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Mitsubishi Engineering-Plastics Corp. Patents
Assignee:
Mitsubishi Engineering-Plastics Corp.
Address:
Tokyo, JP
No. of patents:
9
Patents:




Patent Number Title Of Patent Date Issued
7048428 Light guide plate with convex portions having low radius of curvature tips, or low surface rough May 23, 2006
A light guide plate made of a transparent resin includes a first main surface and a second main surface opposite to the first main surface. The first main surface has a surface portion provided with convex portions having a height in the range of 5.times.10.sup.-7 m to 6.times.10.sup.-5
6866811 Method for injection-molding an article having a hollow portion March 15, 2005
An injection-molding apparatus comprises a mold assembly having a first-molten-resin injection portion for injecting a first molten thermoplastic resin into a cavity of the mold assembly, a second-molten-resin injection portion for injecting a second molten thermoplastic resin into t
6730725 Polycarbonate and resin composition May 4, 2004
The present invention relates to a polycarbonate which can be obtained by a melting method and has a viscosity-average molecular weight of 16000 to 27000, and whose loss angle .delta. and complex viscosity .eta.* (Pa.multidot.s) measured under the conditions of 250.degree. C. and an
6608133 Thermoplastic resin composition, molded product using the same and transport member for electric August 19, 2003
The present invention relates to a thermoplastic resin composition comprising a thermoplastic resin and hollow carbon fibrils dispersed in the thermoplastic resin, the hollow carbon fibrils being present in an amount of 0.1 to 20% by weight based on the total weight of the composition
6391418 Substrate for information recording media May 21, 2002
The present invention relates to a substrate for information recording media, which comprises aromatic polycarbonate resin composition comprising:100 parts by weight of an aromatic polycarbonate resin having a viscosity-average molecular weight of 10,000 to 40,000, and0.01 to 40 parts by
6202883 Tray for semiconductor integrated circuit devices March 20, 2001
A tray for semiconductor integrated circuit devices, including a plurality of first partition walls extending in a first direction, a plurality of second partition walls extending in a second direction at right angles with the first direction, and circumferential frame portions connectin
6165407 Mold assembly for molding thermoplastic resin and method of manufacturing molded article of ther December 26, 2000
A mold assembly for molding a thermoplastic resin, which comprises; (a) a first mold member and a second mold member for manufacturing a molded article of a thermoplastic resin, (b) an insert block provided in the first mold member, said insert block constituting part of a cavity, having
5942169 Optimization of overmolding method for three-dimensional hollow molded article August 24, 1999
A method of over-molding used to produce a three-dimensional hollow molded article employs a core made of resin having a hollow portion. The core is placed in a cavity of a mold. Molten resin is injected into a space formed by the core and a cavity wall of the mold through a resin inject
5736090 Method of in-mold coating April 7, 1998
A method of in-mold coating using a coating composition including:(A) a vehicle component including (i) a urethane acrylate oligomer or a urethane methacrylate oligomer, which is a reaction product containing no substantial unreacted isocyanate groups, of (a) an organic polyisocyanate, (

 
 
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