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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Microelectronics and Computer Technology Corporation Patents
Assignee:
Microelectronics and Computer Technology Corporation
Address:
Austin, TX
No. of patents:
167
Patents:


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Patent Number Title Of Patent Date Issued
5830533 Selective patterning of metallization on a dielectric substrate November 3, 1998
A method of selectively fabricating metallization on a dielectric substrate is disclosed. A seed layer is sputtered on a polymer dielectric, a patterned photoresist mask is disposed over the seed layer, exposed portions of the seed layer are etched, the photoresist is stripped, and c
5679043 Method of making a field emitter October 21, 1997
A matrix addressable flat panel display includes a flat cathode operable for emitting electrons to an anode when an electric field is produced across the surface of the flat cathode by two electrodes placed on each side of the flat cathode. The flat cathode may consist of a cermet or
5659224 Cold cathode display device August 19, 1997
A display device for use in conjunction with a computer system includes a cathode having a layer of conductive material and a layer of low-effective work function material deposited over the conductive material wherein the low-effective work function material has an emission surface comp
5652083 Methods for fabricating flat panel display systems and components July 29, 1997
A method is provided for fabricating a display cathode which includes forming a conductive line adjacent a face of a substrate. A region of amorphic diamond is formed adjacent a selected portion of the conductive line.
5612712 Diode structure flat panel display March 18, 1997
A matrix-addressed diode flat panel display of field emission type is described, utilizing a diode (two terminal) pixel structure. The flat panel display comprises a cathode assembly having a plurality of cathodes, each cathode including a layer of cathode conductive material and a layer
5601966 Methods for fabricating flat panel display systems and components February 11, 1997
A method is provided for fabricating a display cathode which includes forming a conductive line adjacent a face of a substrate. A region of amorphic diamond is formed adjacent a selected portion of the conductive line.
5600200 Wire-mesh cathode February 4, 1997
A field emission cathode for use in flat panel displays comprises a layer of conductive material and a layer of amorphic diamond film, functioning as a low effective work-function material, deposited over the conductive material to form emission sites. The emission sites each contain at
5574814 Parallel optical transceiver link November 12, 1996
An assembly of an optical interconnect module adaptable for mating with an optical connector having at least one optical fiber and an alignment pin. A method of assembly includes the steps of (1) mounting an optical device onto a connector body, wherein the connector body is a portion of
5548185 Triode structure flat panel display employing flat field emission cathode August 20, 1996
A flat panel display of a field emission type having a triode (three terminal) structure and useful as a device for displaying visual information is disclosed. The display includes a plurality of corresponding light-emitting anodes and field-emission cathodes, each of the anodes emit
5544018 Electrical interconnect device with customizeable surface layer and interwoven signal lines August 6, 1996
Provided is an electrical interconnect cell intermittently spaced across a substrate to form an interconnect device or structure. The interconnect device is fully customizable or programmable upon the upper surface to accommodate various electrical components and connectivity to those
5543684 Flat panel display based on diamond thin films August 6, 1996
A field emission cathode is provided which includes a substrate and a conductive layer disposed adjacent the substrate. An electrically resistive pillar is disposed adjacent the conductive layer, the resistive pillar having a substantially flat surface spaced from and substantially p
5536193 Method of making wide band gap field emitter July 16, 1996
A field emitter comprising an exposed wide band gap emission area in contact with and protruding from a planar surface of a conductive metal, and a method of making is disclosed. Suitable wide band gap materials (2.5-7.0 electron-volts) include diamond, aluminum-nitride and gallium-n
5531880 Method for producing thin, uniform powder phosphor for display screens July 2, 1996
A system and method for producing thin, uniform powder phosphors for field emission display screens wherein a planarization of the phosphor powder layer is accomplished by placing the deposited phosphor layer in an anode plate between two optical flats, which are then mounted within a
5528099 Lateral field emitter device June 18, 1996
Lateral luminescent field emitter devices for use in flat panel displays and a method of manufacturing are described. The device comprises a flat substrate, an anode disposed on the substrate, and a cathode disposed on the substrate, the cathode providing an electron emission surface cap
5509071 Electronic proof of receipt April 16, 1996
A system for use in an electronic cryptosystem for providing a sender with electronic proof of receipt by an intended recipient of an electronic artifact is disclosed. The process is initiated by the recipient's requesting an artifact from the sender, who then obtains the recipient's
5508228 Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and April 16, 1996
Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The p
5503948 Thin cell electrochemical battery system; and method of interconnecting multiple thin cells April 2, 1996
