| Patent Number |
Title Of Patent |
Date Issued |
| 7397262 |
Burn-in system power stage |
July 8, 2008 |
| A burn-in system includes a testing stage configured to stress test one an integrated circuit and a power stage having a voltage control mode and a current control mode. The power stage is configured to supply power to the testing stage. One embodiment of the power stage includes a pulse |
| 7296430 |
Cooling air flow control valve for burn-in system |
November 20, 2007 |
| A burn-in oven is provided with a plurality of spaced, stacked burn-in-boards, each with a plurality of individual circuits being tested under heated conditions, and a plurality of valve trays positioned between two burn-in-boards to form a heat exchange compartment below the valve t |
| 7288951 |
Burn-in system having multiple power modes |
October 30, 2007 |
| A burn-in system includes single and dual power modes, a testing stage, first and second power stages, a single mode power control circuit and a dual mode power control circuit. When the burn-in system is in the single power mode, the first power stage produces a first power output to th |
| 7114556 |
Burn-in oven heat exchanger having improved thermal conduction |
October 3, 2006 |
| A heat exchange system that can accommodate a high power integrated circuit chip for burn-in temperature stressing includes a heat sink having a chip engaging surface that is adapted to engage a surface of the chip. A liquid layer fills a heat exchange gap between the surface of the |
| 6891132 |
Shutters for burn-in-board connector openings |
May 10, 2005 |
| A burn-in oven is provided with a wall that has a number of vertically stacked, laterally extending slots aligned with each of the burn-in-board supports in the oven. When a burn-in-board is placed in the oven on the supports, an edge portion of the burn-in-board extends through a slot i |
| 6741089 |
Hinged heat sink burn-in socket |
May 25, 2004 |
| A holder for holding an integrated circuit device to be tested in contact with a contact set on a circuit board has a support base that supports a contact set circuit board, and a hinged cover that will move between an open and a closed position. The hinged cover is pivotally mounted on |
| 6514097 |
Test and burn-in socket clamping mechanism |
February 4, 2003 |
| A test and burn-in socket assembly designed to hold an integrated circuit module during testing or burn-in has a base that mounts a printed circuit connection board. The base has a central opening in which the integrated circuit module can be inserted. A pair of locking arms that will en |
| 6288371 |
Temperature controlled high power burn-in board heat sinks |
September 11, 2001 |
| A heat sink is used for thermally controlling a chip on a burn-in board which is being tested in a burn-in oven. The heat sink includes a resiliently mounted block that will engage a chip under resilient pressure and which is housed in a separate cup that permits accommodating misali |
| 6175498 |
Burn-in board and heat sink assembly mounting rack |
January 16, 2001 |
| A rack for supporting a plurality of burn-in boards and thermal boards which carry heat sinks to be associated with circuit chips mounted on the burn-in boards, has a first side frames that support the burn-in boards in a fixed position. Movable frames adjacent each of the side frame hav |
| 6100706 |
Burn-in board support frame having inserter and ejector bars for racks of burn-in boards |
August 8, 2000 |
| An automatic loading and unloading support for use on the interior of a burn-in oven includes a frame that supports a rack of printed circuit burn-in boards connected to connectors along edges of the burn-in boards at one end of the rack. The frame has a track for supporting the rack for |
| 5923098 |
Driver board having stored calibration data |
July 13, 1999 |
| A batch test or burn-in board system has a driver/receiver board having a plurality of driver/receiver circuits that are used for burning in individual circuits on a second board in a desired environment. The driver/receiver board sends timed pulses to each of the circuits on the sec |
| 5911897 |
Temperature control for high power burn-in for integrated circuits |
June 15, 1999 |
| A temperature control system for high power burn-in of integrated circuit chips which includes an individual heat sink at each of the integrated circuit chips to dissipate heat generated by the integrated circuit. A heater for each chip is provided and is temperature controlled so that |
| 5582235 |
Temperature regulator for burn-in board components |
December 10, 1996 |
| The present invention is directed to an apparatus suitable for regulating, with an impinging flow of gas, the temperature of an electronic component under thermal stress testing at selected temperatures. The apparatus comprises a sensor which senses the temperature of the electronic |
| 5579826 |
Method for burn-in of high power semiconductor devices |
December 3, 1996 |
| A thermal control system for use with a burn-in system, the thermal control system capable of delivering a thermally preconditioned liquid to a plurality of semiconductor devices during burn-in. The thermal control system comprises a liquid reservoir containing a liquid, a pump, and a |
| 5402078 |
Interconnection system for burn-in boards |
March 28, 1995 |
| An interconnection system for electrically connecting a burn-in board with one or more driver/receiver boards in a burn-in system. The interconnection system comprises a burn-in board located in an environmental test chamber, a first driver/receiver board having a first edge connecto |
| 5327076 |
Glitchless test signal generator |
July 5, 1994 |
| A test signal generating system for providing test signals to electronic circuit components under test in a burn-in system, the test signal generating system having a timing arrangement for eliminating glitches from the test signals, The test signal generating system comprises a data |
| 5317254 |
Bipolar power supply |
May 31, 1994 |
| A bipolar power supply capable of selectably supplying either a positive or a negative voltage at an output terminal. The power supply comprises a first operational amplifier, a second operational amplifier, a first transistor electrically connected to a positive voltage source and a |
| 5239748 |
Method of making high density connector for burn-in boards |
August 31, 1993 |
| A method for the construction of a high density electrical connector for connecting a printed circuit board with a burn-in board in a burn-in system. The method comprises the steps of attaching a standard edge connector to a printed circuit board to form a first set of contacts, atta |
| 5200885 |
Double burn-in board assembly |
April 6, 1993 |
| A pair of mother burn-in boards are placed back to back, and are adequately supported with respect to each other to form an assembly. Each of the boards supports a nose board or connector board so that two sets of connectors are available for conductors and sockets on the exposed sides |
| 4997366 |
Rear wall construction for burn-in environmental systems |
March 5, 1991 |
| A rear module wall before a burn-in system that provides burn-in boards for electronic components to permit passing connections through slots while maintaining a good heat seal. The module rear wall is a sandwich type construction of a plurality of layers with insulating silicon rubber |
| 4900948 |
Apparatus providing signals for burn-in of integrated circuits |
February 13, 1990 |
| A burn-in board construction mounts and provides operational signals to circuit packages, for example, digital devices in an environmental stress operation such as in an oven/chamber for dynamic burn-in. Each of the circuit packages has connections to circuits and which connections are |
