| Patent Number |
Title Of Patent |
Date Issued |
| RE37765 |
Process for preparing a nonconductive substrate for electroplating |
June 25, 2002 |
| Described herein is an improved process for electroplating a conductive metal layer to the surface of a nonconductive material comprising pretreating the material with a carbon black dispersion followed by a graphite dispersion before the electroplating step. |
| RE31694 |
Apparatus and method for automatically maintaining an electroless copper plating bath |
October 2, 1984 |
| Apparatus and a method are disclosed for replenishing an electroless plating bath with those of its components which are consumed during plating operation, in order that the concentration of components be maintained as nearly constant as possible in the working bath. The system invol |
| 6342332 |
Liquid photoimagable resist which is resistant to blocking |
January 29, 2002 |
| A liquid applied photoresist composition is disclosed which exhibits a favorable balance of photospeed and overall physical properties. The photoresist composition includes a binder, a multifunctional monomer, a photoinitiator, and a solvent. The photoinitiator is present in the phot |
| 6281090 |
Method for the manufacture of printed circuit boards with plated resistors |
August 28, 2001 |
| A process is revealed whereby resistors can be manufactured integral with the printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are revealed as techniques for impro |
| 6261381 |
Composition and process for cleaning inks from various substrates including printing plates |
July 17, 2001 |
| A composition and process for cleaning inks and organic residues from various substrates utilizing dimethyl piperidone and other safe solvents is revealed. The composition and process are particularly useful in cleaning printing plates and printing apparatus. |
| 6214522 |
Photosensitive resin composition useful in fabricating printing plates |
April 10, 2001 |
| A photosensitive resin, process for its use, and printing plates formed thereby are disclosed wherein the photosensitive resin comprises (i) a polyurethane prepolymer which is the reaction product of at least one polyether diol having olefin unsaturation equal to or less than 0.01 me |
| 6206981 |
Process for enhancing the adhesion of organic coatings to metal surfaces |
March 27, 2001 |
| A process is described for increasing the adhesion of organic coatings to metal surfaces, particularly aluminum and aluminum alloys. The process involves the utilization of an adhesion promoting composition in conjunction with a chromating composition in treating the metal surface pr |
| 6200451 |
Method for enhancing the solderability of a surface |
March 13, 2001 |
| A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, |
| 6197459 |
Photosensitive resin composition useful in fabricating printing plates |
March 6, 2001 |
| A photosensitive resin, process for its use, and printing plates formed thereby are disclosed wherein the photosensitive resin comprises (i) a polyurethane prepolymer which is the reaction product of at least one polyether diol having olefin unsaturation equal to or less than 0.01 me |
| 6168836 |
Process for plating upon a polymeric surface |
January 2, 2001 |
| A process is disclosed for plating upon a polymeric surface with improved adhesion and coverage. The process comprises plating a metallic deposit upon a polymeric surface which has not been completely polymerized and then further curing the plated upon surface. |
| 6162503 |
Process for improving the adhesion of polymeric materials to metal surfaces |
December 19, 2000 |
| A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, a benzotriazole with an electron withdrawing group in the 1-position which electron withdrawing group is a stronger electron withdrawer than a hydrogen group, |
| 6146701 |
Process for improving the adhension of polymeric materials to metal surfaces |
November 14, 2000 |
| A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, a source of halide ions, a source of adhesion enhancing ions selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates and |
| 6132095 |
Low friction sliding bearing for an axial shaft |
October 17, 2000 |
| An apparatus for reliably and efficiently propelling a printing substrate across a printing platen by use of the known roller/nip roller configuration wherein an improved, unitary slider bearing preferably formed of low friction material is coupled to an axial shaft at two points of |
| 6120639 |
Method for the manufacture of printed circuit boards |
September 19, 2000 |
| A process for improving the adhesion of a copper surface to a resinous layer, the process comprising contacting the copper layer with an adhesion promoting composition comprising a reducing agent and a metal selected from the group consisting of gold, silver, palladium, ruthenium, rhodiu |
| 6044550 |
Process for the manufacture of printed circuit boards |
April 4, 2000 |
| The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary |
| 6023842 |
Process for the manufacture of printed circuit boards |
February 15, 2000 |
| The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary |
| 6020029 |
Process for treating metal surfaces |
