| Patent Number |
Title Of Patent |
Date Issued |
| 7452574 |
Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-con |
November 18, 2008 |
| The present invention provides a method to reduce adhesion between a polymerizable layer and a substrate surface that selectively comes into contact with the polymerizable layer. The method features disposing a coating upon the surface from a composition having a perfluoro silane con |
| 7442336 |
Capillary imprinting technique |
October 28, 2008 |
| The present invention provides a method for patterning a substrate with a template having a mold that features positioning conformable material between the substrate and the mold and filling a volume defined between the mold and the substrate with the conformable material through cap |
| 7420654 |
Method of varying dimensions of a substrate during nano-scale manufacturing |
September 2, 2008 |
| The present invention is directed toward a method to vary dimensions of a substrate supported by a chuck. The method includes applying compressive forces to the substrate with the actuator assembly while facilitating movement of the actuator assembly with respect to the substrate to |
| 7396475 |
Method of forming stepped structures employing imprint lithography |
July 8, 2008 |
| The present invention provides a method for forming a stepped structure on a substrate that features transferring, into the substrate, an inverse shape of the stepped structure disposed on the substrate. |
| 7387508 |
Compliant device for nano-scale manufacturing |
June 17, 2008 |
| The present invention is directed to a compliant device comprising a support body, a floating body, and a plurality of flexure arms. Each of the plurality of flexure arms is connected between the support body and the floating body to transfer a load therebetween in parallel. To that |
| 7357876 |
Eliminating printability of sub-resolution defects in imprint lithography |
April 15, 2008 |
| The present invention provides a method of forming a desired pattern in a layer positioned on a substrate with a mold, the method including, inter alia, contacting the layer with the mold forming a shape therein having a plurality of features extending in a first direction; and altering |
| 7338275 |
Formation of discontinuous films during an imprint lithography process |
March 4, 2008 |
| The present invention is directed to a template having a body including a surface with first and second regions. The first region has first wetting characteristics for a given material and the second region has second wetting characteristics for the given material. The first wetting |
| 7323417 |
Method of forming a recessed structure employing a reverse tone process |
January 29, 2008 |
| The present invention provides a method of forming recesses on a substrate, the method including forming on the substrate a patterning layer having first features; trim etching the first features to define trimmed features having a shape; and transferring an inverse of the shape into |
| 7323130 |
Magnification correction employing out-of-plane distortion of a substrate |
January 29, 2008 |
| The present invention is directed to a method of controlling dimensional relations between an original pattern present in a mold and a recorded pattern formed in a layer of a substrate. In this manner, the size of the recorded pattern may appear to be magnified and/or reduced, when compa |
| 7316554 |
System to control an atmosphere between a body and a substrate |
January 8, 2008 |
| The present invention is directed towards a system to control an atmosphere about a substrate, the system including, inter alia, a body spaced-apart from a surface of the substrate a distance; a supply of fluid coupled to introduce a flow between the body and the substrate; and a wal |
| 7309225 |
Moat system for an imprint lithography template |
December 18, 2007 |
| The present invention is directed to a body having a first area and a second area separated by a recess. The recess is dimensioned to reduce, if not prevent, a liquid moving along a surface of the body from traveling between the first and second areas. One or more alignment marks may |
| 7307118 |
Composition to reduce adhesion between a conformable region and a mold |
December 11, 2007 |
| The present invention provides compositions that feature improved preferential adhesion and release characteristics with respect to a substrate and a mold having imprinting material disposed therebetween. To that end, the compositions facilitate bifurcation of the imprinting into a s |
| 7298456 |
System for varying dimensions of a substrate during nanoscale manufacturing |
November 20, 2007 |
| The present invention is directed toward a system to vary dimensions of a substrate, such as a template having a patterned mold. To that end, the system includes a substrate chuck adapted to position the substrate in a region; a pliant member; and an actuator sub-assembly elastically cou |
| 7292326 |
Interferometric analysis for the manufacture of nano-scale devices |
November 6, 2007 |
| The present invention features a system to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The system senses relative alignment between the two coordinate systems at |
| 7282550 |
Composition to provide a layer with uniform etch characteristics |
October 16, 2007 |
| The present invention includes a composition to form a layer on a substrate having uniform etch characteristics. To that end, the composition has a plurality of components, a subset of which has substantially similar rates of evaporation for an interval of time. |
| 7281921 |
Scatterometry alignment for imprint lithography |
October 16, 2007 |
| Described are methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns |
| 7281919 |
System for controlling a volume of material on a mold |
October 16, 2007 |
