing |
September 1, 2009 |
| A monolithic semiconductor ceramic capacitor includes semiconductor ceramic layers made of a semiconductor ceramic having a Sr site and a Ti site. The semiconductor ceramic satisfies the inequality 1.000<m.ltoreq.1.020, wherein m represents the molar ratio of the Sr site to the Ti |
| 7583226 |
Dielectric antenna |
September 1, 2009 |
| A dielectric antenna is provided which uses a compounded material and exhibits a small change in relative dielectric constant at room temperature against a load due to temperature changes. The dielectric antenna includes a dielectric block, a radiation electrode, a feeding electrode |
| 7583161 |
Surface acoustic wave device and boundary acoustic wave device |
September 1, 2009 |
| A piezoelectric substrate is joined to a cover with a support layer disposed therebetween and with a space maintained therebetween. A transmission surface acoustic wave filter and a reception surface acoustic wave filter are disposed on a major surface of the piezoelectric substrate |
| 7583011 |
Package of surface-mountable electronic component |
September 1, 2009 |
| A package of a surface-mountable electronic component to be reflow-soldered to a circuit board at about 250.degree. C. or more includes a case and a cover. The cover has a softening temperature lower than the reflow temperature, and the case has a softening temperature higher than th |
| 7583007 |
Piezoelectric vibrator |
September 1, 2009 |
| An energy-trapping strip piezoelectric vibrator utilizing a third harmonic overtone of a thickness shear mode is provided. A piezoelectric vibrator 1 has a strip piezoelectric ceramic substrate 2 polarized in a longitudinal direction, and first and second excitation electrodes 3 and |
| 7581306 |
Method for producing a boundary acoustic wave device |
September 1, 2009 |
| In a method for producing a boundary acoustic wave device that includes a first medium, a second medium, and a third medium laminated in that order, and electrodes disposed at the interface between the first medium and the second medium, the method includes the steps of preparing a l |
| 7579930 |
High-frequency module |
August 25, 2009 |
| A high-frequency module is integrally formed from at least some circuit components defining a first wireless system using a first frequency band and at least some circuit components defining a second wireless system using a second frequency band. The high-frequency module includes a |
| 7579923 |
Laminated balun transformer |
August 25, 2009 |
| A laminated balun transformer that may be used for lines having various impedances includes a first magnetic substrate, a laminated body, a second magnetic substrate, and external electrodes. The laminated body includes a first transformer, a second transformer, and an insulator that |
| 7579760 |
Vibrator and production method therefor |
August 25, 2009 |
| A vibrator includes a vibrating body having a substantially quadrangular prism shape and including four side surfaces extending in the longitudinal direction of the vibrating body. A common electrode is formed on substantially an entire surface of one of the side surfaces of the vibr |
| 7574914 |
Acceleration sensor |
August 18, 2009 |
| An acceleration sensor includes a frame-shaped beam portion disposed above an XY substrate surface of a base in a floating state and a beam-portion supporting/fixing unit arranged to attach the beam portion to the base with support portions so as to be supported on two sides. The acc |
| 7570477 |
Ceramic electronic component and method for manufacturing the same |
August 4, 2009 |
| In a ceramic electronic component, an electrically conductive resin layer is arranged to cover a thick film layer and to extend beyond the end of the thick film layer by at least about 100 .mu.m and a plating layer is arranged to cover the electrically conductive resin layer except a reg |
| 7569972 |
Surface acoustic wave device |
August 4, 2009 |
| A surface acoustic wave device utilizing a Rayleigh wave includes a LiNbO.sub.3 substrate having Euler angles of (0.degree..+-.5.degree., .theta..+-.5.degree., 0.degree..+-.10.degree.), an electrode which is disposed on the LiNbO.sub.3 substrate and which includes an IDT electrode pr |
| 7569925 |
Module with built-in component |
August 4, 2009 |
| A module with a built-in component is produced by disposing a cavity on a mounting surface side of a ceramic multilayer substrate, storing a circuit component therein and, thereafter, performing resin molding. A second resin portion is disposed on the mounting surface side of the cer |
| 7569177 |
Method of producing ceramic multilayer substrates, and green composite laminate |
August 4, 2009 |
| A method of producing a ceramic multilayer substrate involves producing a green composite laminate 11 containing first and second shrink-suppressing layers formed on the main surfaces of a green multilayer mother substrate 12 having a plurality of ceramic green layers 17 containing c |
| 7569162 |
Electrically conductive paste and multilayer ceramic substrate |
August 4, 2009 |
| An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range in which sintering is effected in a firing step can be controlled relatively optimally. The electrically conductiv |