February 1, 2000 |
| A process for treating metal surfaces that includes first contacting the metal surface with a particular acidic peroxide adhesion promoting composition, followed by contacting that metal surface with an alkaline solution. This treatment is particularly suitable for treating metal sur |
| 6010822 |
Process for preparing a nitrocellulose coated polypropylene film |
January 4, 2000 |
| Polypropylene film coated with a submicron thickness of a composition comprising mitrocellulose is proposed as useful in the production of photopolymer printing plates. In addition to nitrocellulose, the coating composition also preferably comprises a solvent, lecithin and a wax. |
| 5981147 |
Stable, ionomeric photoresist emulsion and process of preparation and use thereof |
November 9, 1999 |
| Disclosed are waterborne, stable photoresist compositions and methods of their preparation and use. The compositions are characterized by increased shear and storage stability. The photoresist composition comprises an aqueous emulsion of a 22% or less neutralized carboxylated resin and |
| 5965460 |
Polyurethane composition with (meth)acrylate end groups useful in the manufacture of polishing p |
October 12, 1999 |
| Particular polyurethane photopolymers are disclosed as materials of construction in producing improved polishing pads. The polyurethane photopolymers are formed from a polyurethane prepolymer prepared from the reaction products of a first reactant selected from the group consisting o |
| 5962111 |
Compressible printing plates and manufacturing process therefor |
October 5, 1999 |
| A compressible printing plate is prepared by casting liquid photopolymerizable resin directly onto a compressible material having open cells on its surface. The photopolymerizable resin is incompletely cured by exposure to actinic radiation, preferably in the absence of a coverfilm c |
| 5935640 |
Method for enhancing the solderability of a surface |
August 10, 1999 |
| A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed. |
| 5925719 |
Photoresist developable in aqueous base made from acid-functional .beta.-hydroxy thiol resin |
July 20, 1999 |
| A substantially ester-free, acid-functional thiol-functional resin is prepared via the reaction of an epoxy compound with a thiolacetic acid in the presence of an amine catalyst and heat to form a thioacetate derivative which is hydrolyzed to yield an ester-free, .beta.-hydroxy thiol |
| 5922414 |
Process for plating |
July 13, 1999 |
| A composition comprising at least two resins with widely different molecular weights is disclosed. The composition is particularly suitable as a permanent dielectric which provides an optimum surface for plating upon. The composition is particularly useful in the fabrication of printed |
| 5869130 |
Process for improving the adhesion of polymeric materials to metal surfaces |
February 9, 1999 |
| A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, a source of holide ions and optionally a water soluble polymer in order to increase the adhesion of polymeric materials to the metal surface. |
| 5861234 |
Photopolymer useful in fabricating printing plates which are resistant to polar solvent based in |
January 19, 1999 |
| The addition of vinyl ethers to photosensitive resins is suggested to improve the resistance of the cured resin to polar solvents. Long chain vinyl ethers such as octadecyl vinyl ether or dodecyl vinyl ether are preferred. The resulting photosensitive resin compositions are particula |
| 5843517 |
Composition and method for selective plating |
December 1, 1998 |
| This invention proposes the use of an activator solution comprising precious metal ions and an oxidizing agent for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without subs |
| 5814163 |
Composition and process for cleaning inks form various surfaces including printing plates |
September 29, 1998 |
| The present invention concerns a mixture of at least one monoester, at least one methyl ester, at least one olefinic hydrocarbon, along with other optional ingredients, which mixture is useful in cleaning organic residues, particularly inks, from various surfaces. |
| 5792278 |
Process for cleaning inks from various surfaces including printing plates |
August 11, 1998 |
| A method for cleaning organic residues, particularly inks, from various surfaces. The method involves contacting the surfaces to be cleaned with a composition including n-methyl-2-pyrrolidone, at least one ester alcohol, at least one unsaturated aliphatic hydrocarbon, isoparaffin and dib |
| 5763140 |
Photodefinable dielectric composition useful in the manufacture of printed circuits |
June 9, 1998 |
| A composition and process useful in fabricating circuitry packages with permanent resists is proposed. The proposed composition comprises a carboxy functional resin, an acrylate oligomer, an epoxy functional resin, a butadiene nitrile resin, and a photoinitiator. |
| 5759378 |
Process for preparing a non-conductive substrate for electroplating |
June 2, 1998 |
| The modification of carbon particles is proposed to achieve enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards. |
| 5758412 |
Method of making a printed circuit board |