| A system for controlling a volume of liquid on a mold that features a body defining a volume with an aperture formed into the body and positioned proximate to the mold. A pump system is in fluid communication with the body, and the aperture and the pump system are established to create a |
| 7279113 |
Method of forming a compliant template for UV imprinting |
October 9, 2007 |
| A method of forming a lithographic template having an elastomer layer positioned between a body and an imprinting layer, the imprinting layer having a pattern formed thereon. |
| 7270533 |
System for creating a turbulent flow of fluid between a mold and a substrate |
September 18, 2007 |
| The present invention is directed toward a system for introducing a flow of a fluid between a mold, disposed on a template, and a substrate, the system including, a fluid supply system; and a chuck body having a baffle and first and second apertures, the first and second apertures dispos |
| 7261831 |
Positive tone bi-layer imprint lithography method |
August 28, 2007 |
| The present invention provides a method to pattern a substrate which features creating a multi-layered structure by forming, on the substrate, a patterned layer having protrusions and recessions. Formed upon the patterned layer is a conformal layer, with the multi-layered structure h |
| 7261830 |
Applying imprinting material to substrates employing electromagnetic fields |
August 28, 2007 |
| The present invention comprises a method for applying a liquid, such as imprinting material, to a substrate that features use of an electromagnetic field to rapidly spread the liquid over a desired portion of the substrate, while confining the same to the desired region. |
| 7259102 |
Etching technique to planarize a multi-layer structure |
August 21, 2007 |
| The present invention is directed to a method of etching a multi-layer structure formed from a layer of a first material and a layer of a second material differing from the first material to obtain a desired degree of planarization. To that end, the method includes creating a first set o |
| 7256131 |
Method of controlling the critical dimension of structures formed on a substrate |
August 14, 2007 |
| The present invention provides a method of patterning a substrate, the method including, inter alia, forming a multi-layered structure on the substrate formed from first, second and third materials. The first, second and third materials are exposed to an etch chemistry, with the firs |
| 7252777 |
Method of forming an in-situ recessed structure |
August 7, 2007 |
| The present invention features a method of patterning a substrate that includes forming from a first material, disposed on the substrate, a first film having an original pattern that includes a plurality of projections. The projections extend from a nadir surface terminating in an ap |
| 7252715 |
System for dispensing liquids |
August 7, 2007 |
| The present invention provides a system to dispense a liquid, contained in a cartridge, onto a substrate employing a dispensing system under control of a processor in data communication with a memory. |
| 7244386 |
Method of compensating for a volumetric shrinkage of a material disposed upon a substrate to for |
July 17, 2007 |
| The present invention provides a method of planarizing a substrate with a template spaced-apart from the substrate having a liquid disposed therebetween, the method including: contacting the liquid with the template forming a first shape therein; and impinging radiation upon the liqu |
| 7241395 |
Reverse tone patterning on surfaces having planarity perturbations |
July 10, 2007 |
| The present invention features a method of patterning a substrate that includes forming, on the substrate, a first film having an original pattern that includes a plurality of projections a subset of which extends from a nadir surface terminating in an apex surface defining a height |
| 7224443 |
Imprint lithography substrate processing tool for modulating shapes of substrates |
May 29, 2007 |
| The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides |
| 7186656 |
Method of forming a recessed structure employing a reverse tone process |
March 6, 2007 |
| The present invention provides a method of forming recesses on a substrate, the method including forming on the substrate a patterning layer having first features; trim etching the first features to define trimmed features having a shape; and transferring an inverse of the shape into |
| 7179396 |
Positive tone bi-layer imprint lithography method |
February 20, 2007 |
| The present invention provides a method to pattern a substrate which features creating a multi-layered structure by forming, on the substrate, a patterned layer having protrusions and recessions. Formed upon the patterned layer is a conformal layer, with the multi-layered structure h |
| 7179079 |
Conforming template for patterning liquids disposed on substrates |
February 20, 2007 |
| The present invention includes a conforming template for patterning liquids disposed on substrates. The template includes a body having opposed first and second surfaces. The first surface includes a plurality of recessed regions with a patterning region being disposed between adjace |
| 7170589 |
Apparatus to vary dimensions of a substrate during nano-scale manufacturing |
January 30, 2007 |
| The present invention is directed toward a system to vary dimensions of a substrate, such as a template having a patterned mold. To that end, the system includes a substrate chuck adapted to position the substrate in a region; a pliant member; and an actuator sub-assembly elastically cou |
| 7157036 |
Method to reduce adhesion between a conformable region and a pattern of a mold |
January 2, 2007 |
| The present invention provides a method to reduce adhesion between a conformable region on a substrate and a pattern of a mold, which selectively comes into contact with the conformable region. The method features forming a conformable material on the substrate and contacting the con |