Multicell system and method for making a multicell system. Systems include relatively thin (less than about 50 mil) electrochemical cells layered upon one another to minimize volume and weight. Cells systems are formed with cells that are layered such that first charge sides of each cell
5500905 Pattern recognition neural network with saccade-like operation March 19, 1996
A multi-layered pattern recognition neural network (30) is disclosed that comprises an input layer (50) that is operable to be mapped onto an input space that includes a scan window (32). Two hidden layers (54) and (58) map the input space to an output layer (34). The hidden layers utili
5462217 High force compression flip chip bonding system October 31, 1995
A high force flip chip bonding method and system that precisely and forcefully engage a flip chip device with a corresponding wiring pattern on a substrate in a manner that prevents flip chip device and substrate shifting during force application. The method includes the steps of det
5449970 Diode structure flat panel display September 12, 1995
A matrix-addressed diode flat panel display of field emission type is described, utilizing a diode (two terminal) pixel structure. The flat panel display includes a cathode assembly having a plurality of cathodes, each cathode including a layer of cathode conductive material and a layer
5438166 Customizable circuitry August 1, 1995
A customizable circuit using a programmable interconnect and compatible TAB chip bonding design. The programmable interconnect comprises layers of wire segments forming programmable junctions rather than continuous wires. This segmentation is performed with an offset from line to line in
5424656 Continuous superconductor to semiconductor converter circuit June 13, 1995
Apparatus for converting superconductor low level signals to semiconductor signal levels utilizing a continuous superconductor to semiconductor converter circuit biased for maximum gain and without the need for a clocked reset signal. Employing a unique biasing arrangement utilizing two
5403784 Process for manufacturing a stacked multiple leadframe semiconductor package using an alignment April 4, 1995
A process for manufacturing a pin grid array package providing a plurality of electrical input and/or output connections using a plurality of stacked, but spaced apart, separate leadframes which are preformed and include a plurality of electrical leads having first and second ends for
5399238 Method of making field emission tips using physical vapor deposition of random nuclei as etch ma March 21, 1995
A method of making sub-micron low work function field emission tips without using photolithography. The method includes physical vapor deposition of randomly located discrete nuclei to form a discontinuous etch mask. In one embodiment an etch is applied to low work function material cove
5393613 Composition for three-dimensional metal fabrication using a laser February 28, 1995
Direct fabrication of three-dimensional metal parts by irradiating a thin layer of a mixture of metal powder and temperature equalization and unification vehicle to melt the metal powder and form a solid metal film. The vehicle also protects the molten metal from oxidation. The metal
5393573 Method of inhibiting tin whisker growth February 28, 1995
An improved method for inhibiting tin whisker growth involving the implantation in a tin coating of an ion or ions selected from the group Pb, Bi, Sb, Tl, Cu, Ag, Au, Cd, Mo, Cr, W, Ar, He, Ne and Kr.
5383269 Method of making three dimensional integrated circuit interconnect module January 24, 1995
A three dimensional integrated circuit interconnect for connecting a plurality of chips in a module with a standard footprint for pin grid array or quad flat pack mounting. Each IC is mounted on a custom interconnect slice and tested. The slices are stacked together with electrical c
5382315 Method of forming etch mask using particle beam deposition January 17, 1995
A method of forming an etch mask and patterning a substrate. The method includes directing a particle beam at a substrate without using a mask to deposit an etch mask on the substrate which selectively exposes predetermined portions of the substrate, the etch mask consisting of parti
5380546 Multilevel metallization process for electronic components January 10, 1995
A maskless process for forming a protected metal feature in a planar insulating layer of a substrate is disclosed. A first barrier material is disposed in a recess in an insulating layer, a conductive metal is disposed on the first barrier material such that the entire metal feature
5379191 Compact adapter package providing peripheral to area translation for an integrated circuit chip January 3, 1995
An peripheral to area adapter for an integrated circuit chip. The adapter comprises pads on an upper surface of a support in a pattern corresponding to the terminals on a integrated circuit, planar reroute lines on the upper surface with first ends at the pads, and vertical conductive vi
5368217 High force compression flip chip bonding method and system November 29, 1994
A high force flip chip bonding method and system that precisely and forcefully engage a flip chip device with a corresponding wiring pattern on a substrate in a manner that prevents flip chip device and substrate shifting during force application. The method includes the steps of det
5347086 Coaxial die and substrate bumps September 13, 1994
A coaxial bump for connecting a die to a substrate includes a center post and a ground ring surrounding and shielding the center post. The center post may be a center conductor line, and the ground ring may be generally torus-shaped, nearly closed or completely closed. The coaxial bump
5344795 Method for encapsulating an integrated circuit using a removable heatsink support block September 6, 1994
A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the integrated circuit and the other end is exposed to the environment beyond the housing portion.
5341063 Field emitter with diamond emission tips August 23, 1994
A field emitter comprising a conductive metal and a diamond emission tip with negative electron affinity in ohmic contact with and protruding above the metal. The field emitter is fabricated by coating a substrate with an insulating diamond film having negative electron affinity and a to
5339391 Computer display unit with attribute enhanced scroll bar August 16, 1994
An attribute-enhanced scroll bar is graphically displayed. A selected portion of a stored data file, for example a document, is displayed in a display field, and a scroll bar field including a scroll bar is used to indicate the position of the displayed portion relative to the entire dat
5334245 Method and apparatus for coating the top of an electrical device August 2, 1994
A method and apparatus for dispensing a thin coating of a highly viscous encapsulant liquid on to the top surface of a semiconductor device having been inner lead bonded. The coating is dispensed with a controlled thickness and is substantially planar. A liquid encapsulant having optimum
5331172 Ionized metal cluster beam systems and methods July 19, 1994
Ionized metal cluster beam deposition of metal bumps on substrates such as multi-chip modules and integrated circuit chips is enhanced. The present invention discloses wet etching techniques for removing unwanted metal deposited on the substrate around bumps, multiple sources for deposit
5328087 Thermally and electrically conductive adhesive material and method of bonding with same July 12, 1994
The present invention discloses a thermally and electrically conductive adhesive material comprising a hardened adhesive, and a non-solidified filler containing a liquid metal dispersed in separate spaced regions of the adhesive. The hardened adhesive provides a mechanical bond whereas t
5317006 Cylindrical magnetron sputtering system May 31, 1994
An improved cathode for a sputtering system includes a metal cylinder and strips of material bonded to the inside of the metal cylinder and/or material sprayed onto the inside of the metal cylinder. The strips may have various specified compositions and/or configurations and/or other
5314003 Three-dimensional metal fabrication using a laser May 24, 1994
Three-dimensional metal parts are fabricated by irradiating a thin layer of a mixture of metal powder and temperature equalization and unification vehicle to melt the metal powder and form a solid metal film. The vehicle also protects the molten metal from oxidation. The metal powder can
5312514 Method of making a field emitter device using randomly located nuclei as an etch mask May 17, 1994
Method of making a field emitter device with submicron low work function emission tips without using photolithography. The method includes depositing in situ by evaporating or sputtering a discontinuous etch mask comprising randomly located discrete nuclei. In one embodiment an ion etch
5309321 Thermally conductive screen mesh for encapsulated integrated circuit packages May 3, 1994
An encapsulated integrated circuit package having an integrated circuit chip with a plurality of electrical leads connected thereto and at least one thermally conductive screen mesh positioned adjacent to the chip. A non-electrically conductive thermosetting or thermoplastic material for
5298288 Coating a heat curable liquid dielectric on a substrate March 29, 1994
A porous substrate curtain coated with a single coating of a liquid dielectric that is cured into a well adhering film at least 15 microns thick with a uniformity of less than 5 microns. The substrate is cleaned to remove contaminants, heated to remove moisture, curtain coated with a
5290732 Process for making semiconductor electrode bumps by metal cluster ion deposition and etching March 1, 1994
Ionized metal cluster beam deposition of metal bumps on substrates such as multi-chip modules and integrated circuit chips is enhanced. The present invention discloses wet etching techniques for removing unwanted metal deposited on the substrate around bumps, and multiple sources for
5289346 Peripheral to area adapter with protective bumper for an integrated circuit chip February 22, 1994
An peripheral to area adapter for an integrated circuit chip. The adapter comprises pads on an upper surface of a support in a pattern corresponding to the terminals on a integrated circuit, planar reroute lines on the upper surface with first ends at the pads, and vertical conductive vi
5284548 Process for producing electrical circuits with precision surface features February 8, 1994
A process for producing fine pitch surface features on a multilayer printed circuit boards such as copper-polyimide interconnects without requiring a thick copper plating foil. Initially, a thin first conductor (less than 1 micron) is vacuum deposited on a dielectric base and the dielect
5283946 Method and apparatus for forming metal leads February 8, 1994
The excise and lead form of TAB leads bonded to an integrated circuit chip. Leads extending beyond a sidewall are clamped between a first clamp and a form anvil at a first portion spaced from the chip. The leads are also clamped between an excise/form tool and a second clamp at a second
5272600 Electrical interconnect device with interwoven power and ground lines and capacitive vias December 21, 1993
The invention relates to an electrical interconnect device with power and ground lines interwoven about signal line layers and capacitive vias between signal layers so as to make efficient use of otherwise undedicated area between signal lines and signal layers and to reduce or eliminate
5272309 Bonding metal members with multiple laser beams December 21, 1993
A first laser beam and a second laser beam with a longer wavelength than the first laser beam are directed at a first metal member in contact with a second metal member. At the ambient temperature the first member has high absorption of energy from the first laser beam but low absorption
5271822 Methods and apparatus for electroplating electrical contacts December 21, 1993
A method for selectively electroplating a metallic coating, such as solder, onto a plurality of small and closely spaced electrical contacts. The method includes sealingly enclosing the contacts in an electroplating cell having an anode, a cathode and a chamber, forming an electrical con
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