June 2, 1998 |
| A method of making a plate through hole printed circuit board, comprises the steps of: a) forming conductive circuit elements on two opposed faces of a non-conductive substrate; b) coating the substrate and circuit elements with a de-sensitising material; c) forming holes through the |
| 5747098 |
Process for the manufacture of printed circuit boards |
May 5, 1998 |
| The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary |
| 5733599 |
Method for enhancing the solderability of a surface |
March 31, 1998 |
| A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed. |
| 5693364 |
Method for the manufacture of printed circuit boards |
December 2, 1997 |
| The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary |
| 5674372 |
Process for preparing a non-conductive substrate for electroplating |
October 7, 1997 |
| A process is disclosed for the direct electroplating of a non-conductive material comprising non-conductive surfaces and metallic surfaces. The process involves contacting the non-conductive material with a compound capable of selectively forming a sacrificial layer on the metallic s |
| 5654126 |
Photodefinable dielectric composition useful in the manufacture of printed circuits |
August 5, 1997 |
| A composition and process useful in fabricating circuitry packages with permanent resists is proposed. The proposed composition comprises a carboxy functional resin, an acrylate oligomer, an epoxy functional resin, a butadiene nitrile resin, and a photoinitiator. |
| 5648200 |
Process for creating circuitry on the surface of a photoimageable dielectric |
July 15, 1997 |
| A process is proposed for creating circuitry on the surface of a photoimageable dielectric. Specifically the process uses electroless means with controlled pH and an organosilane conditioning agent to fabricate circuitry and interconnects directly upon the surface of a photoimageable |
| 5641608 |
Direct imaging process for forming resist pattern on a surface and use thereof in fabricating pr |
June 24, 1997 |
| A process is described for the direct production of an imaged pattern of resist on a substrate surface (such as a pattern of etch-resistant organic resin material on the surface of a copper-clad dielectric in connection with a printed circuit board (PCB) fabrication process or in the pro |
| 5632927 |
Process for preparing a non-conductive substrate for electroplating |
May 27, 1997 |
| The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards. |
| 5620612 |
Method for the manufacture of printed circuit boards |
April 15, 1997 |
| The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary |
| 5550006 |
Phosphating compositions and processes, particularly for use in fabrication of printed circuits |
August 27, 1996 |
| Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate |
| 5547559 |
Process for plating metals onto various substrates in an adherent fashion |
August 20, 1996 |
| The invention described provides a process for direct electroplating on activated surfaces substantially without the formation of a smut layer and thereby improving the adhesion of the plated deposit to the surface. The use of divalent or tetravalent sulfur compounds and/or cathodic |
| 5536386 |
Process for preparing a non-conductive substrate for electroplating |
July 16, 1996 |
| The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards. |
| 5525207 |
Polyalkylene glycol bis-phenyl-a-sulfopropyl diether compound and their salts, and process for t |
June 11, 1996 |
| The present invention relates to a novel composition of matter, and a process for its use as an electroplating additive for enhancing the performance of a plating bath. Polyalkylene glycol bis-phenyl-A-Sulfopropyl diether compounds and their salts are proposed and their usefulness as |
| 5518760 |
Composition and method for selective plating |
May 21, 1996 |
| This invention proposes the addition of imidazole and imidazole derivatives to various activator solutions for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial |
| 5510014 |
Method for regenerating tin or tin alloy electroplating |
April 23, 1996 |
| An aged tin or tin alloy plating bath is regenerated by adding a water-soluble polymer as a coagulant and a polymeric flocculant to remove sludge. |
| 5474798 |
Method for the manufacture of printed circuit boards |
December 12, 1995 |
| The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates the use of electroless nickel as the primary medium for interconnection, for building circuitry to the desired thickness and as an etch resist. The method is particularly |
| 5468515 |
Composition and method for selective plating |
November 21, 1995 |
| This invention proposes the addition of imidazole and imidazole derivatives to various activator solutions for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial |
| 5431959 |
Process for the activation of nickel - phosphorous surfaces |
July 11, 1995 |
| Disclosed is a composition and process useful in activating nickel-phosphorous surfaces for subsequent plating thereon. A combination of sulfuric acid and ammonium sulfate is utilized to render otherwise non-catalytic nickel-phosphorous surfaces catalytic to subsequent plating. |