| 7150622 |
Systems for magnification and distortion correction for imprint lithography processes |
December 19, 2006 |
| The present invention is directed toward a system to vary dimensions of a template in order to attenuate if not prevent distortions in an underlying pattern formed by the template. To that end, the system features a compression device that includes a pair of spaced-apart contact memb |
| 7140861 |
Compliant hard template for UV imprinting |
November 28, 2006 |
| A compliant UV imprint lithography template, which may also act as a thermal implant template, and methods for manufacturing it. The template essentially comprises a relief image and an elastomer adapted to adjust the relief image. In an embodiment, the relief image is arranged in a |
| 7136150 |
Imprint lithography template having opaque alignment marks |
November 14, 2006 |
| The present invention is directed to providing a template with alignment marks that are opaque to selective wavelength of light. In one embodiment, a template is provided having patterning areas and a template, with the template mark being formed from metal and disposed outside of th |
| 7132225 |
Methods of inspecting a lithography template |
November 7, 2006 |
| A method for forming imprint lithography templates is described herein. The method includes forming a masking layer and a conductive layer on a substrate surface. The use of a conductive layer allows patterning of the masking layer using electron beam pattern generators. The substrate is |
| 7122482 |
Methods for fabricating patterned features utilizing imprint lithography |
October 17, 2006 |
| One embodiment of the present invention is a method for generating patterned features on a substrate that includes: (a) forming a first layer on at least a portion of a surface of the substrate, the first layer comprising at least one layer of a first material, which one layer abuts |
| 7122079 |
Composition for an etching mask comprising a silicon-containing material |
October 17, 2006 |
| The present invention includes a composition for a silicon-containing material used as an etch mask for underlying layers. More specifically, the silicon-containing material may be used as an etch mask for a patterned imprinted layer comprising protrusions and recessions. To that end |
| 7105452 |
Method of planarizing a semiconductor substrate with an etching chemistry |
September 12, 2006 |
| The present invention provides a method of planarizing a substrate, the method including, forming, on the substrate, a patterned layer having a first shape associated therewith; and processing the patterned layer, with the first shape compensating for variations in the processing such |
| 7090716 |
Single phase fluid imprint lithography method |
August 15, 2006 |
| The present invention is directed toward a method for reducing pattern distortions in imprinting layers by reducing gas pockets present in a layer of viscous liquid deposited on a substrate. To that end, the method includes varying a transport of the gases disposed proximate to the v |
| 7077992 |
Step and repeat imprint lithography processes |
July 18, 2006 |
| The present invention is directed to methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an impri |
| 7071088 |
Method for fabricating bulbous-shaped vias |
July 4, 2006 |
| The present invention provides a method for fabricating bulbous-shaped vias on a substrate, having a surface, by disposing, on the substrate, a polymerizable fluid composition. A mold is placed in contact with the polymerizable fluid composition. The mold includes a relief structure on |
| 7070405 |
Alignment systems for imprint lithography |
July 4, 2006 |
| Described are systems for patterning a substrate by imprint lithography. Imprint lithography systems include an imprint head configured to hold a template in a spaced relation to a substrate. The imprint lithography system is configured to dispense an activating light curable liquid onto |
| 7041604 |
Method of patterning surfaces while providing greater control of recess anisotropy |
May 9, 2006 |
| The present invention features a method of patterning a substrate that includes forming, on the substrate, a multi-layer film defining an etch rate interface having a plurality of first portions that having a first etch rate associated therewith. The multi-layer film includes a second |
| 7037639 |
Methods of manufacturing a lithography template |
May 2, 2006 |
| A method for forming imprint lithography templates is described herein. The method includes forming a masking layer and a conductive layer on a substrate surface. The use of a conductive layer allows patterning of the masking layer using electron beam pattern generators. The substrate is |
| 7036389 |
System for determining characteristics of substrates employing fluid geometries |
May 2, 2006 |
| The present invention provides a system for determining characteristics of substrates, such as the presence of contaminants, shape, as well as the spatial relationships between spaced-apart substrates. The spatial relationships include distance and angular orientation between first and |
| 7027156 |
Scatterometry alignment for imprint lithography |
April 11, 2006 |
| Described are methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns |
| 7019835 |
Method and system to measure characteristics of a film disposed on a substrate |
March 28, 2006 |
| The present invention is directed to providing a method and system to measure characteristics of a film disposed on a substrate. The method includes identifying a plurality of processing regions on the film; measuring characteristics of a subset of the plurality of processing regions |
| 7019819 |
Chucking system for modulating shapes of substrates |
March 28, 2006 |
| The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides |
